KR102442311B1 - 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법 - Google Patents

베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법 Download PDF

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KR102442311B1
KR102442311B1 KR1020197024492A KR20197024492A KR102442311B1 KR 102442311 B1 KR102442311 B1 KR 102442311B1 KR 1020197024492 A KR1020197024492 A KR 1020197024492A KR 20197024492 A KR20197024492 A KR 20197024492A KR 102442311 B1 KR102442311 B1 KR 102442311B1
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groove
mainstream
metal sheet
convex
communication
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KR20190121309A (ko
Inventor
신이치로 다카하시
겐로 히라타
다카유키 오타
다이조 하시모토
기요타카 다케마츠
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다이니폰 인사츠 가부시키가이샤
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Priority to KR1020227030577A priority Critical patent/KR102561617B1/ko
Publication of KR20190121309A publication Critical patent/KR20190121309A/ko
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)
KR1020197024492A 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법 Active KR102442311B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227030577A KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2017-033622 2017-02-24
JP2017033622 2017-02-24
JPJP-P-2017-217633 2017-11-10
JPJP-P-2017-217593 2017-11-10
JP2017217633 2017-11-10
JP2017217593 2017-11-10
PCT/JP2018/006758 WO2018155641A1 (ja) 2017-02-24 2018-02-23 ベーパーチャンバ、電子機器、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030577A Division KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법

Publications (2)

Publication Number Publication Date
KR20190121309A KR20190121309A (ko) 2019-10-25
KR102442311B1 true KR102442311B1 (ko) 2022-09-13

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Application Number Title Priority Date Filing Date
KR1020197024492A Active KR102442311B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020237041026A Active KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020247043247A Pending KR20250005552A (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020227030577A Active KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020237025606A Active KR102608789B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법

Family Applications After (4)

Application Number Title Priority Date Filing Date
KR1020237041026A Active KR102749417B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020247043247A Pending KR20250005552A (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020227030577A Active KR102561617B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
KR1020237025606A Active KR102608789B1 (ko) 2017-02-24 2018-02-23 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트및 베이퍼 챔버의 제조 방법

Country Status (6)

Country Link
US (4) US11578927B2 (enExample)
JP (6) JP6853962B2 (enExample)
KR (5) KR102442311B1 (enExample)
CN (2) CN113237368B (enExample)
TW (4) TWI870768B (enExample)
WO (1) WO2018155641A1 (enExample)

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TWI893344B (zh) 2017-09-28 2025-08-11 日商大日本印刷股份有限公司 蒸氣腔、電子機器及蒸氣腔之製造方法
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7015197B2 (ja) * 2018-03-26 2022-02-02 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7363199B2 (ja) * 2018-08-31 2023-10-18 大日本印刷株式会社 ベーパーチャンバー、電子機器
TWI738179B (zh) 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
TWI897457B (zh) * 2019-03-11 2025-09-11 日商大日本印刷股份有限公司 蒸氣腔、電子機器及蒸氣腔用片材
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CN110572981B (zh) 2019-07-31 2020-12-22 华为技术有限公司 一种导热装置及终端设备
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
CN112484544A (zh) * 2019-10-30 2021-03-12 株式会社Cgi 非定向型均热板
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CN113270382B (zh) * 2020-02-14 2025-03-18 昇印光电（昆山）股份有限公司 一种散热组件及搭载其的电子设备
KR102442845B1 (ko) * 2020-03-23 2022-09-15 화인시스 주식회사 베이퍼 체임버
KR102381018B1 (ko) * 2020-03-23 2022-03-31 화인시스 주식회사 베이퍼 체임버
CN113465420A (zh) * 2020-03-30 2021-10-01 超众科技股份有限公司 热传导部件、接合热传导部件的接合装置
TWI747305B (zh) * 2020-06-01 2021-11-21 建準電機工業股份有限公司 均溫板結構
JP7568431B2 (ja) * 2020-06-30 2024-10-16 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
CN113883936B (zh) * 2020-07-03 2025-08-19 台达电子工业股份有限公司 薄型均温板结构
CN112118711A (zh) * 2020-09-18 2020-12-22 南昌欧菲显示科技有限公司 均热板及其制作方法及电子设备
KR20220055070A (ko) 2020-10-26 2022-05-03 주식회사 엘지화학 증기 챔버
WO2022097417A1 (ja) * 2020-11-04 2022-05-12 株式会社村田製作所 熱拡散デバイス
TWI817052B (zh) * 2020-11-09 2023-10-01 欣興電子股份有限公司 均溫板裝置及其製作方法
JP7593793B2 (ja) * 2020-11-26 2024-12-03 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
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KR102864842B1 (ko) * 2020-11-30 2025-09-25 주식회사 엘지화학 증기 챔버
KR102864840B1 (ko) * 2020-11-30 2025-09-25 주식회사 엘지화학 증기 챔버
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WO2022181453A1 (ja) * 2021-02-26 2022-09-01 京セラ株式会社 熱デバイス
TWI878479B (zh) * 2021-03-04 2025-04-01 宸寰科技有限公司 薄型化封裝接著結構
JPWO2022191240A1 (enExample) 2021-03-10 2022-09-15
CN113316355A (zh) * 2021-04-20 2021-08-27 江西展耀微电子有限公司 均热结构及电子设备
KR102620257B1 (ko) * 2021-07-20 2024-01-03 주식회사 씨지아이 베이퍼 챔버 및 그에 사용되는 작동 유체
FR3128821B1 (fr) * 2021-11-04 2023-12-22 Commissariat Energie Atomique Chambre à vapeur
JP2024053369A (ja) 2022-10-03 2024-04-15 新光電気工業株式会社 ループ型ヒートパイプ及びループ型ヒートパイプの製造方法
CN222514294U (zh) * 2024-03-11 2025-02-21 讯强电子(惠州)有限公司 均热板、散热器

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