TW200636027A - Conductive ink - Google Patents

Conductive ink

Info

Publication number
TW200636027A
TW200636027A TW094146506A TW94146506A TW200636027A TW 200636027 A TW200636027 A TW 200636027A TW 094146506 A TW094146506 A TW 094146506A TW 94146506 A TW94146506 A TW 94146506A TW 200636027 A TW200636027 A TW 200636027A
Authority
TW
Taiwan
Prior art keywords
conductive ink
dispersion medium
film density
conductor
metal oxide
Prior art date
Application number
TW094146506A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377237B (https=
Inventor
Yoichi Kamikoriyama
Sumikazu Ogata
Kei Anai
Hiroki Sawamoto
Mikimasa Horiuchi
Mukuno Takashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200636027A publication Critical patent/TW200636027A/zh
Application granted granted Critical
Publication of TWI377237B publication Critical patent/TWI377237B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0239Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
TW094146506A 2004-12-27 2005-12-26 Conductive ink TW200636027A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004375893 2004-12-27
JP2005048662A JP4799881B2 (ja) 2004-12-27 2005-02-24 導電性インク

Publications (2)

Publication Number Publication Date
TW200636027A true TW200636027A (en) 2006-10-16
TWI377237B TWI377237B (https=) 2012-11-21

Family

ID=36614864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146506A TW200636027A (en) 2004-12-27 2005-12-26 Conductive ink

Country Status (6)

Country Link
US (1) US8043535B2 (https=)
EP (1) EP1847575A4 (https=)
JP (1) JP4799881B2 (https=)
KR (1) KR20070097055A (https=)
TW (1) TW200636027A (https=)
WO (1) WO2006070747A1 (https=)

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* Cited by examiner, † Cited by third party
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US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

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KR101276237B1 (ko) * 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
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CN102675964B (zh) * 2011-02-02 2014-09-03 日本特殊陶业株式会社 油墨及设备
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US10494720B2 (en) 2011-02-28 2019-12-03 Nthdegree Technologies Worldwide Inc Metallic nanofiber ink, substantially transparent conductor, and fabrication method
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JP5957187B2 (ja) * 2011-06-23 2016-07-27 株式会社アルバック 金属微粒子の製造方法
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KR20150006091A (ko) * 2012-02-29 2015-01-15 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. 금속 전구체 나노입자들을 함유한 잉크
JP2015110682A (ja) * 2012-03-21 2015-06-18 旭硝子株式会社 導電インク、導体付き基材、および導体付き基材の製造方法
CN103377751B (zh) 2012-04-17 2018-01-02 赫劳斯贵金属北美康舍霍肯有限责任公司 用于太阳能电池触点的导电厚膜膏
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CN104870578B (zh) * 2012-12-28 2021-01-12 印制能源技术有限公司 导电墨水及其制造方法
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
JP6032110B2 (ja) * 2013-04-17 2016-11-24 株式会社豊田中央研究所 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
US8475867B2 (en) 2008-11-27 2013-07-02 Fukui Precision Component (Shenzhen) Co., Ltd. Method for forming electrical traces on substrate
TWI603342B (zh) * 2013-03-29 2017-10-21 富士軟片股份有限公司 導電膜形成用組成物及使用其的導電膜的製造方法
TWI678711B (zh) * 2018-11-01 2019-12-01 磐采股份有限公司 導電漿料組合物及應用該導電漿料組合物之太陽能電池

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US20080134936A1 (en) 2008-06-12
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EP1847575A4 (en) 2008-05-07
EP1847575A1 (en) 2007-10-24
US8043535B2 (en) 2011-10-25
JP2006210301A (ja) 2006-08-10
JP4799881B2 (ja) 2011-10-26

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