JP4506810B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP4506810B2 JP4506810B2 JP2007271891A JP2007271891A JP4506810B2 JP 4506810 B2 JP4506810 B2 JP 4506810B2 JP 2007271891 A JP2007271891 A JP 2007271891A JP 2007271891 A JP2007271891 A JP 2007271891A JP 4506810 B2 JP4506810 B2 JP 4506810B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- organic
- wiring
- layer
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010408 film Substances 0.000 claims description 120
- 239000010410 layer Substances 0.000 claims description 69
- 230000002093 peripheral effect Effects 0.000 claims description 42
- 239000010409 thin film Substances 0.000 claims description 26
- 238000000926 separation method Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000011229 interlayer Substances 0.000 claims description 15
- 238000000605 extraction Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- 238000005401 electroluminescence Methods 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Description
以上説明した本発明に係る表示装置は、図4〜図8に示す様々な電子機器、例えば、デジタルカメラ、ノート型パーソナルコンピュータ、携帯電話等の携帯端末装置、ビデオカメラなど、電子機器に入力された映像信号、若しくは、電子機器内で生成した映像信号を、画像若しくは映像として表示するあらゆる分野の電子機器の表示装置に適用することが可能である。以下に、本発明が適用される電子機器の一例について説明する。
Claims (4)
- 支持基板と、当該支持基板上に設けられた画素回路および周辺回路およびこれらの回路を接続する接続配線と、当該画素回路および周辺回路および接続配線を覆う層間絶縁膜と、当該層間絶縁膜上の表示領域に配列された有機電界発光素子と、当該層間絶縁膜上において当該有機電界発光素子から当該表示領域の周囲の周辺領域に延設された引出配線とを備え、
前記画素回路は前記表示領域に設けられると共にボトムゲート型の薄膜トランジスタおよび当該薄膜トランジスタを構成する半導体層の上部に設けられたソース・ドレイン用の電極を有し、
前記周辺回路は前記周辺領域に設けられ、
前記接続配線は前記薄膜トランジスタのゲート電極と同一層で構成され、
前記層間絶縁膜は、無機絶縁膜と有機絶縁膜とをこの順に積層した積層膜からなり、
前記有機絶縁膜には、前記表示領域を囲む状態で当該有機絶縁膜を除去してなる分離溝が前記無機絶縁膜を底部として設けられ、
前記接続配線と前記引出配線とは、当該引出配線が前記分離溝を横切る部分において前記無機絶縁膜によって絶縁されると共に、
前記接続配線と前記引出配線との間における前記無機絶縁膜の下層には、前記画素回路を構成する絶縁膜と同一層で構成された絶縁膜が設けられている
表示装置。 - 前記接続配線と前記引出配線との間における前記無機絶縁膜の下層には、前記画素回路を構成する薄膜トランジスタの半導体層と同一層で構成された半導体層が設けられている
請求項1に記載の表示装置。 - 前記層間絶縁膜と前記引出配線との間には、前記有機電界発光素子の下部電極の周縁を覆うウインドウ絶縁膜が設けられた
請求項1または2に記載の表示装置。 - 前記画素回路は、非晶質シリコンからなる半導体層を備えた薄膜トランジスタを用いて構成されている
請求項1〜3の何れか1項に記載の表示装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007271891A JP4506810B2 (ja) | 2007-10-19 | 2007-10-19 | 表示装置 |
KR1020080098651A KR101622931B1 (ko) | 2007-10-19 | 2008-10-08 | 표시 장치 |
US12/253,447 US7985968B2 (en) | 2007-10-19 | 2008-10-17 | Display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007271891A JP4506810B2 (ja) | 2007-10-19 | 2007-10-19 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009098533A JP2009098533A (ja) | 2009-05-07 |
JP4506810B2 true JP4506810B2 (ja) | 2010-07-21 |
Family
ID=40562559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007271891A Expired - Fee Related JP4506810B2 (ja) | 2007-10-19 | 2007-10-19 | 表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7985968B2 (ja) |
JP (1) | JP4506810B2 (ja) |
KR (1) | KR101622931B1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7042024B2 (en) * | 2001-11-09 | 2006-05-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting apparatus and method for manufacturing the same |
JP4991634B2 (ja) * | 2008-06-09 | 2012-08-01 | キヤノン株式会社 | 有機el発光装置 |
JP5663231B2 (ja) * | 2009-08-07 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 発光装置 |
TWI596741B (zh) * | 2009-08-07 | 2017-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
JP5593676B2 (ja) * | 2009-10-22 | 2014-09-24 | ソニー株式会社 | 表示装置および表示装置の製造方法 |
TWI654762B (zh) * | 2011-05-05 | 2019-03-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
JP2013122903A (ja) * | 2011-11-10 | 2013-06-20 | Nitto Denko Corp | 有機elデバイス、および、有機elデバイスの製造方法 |
US8912547B2 (en) * | 2012-01-20 | 2014-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, display device, and semiconductor device |
US20150034929A1 (en) * | 2012-03-12 | 2015-02-05 | Panasonic Corporation | Organic electroluminescence element |
KR101980768B1 (ko) * | 2012-12-28 | 2019-05-21 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
JP6074597B2 (ja) * | 2013-03-29 | 2017-02-08 | 株式会社Joled | 有機el表示装置および電子機器 |
WO2014171336A1 (en) | 2013-04-15 | 2014-10-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
KR102139577B1 (ko) | 2013-10-24 | 2020-07-31 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102240894B1 (ko) * | 2014-02-26 | 2021-04-16 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
JP2015187928A (ja) * | 2014-03-26 | 2015-10-29 | 株式会社Joled | 有機el表示装置および電子機器 |
JP6175644B2 (ja) * | 2014-08-19 | 2017-08-09 | 株式会社Joled | 表示装置および電子機器 |
KR102606279B1 (ko) * | 2016-04-04 | 2023-11-27 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
JP6715105B2 (ja) * | 2016-06-29 | 2020-07-01 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102457251B1 (ko) * | 2017-03-31 | 2022-10-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP6912080B2 (ja) * | 2017-06-09 | 2021-07-28 | 株式会社Joled | 有機el表示パネル |
KR102638296B1 (ko) * | 2018-03-19 | 2024-02-20 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
KR20200057142A (ko) * | 2018-11-15 | 2020-05-26 | 삼성디스플레이 주식회사 | 표시 장치 |
US11239305B2 (en) * | 2019-07-24 | 2022-02-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Display device and manufacturing method thereof |
KR20230103694A (ko) * | 2021-12-31 | 2023-07-07 | 엘지디스플레이 주식회사 | 발광 표시 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005164818A (ja) * | 2003-12-01 | 2005-06-23 | Mitsubishi Electric Corp | 表示装置 |
JP2006054111A (ja) * | 2004-08-12 | 2006-02-23 | Sony Corp | 表示装置 |
JP2006066206A (ja) * | 2004-08-26 | 2006-03-09 | Mitsubishi Electric Corp | 表示装置 |
JP2006080505A (ja) * | 2004-09-08 | 2006-03-23 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板及びその製造方法 |
JP2006156403A (ja) * | 2004-11-30 | 2006-06-15 | Lg Phillips Lcd Co Ltd | 有機電界発光素子及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2259300B1 (en) * | 2003-10-28 | 2020-04-08 | Semiconductor Energy Laboratory Co., Ltd. | Manufacture of semiconductor device |
JP5007598B2 (ja) * | 2007-04-12 | 2012-08-22 | ソニー株式会社 | 表示装置およびその製造方法 |
-
2007
- 2007-10-19 JP JP2007271891A patent/JP4506810B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-08 KR KR1020080098651A patent/KR101622931B1/ko active IP Right Grant
- 2008-10-17 US US12/253,447 patent/US7985968B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005164818A (ja) * | 2003-12-01 | 2005-06-23 | Mitsubishi Electric Corp | 表示装置 |
JP2006054111A (ja) * | 2004-08-12 | 2006-02-23 | Sony Corp | 表示装置 |
JP2006066206A (ja) * | 2004-08-26 | 2006-03-09 | Mitsubishi Electric Corp | 表示装置 |
JP2006080505A (ja) * | 2004-09-08 | 2006-03-23 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板及びその製造方法 |
JP2006156403A (ja) * | 2004-11-30 | 2006-06-15 | Lg Phillips Lcd Co Ltd | 有機電界発光素子及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2009098533A (ja) | 2009-05-07 |
KR101622931B1 (ko) | 2016-05-20 |
US7985968B2 (en) | 2011-07-26 |
US20090101904A1 (en) | 2009-04-23 |
KR20090040217A (ko) | 2009-04-23 |
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