KR20070097055A - 도전성 잉크 - Google Patents

도전성 잉크 Download PDF

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Publication number
KR20070097055A
KR20070097055A KR20077015677A KR20077015677A KR20070097055A KR 20070097055 A KR20070097055 A KR 20070097055A KR 20077015677 A KR20077015677 A KR 20077015677A KR 20077015677 A KR20077015677 A KR 20077015677A KR 20070097055 A KR20070097055 A KR 20070097055A
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KR
South Korea
Prior art keywords
conductive ink
nickel
powder
metal
preferable
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20077015677A
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English (en)
Korean (ko)
Inventor
요이치 카미코리야마
스미카즈 오가타
케이 아나이
히로키 사와모토
미키마사 호리우치
타카시 무쿠노
카츠히코 요시마루
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20070097055A publication Critical patent/KR20070097055A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
KR20077015677A 2004-12-27 2005-12-26 도전성 잉크 Withdrawn KR20070097055A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JPJP-P-2004-00375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク
JPJP-P-2005-00048662 2005-02-24

Publications (1)

Publication Number Publication Date
KR20070097055A true KR20070097055A (ko) 2007-10-02

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20077015677A Withdrawn KR20070097055A (ko) 2004-12-27 2005-12-26 도전성 잉크

Country Status (6)

Country Link
US (1) US8043535B2 (https=)
EP (1) EP1847575A4 (https=)
JP (1) JP4799881B2 (https=)
KR (1) KR20070097055A (https=)
TW (1) TW200636027A (https=)
WO (1) WO2006070747A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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KR100817856B1 (ko) * 2007-07-13 2008-03-31 주식회사 신우테크 감시카메라용 투명히터판
KR101300215B1 (ko) * 2008-03-05 2013-09-02 이시하라 야쿠힌 가부시끼가이샤 용매­ 및 수­기재 금속계 전도성 잉크용 첨가제 및 변형제
KR20140085551A (ko) * 2011-10-28 2014-07-07 나노그레이드 아게 용액-처리 가능한 산화 텅스텐 완충 층 및 이를 포함하는 유기 전자 기기

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JP2010225287A (ja) * 2009-03-19 2010-10-07 Hitachi Maxell Ltd 透明導電膜形成用インク及び透明導電膜
KR101055625B1 (ko) * 2009-11-06 2011-08-10 에이비씨나노텍 주식회사 배선용 잉크 조성물 및 이를 이용한 구리 배선의 형성방법
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KR20110139942A (ko) * 2010-06-24 2011-12-30 삼성전기주식회사 금속 잉크 조성물 및 이를 이용한 금속 배선 형성 방법, 그리고 상기 금속 잉크 조성물로 형성된 도전성 패턴
KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
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CN102675964B (zh) * 2011-02-02 2014-09-03 日本特殊陶业株式会社 油墨及设备
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JP4416080B2 (ja) * 2003-01-29 2010-02-17 富士フイルム株式会社 プリント配線基板形成用インク、プリント配線基板の形成方法及びプリント配線基板
JP2004277627A (ja) * 2003-03-18 2004-10-07 Asahi Kasei Corp インクジェット用インクおよびこれを用いた金属含有薄膜の形成方法
US7683107B2 (en) * 2004-02-09 2010-03-23 E.I. Du Pont De Nemours And Company Ink jet printable thick film compositions and processes
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
JP5550904B2 (ja) * 2006-08-07 2014-07-16 インクテック カンパニー リミテッド 銀ナノ粒子の製造方法、及び薄膜形成方法

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KR101300215B1 (ko) * 2008-03-05 2013-09-02 이시하라 야쿠힌 가부시끼가이샤 용매­ 및 수­기재 금속계 전도성 잉크용 첨가제 및 변형제
KR20140085551A (ko) * 2011-10-28 2014-07-07 나노그레이드 아게 용액-처리 가능한 산화 텅스텐 완충 층 및 이를 포함하는 유기 전자 기기

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TW200636027A (en) 2006-10-16
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