TWI563756B - Method to fabricate gan-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer - Google Patents
Method to fabricate gan-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layerInfo
- Publication number
- TWI563756B TWI563756B TW103145138A TW103145138A TWI563756B TW I563756 B TWI563756 B TW I563756B TW 103145138 A TW103145138 A TW 103145138A TW 103145138 A TW103145138 A TW 103145138A TW I563756 B TWI563756 B TW I563756B
- Authority
- TW
- Taiwan
- Prior art keywords
- blocking layer
- emitting devices
- cavity surface
- current blocking
- defined current
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103145138A TWI563756B (en) | 2014-12-24 | 2014-12-24 | Method to fabricate gan-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103145138A TWI563756B (en) | 2014-12-24 | 2014-12-24 | Method to fabricate gan-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201624860A TW201624860A (en) | 2016-07-01 |
TWI563756B true TWI563756B (en) | 2016-12-21 |
Family
ID=56984878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103145138A TWI563756B (en) | 2014-12-24 | 2014-12-24 | Method to fabricate gan-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI563756B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5891298A (en) * | 1995-08-31 | 1999-04-06 | Nitto Denko Corporation | Method and apparatus for peeling protective adhesive tape from semiconductor wafer |
TW200536107A (en) * | 2004-04-08 | 2005-11-01 | Renesas Tech Corp | Semiconductor memory device |
JP2008205054A (en) * | 2007-02-17 | 2008-09-04 | Seiko Instruments Inc | Semiconductor device |
-
2014
- 2014-12-24 TW TW103145138A patent/TWI563756B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5891298A (en) * | 1995-08-31 | 1999-04-06 | Nitto Denko Corporation | Method and apparatus for peeling protective adhesive tape from semiconductor wafer |
TW200536107A (en) * | 2004-04-08 | 2005-11-01 | Renesas Tech Corp | Semiconductor memory device |
JP2008205054A (en) * | 2007-02-17 | 2008-09-04 | Seiko Instruments Inc | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
TW201624860A (en) | 2016-07-01 |
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