KR101479349B1 - 다층 배선 기판 및 그 제조 방법 - Google Patents

다층 배선 기판 및 그 제조 방법 Download PDF

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Publication number
KR101479349B1
KR101479349B1 KR20090022924A KR20090022924A KR101479349B1 KR 101479349 B1 KR101479349 B1 KR 101479349B1 KR 20090022924 A KR20090022924 A KR 20090022924A KR 20090022924 A KR20090022924 A KR 20090022924A KR 101479349 B1 KR101479349 B1 KR 101479349B1
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KR
South Korea
Prior art keywords
insulating layer
glass cloth
wiring board
wiring
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR20090022924A
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English (en)
Korean (ko)
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KR20090100292A (ko
Inventor
나츠코 우에다
유지 유키이리
Original Assignee
신코 덴키 코교 가부시키가이샤
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Publication of KR20090100292A publication Critical patent/KR20090100292A/ko
Application granted granted Critical
Publication of KR101479349B1 publication Critical patent/KR101479349B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR20090022924A 2008-03-19 2009-03-18 다층 배선 기판 및 그 제조 방법 Expired - Fee Related KR101479349B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008070681A JP5295596B2 (ja) 2008-03-19 2008-03-19 多層配線基板およびその製造方法
JPJP-P-2008-070681 2008-03-19

Publications (2)

Publication Number Publication Date
KR20090100292A KR20090100292A (ko) 2009-09-23
KR101479349B1 true KR101479349B1 (ko) 2015-01-05

Family

ID=41087768

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20090022924A Expired - Fee Related KR101479349B1 (ko) 2008-03-19 2009-03-18 다층 배선 기판 및 그 제조 방법

Country Status (5)

Country Link
US (1) US8129626B2 (https=)
JP (1) JP5295596B2 (https=)
KR (1) KR101479349B1 (https=)
CN (1) CN101540311B (https=)
TW (1) TWI448216B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020060265A1 (ko) * 2018-09-20 2020-03-26 주식회사 엘지화학 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치
US11848263B2 (en) 2018-09-20 2023-12-19 Lg Chem, Ltd. Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same

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JP5527585B2 (ja) * 2009-12-15 2014-06-18 日立化成株式会社 多層配線基板及びその製造方法
JP5479233B2 (ja) * 2010-06-04 2014-04-23 新光電気工業株式会社 配線基板及びその製造方法
JP5444136B2 (ja) * 2010-06-18 2014-03-19 新光電気工業株式会社 配線基板
JP5578962B2 (ja) * 2010-06-24 2014-08-27 新光電気工業株式会社 配線基板
EP2448380A1 (en) * 2010-10-26 2012-05-02 ATOTECH Deutschland GmbH Composite build-up material for embedding of circuitry
JP5715835B2 (ja) 2011-01-25 2015-05-13 新光電気工業株式会社 半導体パッケージ及びその製造方法
JP2013033914A (ja) * 2011-06-27 2013-02-14 Toshiba Corp 半導体装置
JP6081693B2 (ja) 2011-09-12 2017-02-15 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP5851211B2 (ja) * 2011-11-11 2016-02-03 新光電気工業株式会社 半導体パッケージ、半導体パッケージの製造方法及び半導体装置
JP2013149941A (ja) * 2011-12-22 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板及びその製造方法
US9288909B2 (en) * 2012-02-01 2016-03-15 Marvell World Trade Ltd. Ball grid array package substrate with through holes and method of forming same
JP5955102B2 (ja) * 2012-05-29 2016-07-20 京セラ株式会社 配線基板およびその製造方法
JP5990421B2 (ja) * 2012-07-20 2016-09-14 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
TWI512922B (zh) * 2012-09-26 2015-12-11 欣興電子股份有限公司 封裝基板與封裝結構之製法
JP2014075515A (ja) * 2012-10-05 2014-04-24 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
CN103732012B (zh) * 2012-10-15 2016-11-16 景硕科技股份有限公司 线路载板的增层方法
CN103730436B (zh) * 2012-10-15 2016-11-16 景硕科技股份有限公司 线路载板的增层结构
JP2014127623A (ja) 2012-12-27 2014-07-07 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
JP6381432B2 (ja) 2014-05-22 2018-08-29 新光電気工業株式会社 インダクタ、コイル基板及びコイル基板の製造方法
KR20160010960A (ko) * 2014-07-21 2016-01-29 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6444651B2 (ja) * 2014-08-12 2018-12-26 日本シイエムケイ株式会社 多層プリント配線板
KR20160127226A (ko) * 2015-04-23 2016-11-03 에스케이하이닉스 주식회사 지지 패턴을 구비하는 인쇄회로기판 및 이의 제조 방법
US10395810B2 (en) 2015-05-19 2019-08-27 Shinko Electric Industries Co., Ltd. Inductor
JP6661232B2 (ja) * 2016-03-01 2020-03-11 新光電気工業株式会社 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
US10249561B2 (en) 2016-04-28 2019-04-02 Ibiden Co., Ltd. Printed wiring board having embedded pads and method for manufacturing the same
JP6594264B2 (ja) * 2016-06-07 2019-10-23 新光電気工業株式会社 配線基板及び半導体装置、並びにそれらの製造方法
CN106409688B (zh) * 2016-07-22 2018-08-21 深南电路股份有限公司 一种超薄无芯封装基板的加工方法和结构
CN106340461B (zh) * 2016-07-22 2019-01-01 深南电路股份有限公司 一种超薄无芯封装基板的加工方法和结构
JP2018032661A (ja) 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびその製造方法
JP2018032657A (ja) 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP2018032660A (ja) 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
US10424547B2 (en) * 2017-08-30 2019-09-24 Advanced Semiconductor Engineering Inc. Semiconductor device package and a method of manufacturing the same
JP7533834B2 (ja) * 2019-02-27 2024-08-14 住友電工プリントサーキット株式会社 プリント配線板及びプリント配線板の製造方法
WO2022070389A1 (ja) * 2020-10-01 2022-04-07 昭和電工マテリアルズ株式会社 配線基板の製造方法、半導体装置の製造方法、及び樹脂シート
KR20230047696A (ko) * 2021-10-01 2023-04-10 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지
US12176222B2 (en) * 2021-11-29 2024-12-24 Infineon Technologies Ag Semiconductor package with metal posts from structured leadframe
WO2023157624A1 (ja) * 2022-02-15 2023-08-24 凸版印刷株式会社 インターポーザ、半導体パッケージ及びそれらの製造方法

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US6936336B2 (en) 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
JP2007096260A (ja) 2005-08-29 2007-04-12 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
JP2007173459A (ja) 2005-12-21 2007-07-05 Ibiden Co Ltd プリント配線板の製造方法

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US6936336B2 (en) 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
JP2007096260A (ja) 2005-08-29 2007-04-12 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
JP2007173459A (ja) 2005-12-21 2007-07-05 Ibiden Co Ltd プリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020060265A1 (ko) * 2018-09-20 2020-03-26 주식회사 엘지화학 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치
US11848263B2 (en) 2018-09-20 2023-12-19 Lg Chem, Ltd. Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same

Also Published As

Publication number Publication date
US20090236135A1 (en) 2009-09-24
CN101540311A (zh) 2009-09-23
US8129626B2 (en) 2012-03-06
CN101540311B (zh) 2013-09-04
JP5295596B2 (ja) 2013-09-18
TW200942096A (en) 2009-10-01
KR20090100292A (ko) 2009-09-23
TWI448216B (zh) 2014-08-01
JP2009224739A (ja) 2009-10-01

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