KR102608789B1 - 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법 - Google Patents

베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법 Download PDF

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Publication number
KR102608789B1
KR102608789B1 KR1020237025606A KR20237025606A KR102608789B1 KR 102608789 B1 KR102608789 B1 KR 102608789B1 KR 1020237025606 A KR1020237025606 A KR 1020237025606A KR 20237025606 A KR20237025606 A KR 20237025606A KR 102608789 B1 KR102608789 B1 KR 102608789B1
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South Korea
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groove
mainstream
intersection
metal sheet
depth
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Korean (ko)
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KR20230117628A (ko
Inventor
신이치로 다카하시
겐로 히라타
다카유키 오타
다이조 하시모토
기요타카 다케마츠
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다이니폰 인사츠 가부시키가이샤
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Priority to KR1020237041026A priority Critical patent/KR102749417B1/ko
Publication of KR20230117628A publication Critical patent/KR20230117628A/ko
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)
KR1020237025606A 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법 Active KR102608789B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237041026A KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPJP-P-2017-033622 2017-02-24
JP2017033622 2017-02-24
JPJP-P-2017-217633 2017-11-10
JP2017217593 2017-11-10
JPJP-P-2017-217593 2017-11-10
JP2017217633 2017-11-10
KR1020227030577A KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
PCT/JP2018/006758 WO2018155641A1 (ja) 2017-02-24 2018-02-23 ベーパーチャンバ、電子機器、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030577A Division KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237041026A Division KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Publications (2)

Publication Number Publication Date
KR20230117628A KR20230117628A (ko) 2023-08-08
KR102608789B1 true KR102608789B1 (ko) 2023-12-04

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ID=63253812

Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020237025606A Active KR102608789B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법
KR1020197024492A Active KR102442311B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020247043247A Pending KR20250005552A (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020237041026A Active KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020227030577A Active KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Family Applications After (4)

Application Number Title Priority Date Filing Date
KR1020197024492A Active KR102442311B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020247043247A Pending KR20250005552A (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020237041026A Active KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020227030577A Active KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Country Status (6)

Country Link
US (4) US11578927B2 (https=)
JP (6) JP6853962B2 (https=)
KR (5) KR102608789B1 (https=)
CN (2) CN110325810B (https=)
TW (4) TWI736745B (https=)
WO (1) WO2018155641A1 (https=)

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TWI736745B (zh) 2017-02-24 2021-08-21 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法
KR102539133B1 (ko) 2017-09-28 2023-06-01 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7015197B2 (ja) * 2018-03-26 2022-02-02 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7363199B2 (ja) * 2018-08-31 2023-10-18 大日本印刷株式会社 ベーパーチャンバー、電子機器
TWI738179B (zh) * 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
CN119812143A (zh) * 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
KR102570354B1 (ko) * 2019-05-28 2023-08-25 미쯔이가가꾸가부시끼가이샤 냉각 장치 및 냉각 장치의 제조 방법
CN110572981B (zh) 2019-07-31 2020-12-22 华为技术有限公司 一种导热装置及终端设备
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
CN112484544A (zh) * 2019-10-30 2021-03-12 株式会社Cgi 非定向型均热板
TWI811504B (zh) * 2019-12-16 2023-08-11 訊凱國際股份有限公司 散熱裝置
WO2021141110A1 (ja) * 2020-01-10 2021-07-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
CN113270382B (zh) * 2020-02-14 2025-03-18 昇印光电（昆山）股份有限公司 一种散热组件及搭载其的电子设备
KR102381018B1 (ko) * 2020-03-23 2022-03-31 화인시스 주식회사 베이퍼 체임버
KR102442845B1 (ko) * 2020-03-23 2022-09-15 화인시스 주식회사 베이퍼 체임버
CN113465420A (zh) * 2020-03-30 2021-10-01 超众科技股份有限公司 热传导部件、接合热传导部件的接合装置
TWI747305B (zh) * 2020-06-01 2021-11-21 建準電機工業股份有限公司 均溫板結構
JP7568431B2 (ja) * 2020-06-30 2024-10-16 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
CN113883936B (zh) * 2020-07-03 2025-08-19 台达电子工业股份有限公司 薄型均温板结构
CN112118711A (zh) * 2020-09-18 2020-12-22 南昌欧菲显示科技有限公司 均热板及其制作方法及电子设备
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WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
TWI817052B (zh) * 2020-11-09 2023-10-01 欣興電子股份有限公司 均溫板裝置及其製作方法
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KR102864843B1 (ko) * 2020-11-30 2025-09-25 주식회사 엘지화학 증기 챔버
KR102864842B1 (ko) * 2020-11-30 2025-09-25 주식회사 엘지화학 증기 챔버
KR102940525B1 (ko) 2020-11-30 2026-03-18 주식회사 엘지화학 증기 챔버
KR102864840B1 (ko) * 2020-11-30 2025-09-25 주식회사 엘지화학 증기 챔버
KR20230136170A (ko) * 2021-02-26 2023-09-26 교세라 가부시키가이샤 열 디바이스
TWI878479B (zh) * 2021-03-04 2025-04-01 宸寰科技有限公司 薄型化封裝接著結構
KR20230156088A (ko) 2021-03-10 2023-11-13 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
CN113316355A (zh) * 2021-04-20 2021-08-27 江西展耀微电子有限公司 均热结构及电子设备
KR102620257B1 (ko) * 2021-07-20 2024-01-03 주식회사 씨지아이 베이퍼 챔버 및 그에 사용되는 작동 유체
FR3128821B1 (fr) * 2021-11-04 2023-12-22 Commissariat Energie Atomique Chambre à vapeur
JP2024053369A (ja) 2022-10-03 2024-04-15 新光電気工業株式会社 ループ型ヒートパイプ及びループ型ヒートパイプの製造方法
CN222514294U (zh) * 2024-03-11 2025-02-21 讯强电子(惠州)有限公司 均热板、散热器

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