KR19990028523A - 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 - Google Patents

반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 Download PDF

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Publication number
KR19990028523A
KR19990028523A KR1019970709841A KR19970709841A KR19990028523A KR 19990028523 A KR19990028523 A KR 19990028523A KR 1019970709841 A KR1019970709841 A KR 1019970709841A KR 19970709841 A KR19970709841 A KR 19970709841A KR 19990028523 A KR19990028523 A KR 19990028523A
Authority
KR
South Korea
Prior art keywords
adhesive tape
peeling
protective adhesive
tape
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019970709841A
Other languages
English (en)
Korean (ko)
Inventor
시게지 쿠로다
타카오 마쯔시타
사부로오 미야모토
Original Assignee
야마모토 히데키
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마모토 히데키, 닛토덴코 가부시키가이샤 filed Critical 야마모토 히데키
Publication of KR19990028523A publication Critical patent/KR19990028523A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7446—Separation by peeling using a peeling wheel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019970709841A 1995-08-31 1996-08-28 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치 Abandoned KR19990028523A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-248511 1995-08-31
JP24851195 1995-08-31

Publications (1)

Publication Number Publication Date
KR19990028523A true KR19990028523A (ko) 1999-04-15

Family

ID=17179277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970709841A Abandoned KR19990028523A (ko) 1995-08-31 1996-08-28 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치

Country Status (5)

Country Link
US (1) US5891298A (enExample)
EP (1) EP0848415A1 (enExample)
JP (1) JP3737118B2 (enExample)
KR (1) KR19990028523A (enExample)
WO (1) WO1997008745A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100814536B1 (ko) * 2000-04-26 2008-03-17 린텍 코포레이션 실리콘 웨이퍼용의 보강재 및 상기 보강재를 이용한 ｉｃ 칩의 제조 방법
KR100987917B1 (ko) * 2006-09-29 2010-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제조 방법
KR20110011564A (ko) * 2009-07-27 2011-02-08 닛토덴코 가부시키가이샤 점착 테이프 부착 방법 및 점착 테이프 부착 장치
US8058083B2 (en) 2008-11-20 2011-11-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing flexible semiconductor device
US8137417B2 (en) 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
KR101359154B1 (ko) * 2007-05-25 2014-02-05 닛토덴코 가부시키가이샤 반도체 웨이퍼의 보유 지지 방법
KR101498289B1 (ko) * 2007-09-10 2015-03-03 닛토덴코 가부시키가이샤 보호 테이프 박리 방법 및 보호 테이프 박리 장치

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JP4322328B2 (ja) * 1997-06-05 2009-08-26 テキサス インスツルメンツ インコーポレイテツド ウエハをウエハテープに接着する方法および装置
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
US6273791B1 (en) * 1997-11-18 2001-08-14 Mitsui Chemicals, Inc. Method of producing semiconductor wafer
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
JP2000331963A (ja) * 1999-05-21 2000-11-30 Tokyo Seimitsu Co Ltd ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
US6162702A (en) * 1999-06-17 2000-12-19 Intersil Corporation Self-supported ultra thin silicon wafer process
US6113075A (en) * 1999-07-06 2000-09-05 Mcmichael; Thomas James Scissors type apparatus for removing floor coverings
US6688948B2 (en) * 1999-07-07 2004-02-10 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer surface protection method
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
US7413626B2 (en) * 2001-01-12 2008-08-19 3M Innovative Properties Company Adhesive film removal method and apparatus
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
US20030037877A1 (en) * 2000-10-18 2003-02-27 Fritz Brinkmann Delabelling method and device for carrying out said method
KR100356339B1 (ko) * 2000-11-20 2002-10-19 내일시스템주식회사 웨이퍼 프레임에 부착된 테이프를 자동으로 제거하는 방법
KR100389513B1 (ko) * 2000-12-07 2003-06-27 삼성전자주식회사 웨이퍼 링 테이프 제거 장치
JP4739584B2 (ja) * 2001-07-05 2011-08-03 リンテック株式会社 剥離装置
JP4266106B2 (ja) * 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP3770820B2 (ja) * 2001-10-03 2006-04-26 日東電工株式会社 保護テープの貼付け方法
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JP2003124146A (ja) * 2001-10-11 2003-04-25 Lintec Corp 保護シート剥離方法及び装置
JP2003152058A (ja) * 2001-11-13 2003-05-23 Lintec Corp ウェハ転写装置
JP3880397B2 (ja) * 2001-12-27 2007-02-14 日東電工株式会社 保護テープの貼付・剥離方法
JP2004119718A (ja) * 2002-09-26 2004-04-15 Shinko Electric Ind Co Ltd 薄型半導体チップの製造方法
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KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101969092B1 (ko) * 2013-04-10 2019-04-16 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
CN109273622B (zh) 2013-08-06 2021-03-12 株式会社半导体能源研究所 剥离方法
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TWI794098B (zh) 2013-09-06 2023-02-21 日商半導體能源研究所股份有限公司 發光裝置以及發光裝置的製造方法
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TWI695525B (zh) 2014-07-25 2020-06-01 日商半導體能源研究所股份有限公司 剝離方法、發光裝置、模組以及電子裝置
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CN113013080A (zh) * 2021-02-24 2021-06-22 中芯集成电路制造(绍兴)有限公司 揭膜方法
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