KR102760909B1 - 발광 장치 - Google Patents

발광 장치 Download PDF

Info

Publication number
KR102760909B1
KR102760909B1 KR1020247033964A KR20247033964A KR102760909B1 KR 102760909 B1 KR102760909 B1 KR 102760909B1 KR 1020247033964 A KR1020247033964 A KR 1020247033964A KR 20247033964 A KR20247033964 A KR 20247033964A KR 102760909 B1 KR102760909 B1 KR 102760909B1
Authority
KR
South Korea
Prior art keywords
light
layer
substrate
emitting device
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247033964A
Other languages
English (en)
Korean (ko)
Other versions
KR20240152966A (ko
Inventor
슌페이 야마자키
šœ페이 야마자키
요시하루 히라카타
토모야 아오야마
아키히로 치다
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20240152966A publication Critical patent/KR20240152966A/ko
Application granted granted Critical
Publication of KR102760909B1 publication Critical patent/KR102760909B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827Portable transceivers
    • H04B1/3888Arrangements for carrying or protecting transceivers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40OLEDs integrated with touch screens
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80521Cathodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0404Matrix technologies
    • G09G2300/0408Integration of the drivers onto the display substrate
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00Specific applications
    • G09G2380/02Flexible displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/198Contact-type image sensors [CIS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/86Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/126Shielding, e.g. light-blocking means over the TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Geometry (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Surgical Instruments (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
KR1020247033964A 2013-04-15 2014-03-27 발광 장치 Active KR102760909B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2013-084528 2013-04-15
JP2013084528 2013-04-15
JP2013218603 2013-10-21
JPJP-P-2013-218603 2013-10-21
KR1020247014112A KR20240067959A (ko) 2013-04-15 2014-03-27 발광 장치
PCT/JP2014/059790 WO2014171336A1 (en) 2013-04-15 2014-03-27 Light-emitting device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020247014112A Division KR20240067959A (ko) 2013-04-15 2014-03-27 발광 장치

Publications (2)

Publication Number Publication Date
KR20240152966A KR20240152966A (ko) 2024-10-22
KR102760909B1 true KR102760909B1 (ko) 2025-01-24

Family

ID=51686198

Family Applications (11)

Application Number Title Priority Date Filing Date
KR1020247033964A Active KR102760909B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020247014112A Ceased KR20240067959A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020187034709A Withdrawn KR20180130021A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020207032997A Active KR102250061B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020227044117A Active KR102662635B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020157032237A Ceased KR20150143638A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217041495A Active KR102415221B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020227021447A Active KR102479472B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020187035581A Ceased KR20180133562A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217022746A Active KR102345837B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217013227A Active KR102281568B1 (ko) 2013-04-15 2014-03-27 발광 장치

Family Applications After (10)

Application Number Title Priority Date Filing Date
KR1020247014112A Ceased KR20240067959A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020187034709A Withdrawn KR20180130021A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020207032997A Active KR102250061B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020227044117A Active KR102662635B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020157032237A Ceased KR20150143638A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217041495A Active KR102415221B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020227021447A Active KR102479472B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020187035581A Ceased KR20180133562A (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217022746A Active KR102345837B1 (ko) 2013-04-15 2014-03-27 발광 장치
KR1020217013227A Active KR102281568B1 (ko) 2013-04-15 2014-03-27 발광 장치

Country Status (6)

Country Link
US (7) US9406898B2 (cg-RX-API-DMAC7.html)
JP (12) JP2015109252A (cg-RX-API-DMAC7.html)
KR (11) KR102760909B1 (cg-RX-API-DMAC7.html)
CN (2) CN107768408A (cg-RX-API-DMAC7.html)
TW (6) TWI703042B (cg-RX-API-DMAC7.html)
WO (1) WO2014171336A1 (cg-RX-API-DMAC7.html)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251255A (ja) * 2012-05-04 2013-12-12 Semiconductor Energy Lab Co Ltd 発光装置の作製方法
USD738367S1 (en) * 2012-07-27 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Portable information terminal
JP6490901B2 (ja) * 2013-03-14 2019-03-27 株式会社半導体エネルギー研究所 発光装置の作製方法
KR102187752B1 (ko) 2013-05-07 2020-12-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법 및 박리 장치
KR20150021000A (ko) 2013-08-19 2015-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US9590111B2 (en) 2013-11-06 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
WO2015071800A1 (en) 2013-11-15 2015-05-21 Semiconductor Energy Laboratory Co., Ltd. Data processor
KR102239367B1 (ko) 2013-11-27 2021-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 터치 패널
TWI676119B (zh) 2013-11-28 2019-11-01 日商半導體能源研究所股份有限公司 電子裝置以及其驅動方法
KR102320937B1 (ko) 2013-11-29 2021-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 데이터 처리 장치 및 이의 구동 방법
KR20240129091A (ko) 2013-12-02 2024-08-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 터치 패널 및 터치 패널의 제작 방법
US20150154730A1 (en) 2013-12-02 2015-06-04 Semiconductor Energy Laboratory Co., Ltd. Data processing device
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20150075367A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
WO2015128778A1 (en) 2014-02-28 2015-09-03 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JPWO2015136411A1 (ja) 2014-03-12 2017-04-06 株式会社半導体エネルギー研究所 電子機器
KR102384830B1 (ko) 2014-03-12 2022-04-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 정보 처리 장치
CN106465494B (zh) 2014-04-11 2019-01-22 株式会社半导体能源研究所 发光装置
US10073571B2 (en) 2014-05-02 2018-09-11 Semiconductor Energy Laboratory Co., Ltd. Touch sensor and touch panel including capacitor
CN106463079B (zh) 2014-05-06 2019-05-14 株式会社半导体能源研究所 电子设备
TWI726843B (zh) 2014-05-30 2021-05-11 日商半導體能源研究所股份有限公司 觸控面板
KR102500994B1 (ko) 2014-10-17 2023-02-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 터치 패널
WO2016059514A1 (en) 2014-10-17 2016-04-21 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP2016085457A (ja) 2014-10-24 2016-05-19 株式会社半導体エネルギー研究所 電子機器
US9933872B2 (en) 2014-12-01 2018-04-03 Semiconductor Energy Laboratory Co., Ltd. Touch panel
CN104461142B (zh) * 2014-12-10 2017-06-30 京东方科技集团股份有限公司 触控显示基板及其制备方法、触控显示装置
CN104659066B (zh) * 2015-02-05 2018-02-13 京东方科技集团股份有限公司 一种显示面板及其制作方法和显示装置
DE102015101683A1 (de) * 2015-02-05 2016-08-11 Osram Oled Gmbh Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung
DE102016206922A1 (de) 2015-05-08 2016-11-10 Semiconductor Energy Laboratory Co., Ltd. Touchscreen
KR101719208B1 (ko) * 2015-06-17 2017-03-23 주식회사 하이딥 디스플레이 모듈을 포함하는 압력 검출 가능한 터치 입력 장치
JP6446349B2 (ja) * 2015-10-06 2018-12-26 株式会社ジャパンディスプレイ 表示装置及び表示システム
KR101774649B1 (ko) 2015-10-14 2017-09-04 현대자동차주식회사 나노복합체형 열전소재 및 이의 제조방법
CN106681546B (zh) * 2015-11-06 2023-07-25 宸鸿科技(厦门)有限公司 触控装置及其制造方法
JP6396879B2 (ja) * 2015-11-20 2018-09-26 株式会社ジャパンディスプレイ 表示装置
US10558265B2 (en) 2015-12-11 2020-02-11 Semiconductor Energy Laboratory Co., Ltd. Input device and system of input device
KR102457246B1 (ko) 2016-01-12 2022-10-21 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102457248B1 (ko) * 2016-01-12 2022-10-21 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
TWI792916B (zh) 2016-06-24 2023-02-11 日商半導體能源研究所股份有限公司 顯示裝置、電子裝置
KR102359245B1 (ko) * 2016-07-08 2022-02-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전자 기기
US10488887B2 (en) 2016-10-04 2019-11-26 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP6341345B1 (ja) * 2017-03-07 2018-06-13 富士ゼロックス株式会社 発光装置、画像形成装置及び光照射装置
JP6792506B2 (ja) * 2017-04-18 2020-11-25 株式会社ジャパンディスプレイ 表示装置
CN107291311A (zh) * 2017-06-27 2017-10-24 长沙市宇顺显示技术有限公司 一种电容式触控显示屏fpc防折伤的制作方法
KR102421518B1 (ko) * 2017-06-27 2022-07-15 엘지전자 주식회사 전자장치 및 이의 제어방법
KR102336569B1 (ko) * 2017-07-31 2021-12-06 엘지디스플레이 주식회사 디스플레이 장치와 이를 포함하는 멀티 스크린 디스플레이 장치
JP2019096577A (ja) * 2017-11-28 2019-06-20 株式会社ジャパンディスプレイ 表示装置
KR102490978B1 (ko) * 2017-12-11 2023-01-19 엘지디스플레이 주식회사 전계 발광 표시장치
KR102491881B1 (ko) * 2018-01-16 2023-01-27 삼성디스플레이 주식회사 디스플레이 장치
JP7266897B2 (ja) * 2018-03-28 2023-05-01 株式会社ホタルクス 有機el装置および有機el照明装置
JP7054361B2 (ja) * 2018-04-10 2022-04-13 キヤノン株式会社 表示装置、及び、その製造方法
JP7127802B2 (ja) * 2018-04-18 2022-08-30 三国電子有限会社 タッチ検出機能付き表示装置及びその製造方法
KR102458284B1 (ko) * 2018-05-02 2022-10-25 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
CN112106203A (zh) * 2018-05-08 2020-12-18 华为技术有限公司 一种柔性显示面板及移动终端
CN108881533B (zh) * 2018-06-06 2020-09-11 北京小米移动软件有限公司 终端设备
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte
KR102594035B1 (ko) * 2018-08-06 2023-10-25 삼성디스플레이 주식회사 표시 장치
CN112639937B (zh) * 2018-09-05 2023-06-23 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法
KR102568726B1 (ko) * 2018-09-18 2023-08-22 삼성디스플레이 주식회사 표시장치
CN110277428B (zh) * 2019-03-29 2022-05-20 云谷(固安)科技有限公司 一种柔性有机发光显示面板及显示装置
CN110112315B (zh) 2019-05-22 2021-03-23 京东方科技集团股份有限公司 一种柔性背板、柔性背板的制备方法以及显示面板
KR102770067B1 (ko) * 2019-06-05 2025-02-21 삼성디스플레이 주식회사 보호 윈도우를 포함하는 표시 장치
JP7053532B2 (ja) * 2019-06-07 2022-04-12 株式会社ニフコ ディスプレイ装置及びその製造方法並びにディスプレイ装置を備えるインストルメントパネル
US11710760B2 (en) 2019-06-21 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Display device, display module, electronic device, and manufacturing method of display device
CN110266858B (zh) * 2019-06-30 2021-04-13 Oppo广东移动通信有限公司 电子装置
JP7395359B2 (ja) 2019-08-01 2023-12-11 京東方科技集團股▲ふん▼有限公司 表示基板及び表示装置
KR102840643B1 (ko) * 2019-08-12 2025-07-30 엘지디스플레이 주식회사 전계 발광 표시 장치
JP2021048393A (ja) * 2019-09-13 2021-03-25 株式会社日本触媒 発光素子
KR102889168B1 (ko) * 2019-09-17 2025-11-21 삼성디스플레이 주식회사 표시 장치
KR102688752B1 (ko) * 2019-11-05 2024-07-26 삼성디스플레이 주식회사 커버 윈도우, 이의 제조 방법, 및 이를 포함하는 표시장치
CN114641816A (zh) 2019-11-21 2022-06-17 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法
JP6816246B2 (ja) * 2019-12-18 2021-01-20 株式会社ジャパンディスプレイ 有機el表示装置
KR20210079898A (ko) * 2019-12-20 2021-06-30 엘지디스플레이 주식회사 표시장치
CN111128026A (zh) * 2019-12-30 2020-05-08 业成科技(成都)有限公司 耐弯折结构及显示面板
CN111180501B (zh) * 2020-02-26 2022-06-03 武汉天马微电子有限公司 显示面板及显示装置
KR20230018393A (ko) * 2020-05-29 2023-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광학 기능 디바이스, 기능 패널, 표시 장치, 입출력 장치, 정보 처리 장치
FR3112902B1 (fr) * 2020-07-22 2022-12-16 Aledia Dispositif optoélectronique flexible et son procédé de fabrication
US20220119666A1 (en) * 2020-10-20 2022-04-21 Eastman Kodak Company Aqueous compositions and inkjet receiving media
CN114488606A (zh) * 2020-10-23 2022-05-13 合肥京东方显示技术有限公司 显示装置
USD1052565S1 (en) * 2020-11-12 2024-11-26 Samsung Display Co., Ltd. Cover window
CN115696999A (zh) * 2020-12-22 2023-02-03 湖北长江新型显示产业创新中心有限公司 显示面板及其制作方法、显示装置
KR102475579B1 (ko) * 2020-12-29 2022-12-07 엘지디스플레이 주식회사 표시장치
DE112022002460T5 (de) 2021-05-07 2024-03-21 Semiconductor Energy Laboratory Co., Ltd. Anzeigevorrichtung
WO2023013453A1 (ja) * 2021-08-02 2023-02-09 東洋紡株式会社 電子表示装置
KR20230099264A (ko) * 2021-12-27 2023-07-04 엘지디스플레이 주식회사 표시 패널 및 이를 포함하는 표시 장치
CN114122231B (zh) * 2022-01-25 2023-02-03 北京芯海视界三维科技有限公司 发光器件及显示装置
USD1066347S1 (en) * 2024-01-27 2025-03-11 Darpan Singhal Computer tablet holder

Family Cites Families (161)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526818A (en) * 1982-12-23 1985-07-02 Epson Corporation Liquid crystal display panel and process for the production thereof
US5357061A (en) * 1992-04-30 1994-10-18 Calcomp Inc. Digitizer tablet having high permeability grid shield
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6035180A (en) 1997-10-07 2000-03-07 Ericsson Inc. Communication module having selectively programmable exterior surface
JP2000223682A (ja) 1999-02-02 2000-08-11 Canon Inc 基体の処理方法及び半導体基板の製造方法
EP1156705B1 (en) 1999-10-01 2006-03-01 Seiko Epson Corporation Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
TW468283B (en) * 1999-10-12 2001-12-11 Semiconductor Energy Lab EL display device and a method of manufacturing the same
JP2001210919A (ja) * 1999-11-17 2001-08-03 Sharp Corp フレキシブル配線板およびそれを用いた電子機器
TW521303B (en) 2000-02-28 2003-02-21 Semiconductor Energy Lab Electronic device
JP4776792B2 (ja) 2000-02-28 2011-09-21 株式会社半導体エネルギー研究所 発光装置および電気器具
US6879110B2 (en) * 2000-07-27 2005-04-12 Semiconductor Energy Laboratory Co., Ltd. Method of driving display device
US6613620B2 (en) * 2000-07-31 2003-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
US6562641B1 (en) * 2000-08-22 2003-05-13 Micron Technology, Inc. Apparatus and methods of semiconductor packages having circuit-bearing interconnect components
US6864628B2 (en) * 2000-08-28 2005-03-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting device comprising light-emitting layer having triplet compound and light-emitting layer having singlet compound
JP3739640B2 (ja) * 2000-08-28 2006-01-25 シャープ株式会社 液晶モジュールの製造方法
US6822391B2 (en) 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
JP4101529B2 (ja) 2001-02-22 2008-06-18 株式会社半導体エネルギー研究所 表示装置及びその作製方法
US6992439B2 (en) 2001-02-22 2006-01-31 Semiconductor Energy Laboratory Co., Ltd. Display device with sealing structure for protecting organic light emitting element
JP2002297066A (ja) * 2001-03-30 2002-10-09 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置およびその製造方法
JP2002366059A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd 携帯情報端末
TW548860B (en) * 2001-06-20 2003-08-21 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
US7211828B2 (en) * 2001-06-20 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic apparatus
TW546857B (en) * 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
JP4027740B2 (ja) 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
KR100944886B1 (ko) * 2001-10-30 2010-03-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제조 방법
US6953735B2 (en) 2001-12-28 2005-10-11 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device by transferring a layer to a support with curvature
US7178295B2 (en) * 2002-02-20 2007-02-20 Powerlight Corporation Shingle assembly
JP3989763B2 (ja) * 2002-04-15 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
US20030201974A1 (en) 2002-04-26 2003-10-30 Yin Memphis Zhihong Apparatus display
US7164155B2 (en) * 2002-05-15 2007-01-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7649674B2 (en) * 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
JP2004111158A (ja) 2002-09-17 2004-04-08 Dainippon Printing Co Ltd 発光表示パネル
US7404751B2 (en) 2002-09-17 2008-07-29 Dai Nippon Printing Co., Ltd. Method of manufacturing a light emitting display panel and a light emitting display panel
JP2004140267A (ja) 2002-10-18 2004-05-13 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US7862906B2 (en) * 2003-04-09 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent element and light-emitting device
US6841855B2 (en) * 2003-04-28 2005-01-11 Intel Corporation Electronic package having a flexible substrate with ends connected to one another
JP2005019082A (ja) 2003-06-24 2005-01-20 Totoku Electric Co Ltd フレキシブル表示素子
AU2003262039A1 (en) * 2003-09-10 2005-04-06 Fujitsu Limited Display and process for manufacturing the same
US7601236B2 (en) * 2003-11-28 2009-10-13 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing display device
US7084045B2 (en) * 2003-12-12 2006-08-01 Seminconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7075103B2 (en) * 2003-12-19 2006-07-11 General Electric Company Multilayer device and method of making
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
JP2005302436A (ja) 2004-04-08 2005-10-27 Nissan Motor Co Ltd 有機機能性素子、有機エレクトロルミネッセンス素子、その製造方法及びそれを用いた表示体
JP2006005712A (ja) 2004-06-18 2006-01-05 Konica Minolta Holdings Inc 携帯端末
JP4251129B2 (ja) * 2004-10-25 2009-04-08 セイコーエプソン株式会社 実装構造体、電気光学装置及び電子機器
US7566633B2 (en) * 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US20060286717A1 (en) * 2005-05-06 2006-12-21 Tessera, Inc. Stacked microelectronic assemblies having basal compliant layers
US7651932B2 (en) 2005-05-31 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing antenna and method for manufacturing semiconductor device
US7368307B2 (en) 2005-06-07 2008-05-06 Eastman Kodak Company Method of manufacturing an OLED device with a curved light emitting surface
JP4926426B2 (ja) 2005-08-12 2012-05-09 株式会社半導体エネルギー研究所 電子機器
US7767543B2 (en) 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
JP2007073403A (ja) 2005-09-08 2007-03-22 Toppan Printing Co Ltd 面発光デバイス
KR20070039433A (ko) 2005-10-08 2007-04-12 삼성전자주식회사 표시장치
KR20080025500A (ko) * 2006-09-18 2008-03-21 삼성전자주식회사 표시장치와 그 제조방법
JP4579890B2 (ja) 2005-11-15 2010-11-10 三星電子株式会社 表示装置とその製造方法
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機el素子
JP5239152B2 (ja) 2006-02-02 2013-07-17 セイコーエプソン株式会社 電気光学装置の製造方法、及び電子機器
US20070190675A1 (en) * 2006-02-10 2007-08-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of display device
US8173519B2 (en) * 2006-03-03 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8222116B2 (en) * 2006-03-03 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2007326259A (ja) 2006-06-07 2007-12-20 Yoshida Industry Co Ltd ディスプレイの製造方法及びディスプレイ
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
JP4561729B2 (ja) * 2006-11-06 2010-10-13 エプソンイメージングデバイス株式会社 電気光学装置及び電子機器
WO2008069162A1 (en) * 2006-12-05 2008-06-12 Semiconductor Energy Laboratory Co., Ltd. Anti-reflection film and display device
KR101310757B1 (ko) 2007-03-16 2013-09-25 엘지전자 주식회사 휴대 단말기
US8035789B2 (en) 2007-03-19 2011-10-11 Sony Corporation Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus
WO2009001842A1 (ja) * 2007-06-27 2008-12-31 Murata Manufacturing Co., Ltd. 積層セラミック電子部品及びその実装構造
JP2009026828A (ja) 2007-07-17 2009-02-05 Toshiba Matsushita Display Technology Co Ltd 有機el表示装置
TWI350714B (en) * 2007-07-19 2011-10-11 Chimei Innolux Corp System for displaying image and fabrication method thereof
KR20090019752A (ko) 2007-08-21 2009-02-25 후지필름 가부시키가이샤 산란 부재 및 그것을 사용하는 유기 일렉트로루미네선스 표시 장치
JP4506810B2 (ja) 2007-10-19 2010-07-21 ソニー株式会社 表示装置
KR100875103B1 (ko) 2007-11-16 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
JP5109792B2 (ja) 2008-05-12 2012-12-26 大日本印刷株式会社 有機エレクトロルミネッセンス表示装置用カラーフィルタ
JP2009277985A (ja) 2008-05-16 2009-11-26 Canon Inc 表示装置
TWI379261B (en) 2008-05-16 2012-12-11 Au Optronics Corp Curved display panel and manufacturing method thereof
KR101071138B1 (ko) * 2008-06-13 2011-10-10 엘지디스플레이 주식회사 액정표시장치
US8629842B2 (en) 2008-07-11 2014-01-14 Samsung Display Co., Ltd. Organic light emitting display device
US8928597B2 (en) 2008-07-11 2015-01-06 Samsung Display Co., Ltd. Organic light emitting display device
US20100008068A1 (en) 2008-07-11 2010-01-14 Joo-Young Kim Electron emission device, electron emission type backlight unit including the same and method of fabricating the electron emission device
US9342176B2 (en) 2008-07-21 2016-05-17 Samsung Display Co., Ltd. Organic light emitting display device
KR20100024710A (ko) 2008-08-26 2010-03-08 삼성모바일디스플레이주식회사 유기 발광 표시 장치
JP2010055918A (ja) * 2008-08-28 2010-03-11 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法、及び電子機器
JP5255486B2 (ja) * 2009-03-06 2013-08-07 株式会社ジャパンディスプレイイースト 入力機能付き表示装置
US20100108409A1 (en) 2008-11-06 2010-05-06 Jun Tanaka Capacitive coupling type touch panel
US8610155B2 (en) 2008-11-18 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method for manufacturing the same, and cellular phone
KR101634791B1 (ko) * 2008-11-28 2016-06-30 삼성디스플레이 주식회사 접촉 감지 기능이 있는 유기 발광 표시 장치
JP5095828B2 (ja) 2008-12-26 2012-12-12 シャープ株式会社 液晶表示装置
TWI587734B (zh) * 2009-03-26 2017-06-11 精工愛普生股份有限公司 有機el裝置、有機el裝置之製造方法、及電子機器
US20100253902A1 (en) 2009-04-07 2010-10-07 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and manufacturing method thereof
CN104597651B (zh) * 2009-05-02 2017-12-05 株式会社半导体能源研究所 显示设备
US8911653B2 (en) * 2009-05-21 2014-12-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
CN101924816B (zh) * 2009-06-12 2013-03-20 清华大学 柔性手机
JP2011026558A (ja) 2009-06-25 2011-02-10 Sumitomo Chemical Co Ltd ポリプロピレン系樹脂組成物及び成形体
US8576209B2 (en) * 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2011023558A (ja) * 2009-07-16 2011-02-03 Sharp Corp 有機el表示装置
US8593061B2 (en) * 2009-08-25 2013-11-26 Seiko Epson Corporation Electro-optical device and electronic apparatus
JP5444940B2 (ja) * 2009-08-25 2014-03-19 セイコーエプソン株式会社 電気光学装置、および電子機器
JP5644075B2 (ja) * 2009-08-25 2014-12-24 セイコーエプソン株式会社 電気光学装置、および電子機器
KR102113064B1 (ko) * 2009-09-16 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
KR20110034967A (ko) * 2009-09-29 2011-04-06 삼성전자주식회사 가스 침투 차단부를 구비한 디스플레이 장치
JP5056827B2 (ja) * 2009-10-09 2012-10-24 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子、それを用いた照明装置
JP5300684B2 (ja) * 2009-10-27 2013-09-25 株式会社ジャパンディスプレイウェスト 静電容量型入力装置、静電容量型入力装置の製造方法、および入力機能付き電気光学装置
KR101591334B1 (ko) * 2009-11-03 2016-02-04 엘지디스플레이 주식회사 터치패널 타입 유기전계발광소자
KR101727469B1 (ko) * 2009-11-06 2017-04-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR20110055089A (ko) * 2009-11-19 2011-05-25 엘지전자 주식회사 플라즈마 디스플레이 장치 및 멀티 플라즈마 디스플레이 장치
JP5446790B2 (ja) 2009-12-02 2014-03-19 セイコーエプソン株式会社 電気光学装置および電子機器
KR101082162B1 (ko) * 2009-12-03 2011-11-09 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치
KR101618157B1 (ko) * 2009-12-21 2016-05-09 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP5377269B2 (ja) * 2009-12-22 2013-12-25 株式会社ジャパンディスプレイ 電気光学装置及び電子機器
JP5507237B2 (ja) * 2009-12-25 2014-05-28 株式会社ジャパンディスプレイ 液晶表示装置
KR20110091380A (ko) 2010-02-05 2011-08-11 삼성전자주식회사 터치 패널의 노이즈 보상 방법 및 장치
CN106098788B (zh) * 2010-04-02 2020-10-16 株式会社半导体能源研究所 半导体装置
JP4915487B2 (ja) 2010-04-02 2012-04-11 コニカミノルタホールディングス株式会社 有機発光素子
KR20110112128A (ko) 2010-04-06 2011-10-12 삼성전자주식회사 터치 패널의 기생 커패시턴스 보상 방법 및 장치
US9651729B2 (en) * 2010-04-16 2017-05-16 Flex Lighting Ii, Llc Reflective display comprising a frontlight with extraction features and a light redirecting optical element
US20120001179A1 (en) * 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102765169B1 (ko) * 2010-07-02 2025-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US8647919B2 (en) * 2010-09-13 2014-02-11 Semiconductor Energy Laboratory Co., Ltd. Light-emitting display device and method for manufacturing the same
JP5846473B2 (ja) 2010-09-21 2016-01-20 大日本印刷株式会社 表示用前面板、表示用前面板の製造方法、表示装置および表示装置の製造方法
US8743082B2 (en) * 2010-10-18 2014-06-03 Qualcomm Mems Technologies, Inc. Controller architecture for combination touch, handwriting and fingerprint sensor
WO2012068543A1 (en) 2010-11-18 2012-05-24 Flex Lighting Ii, Llc Light emitting device comprising a lightguide film and aligned coupling lightguides
JP5720222B2 (ja) * 2010-12-13 2015-05-20 ソニー株式会社 表示装置及び電子機器
JP5610373B2 (ja) * 2010-12-24 2014-10-22 凸版印刷株式会社 El素子及びそれを備えた照明装置
KR20120079742A (ko) * 2011-01-05 2012-07-13 삼성전자주식회사 폴디드 적층 패키지 및 그 제조방법
US8780579B2 (en) 2011-01-05 2014-07-15 Samsung Display Co., Ltd. Organic light emitting diode display
JP5800507B2 (ja) 2011-01-06 2015-10-28 株式会社ジャパンディスプレイ 液晶表示装置
KR101780419B1 (ko) 2011-02-15 2017-10-11 삼성디스플레이 주식회사 플렉시블 표시장치
JP5842089B2 (ja) * 2011-02-21 2016-01-13 パナソニックIpマネジメント株式会社 有機elデバイス
JP5927532B2 (ja) * 2011-03-22 2016-06-01 株式会社Joled 表示装置および電子機器
TW201243663A (en) 2011-04-20 2012-11-01 Wintek Corp Touch display panel
NL2006862C2 (en) 2011-05-30 2012-12-03 Polymer Vision Bv Display device with flexible display.
JP2013003306A (ja) 2011-06-15 2013-01-07 Sony Corp 表示装置および電子機器
KR101917753B1 (ko) 2011-06-24 2018-11-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR101320385B1 (ko) * 2011-06-30 2013-10-23 삼성디스플레이 주식회사 가요성 표시 패널 및 상기 가요성 표시 패널을 포함하는 표시 장치
US10061356B2 (en) * 2011-06-30 2018-08-28 Samsung Display Co., Ltd. Flexible display panel and display apparatus including the flexible display panel
KR101320384B1 (ko) * 2011-06-30 2013-10-23 삼성디스플레이 주식회사 가요성 표시 패널 및 상기 가요성 표시 패널을 포함하는 표시 장치
JP2013025447A (ja) 2011-07-19 2013-02-04 Toppan Printing Co Ltd タッチセンサー基板及びその製造方法並びに画像表示装置
KR101896348B1 (ko) * 2011-07-22 2018-09-07 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 장치 어셈블리
KR20130015230A (ko) 2011-08-02 2013-02-13 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP5663434B2 (ja) 2011-08-15 2015-02-04 株式会社ジャパンディスプレイ 表示装置
JP2013050364A (ja) * 2011-08-30 2013-03-14 Fujifilm Corp 放射線画像検出装置
KR101861628B1 (ko) 2011-09-16 2018-05-29 삼성디스플레이 주식회사 액정 표시 장치
US9431545B2 (en) * 2011-09-23 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8723824B2 (en) 2011-09-27 2014-05-13 Apple Inc. Electronic devices with sidewall displays
JP5284449B2 (ja) 2011-11-29 2013-09-11 株式会社東芝 電子機器
KR101935553B1 (ko) 2012-02-01 2019-01-07 삼성디스플레이 주식회사 플렉시블 디스플레이 장치 및 그 제조방법
JP2013225052A (ja) * 2012-04-23 2013-10-31 Sony Corp 表示装置
KR101942918B1 (ko) * 2012-05-03 2019-01-28 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 장치 어셈블리
KR101319543B1 (ko) * 2012-05-17 2013-10-21 삼성디스플레이 주식회사 곡면 디스플레이 장치 및 이를 포함하는 멀티 디스플레이 장치
KR101386219B1 (ko) 2012-06-26 2014-04-17 삼성디스플레이 주식회사 플렉서블 표시 패널, 이를 포함하는 표시 장치 및 그 제조 방법
KR101935552B1 (ko) * 2012-06-27 2019-04-08 삼성디스플레이 주식회사 가요성 표시 패널 및 상기 가요성 표시 패널을 포함하는 표시 장치
US9419065B2 (en) * 2012-08-07 2016-08-16 Apple Inc. Flexible displays
JP5132835B2 (ja) 2012-08-09 2013-01-30 株式会社半導体エネルギー研究所 表示装置
EP2895942B1 (en) * 2012-09-14 2021-07-14 Future Tech Capital LLC Foldable touch sensor assembly
US9504124B2 (en) * 2013-01-03 2016-11-22 Apple Inc. Narrow border displays for electronic devices
US9349969B2 (en) * 2013-02-01 2016-05-24 Lg Display Co., Ltd. Electronic devices with flexible display and method for manufacturing the same
US9516743B2 (en) * 2013-02-27 2016-12-06 Apple Inc. Electronic device with reduced-stress flexible display
KR102028985B1 (ko) * 2013-03-27 2019-10-07 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
JP2015228367A (ja) * 2014-05-02 2015-12-17 株式会社半導体エネルギー研究所 半導体装置、入出力装置、及び電子機器

Also Published As

Publication number Publication date
US20140306260A1 (en) 2014-10-16
TWI776206B (zh) 2022-09-01
US9406898B2 (en) 2016-08-02
KR20210156878A (ko) 2021-12-27
TWI651202B (zh) 2019-02-21
KR20210049996A (ko) 2021-05-06
JP2015109252A (ja) 2015-06-11
JP7137670B2 (ja) 2022-09-14
TW201836834A (zh) 2018-10-16
TW201919858A (zh) 2019-06-01
US12156455B2 (en) 2024-11-26
KR20180130021A (ko) 2018-12-05
TWI703042B (zh) 2020-09-01
TWI630114B (zh) 2018-07-21
KR20240067959A (ko) 2024-05-17
KR102250061B1 (ko) 2021-05-07
TW202044564A (zh) 2020-12-01
TW202247430A (zh) 2022-12-01
KR102415221B1 (ko) 2022-06-29
KR20150143638A (ko) 2015-12-23
CN105144841B (zh) 2017-11-17
JP2020155407A (ja) 2020-09-24
US10924595B2 (en) 2021-02-16
KR102345837B1 (ko) 2021-12-30
JP2025061962A (ja) 2025-04-11
JP2017033950A (ja) 2017-02-09
JP2017201633A (ja) 2017-11-09
JP2019015982A (ja) 2019-01-31
JP2021153072A (ja) 2021-09-30
US20250072258A1 (en) 2025-02-27
JP6346366B2 (ja) 2018-06-20
KR20240152966A (ko) 2024-10-22
US20190124188A1 (en) 2019-04-25
JP2018142018A (ja) 2018-09-13
JP2023089302A (ja) 2023-06-27
KR102479472B1 (ko) 2022-12-19
JP6466012B2 (ja) 2019-02-06
KR20200131357A (ko) 2020-11-23
CN107768408A (zh) 2018-03-06
WO2014171336A1 (en) 2014-10-23
CN105144841A (zh) 2015-12-09
TW201504056A (zh) 2015-02-01
JP6167216B2 (ja) 2017-07-19
US11095763B2 (en) 2021-08-17
KR20230003640A (ko) 2023-01-06
KR102281568B1 (ko) 2021-07-23
US20210227061A1 (en) 2021-07-22
JP2019061965A (ja) 2019-04-18
KR102662635B1 (ko) 2024-04-30
JP2018026361A (ja) 2018-02-15
TW202527824A (zh) 2025-07-01
JP2022130536A (ja) 2022-09-06
TWI878700B (zh) 2025-04-01
US20230320167A1 (en) 2023-10-05
KR20180133562A (ko) 2018-12-14
US11723253B2 (en) 2023-08-08
KR20220098387A (ko) 2022-07-12
JP6293958B2 (ja) 2018-03-14
KR20210092344A (ko) 2021-07-23
US20160269515A1 (en) 2016-09-15
US9848070B2 (en) 2017-12-19
US20180139312A1 (en) 2018-05-17

Similar Documents

Publication Publication Date Title
KR102760909B1 (ko) 발광 장치

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20241011

Application number text: 1020247014112

Filing date: 20240426

PA0201 Request for examination
PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20241023

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20250122

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20250122

End annual number: 3

Start annual number: 1

PG1601 Publication of registration