KR101410534B1 - Ⅲ족 질화물 결정의 제조 방법 - Google Patents
Ⅲ족 질화물 결정의 제조 방법 Download PDFInfo
- Publication number
- KR101410534B1 KR101410534B1 KR1020097008369A KR20097008369A KR101410534B1 KR 101410534 B1 KR101410534 B1 KR 101410534B1 KR 1020097008369 A KR1020097008369 A KR 1020097008369A KR 20097008369 A KR20097008369 A KR 20097008369A KR 101410534 B1 KR101410534 B1 KR 101410534B1
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- KR
- South Korea
- Prior art keywords
- group
- crystal
- iii nitride
- substrates
- plane
- Prior art date
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- Expired - Fee Related
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/025—Epitaxial-layer growth characterised by the substrate
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24752—Laterally noncoextensive components
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006311622 | 2006-11-17 | ||
| JPJP-P-2006-311622 | 2006-11-17 | ||
| JP2007258567A JP5332168B2 (ja) | 2006-11-17 | 2007-10-02 | Iii族窒化物結晶の製造方法 |
| JPJP-P-2007-258567 | 2007-10-02 | ||
| PCT/JP2007/072096 WO2008059875A1 (fr) | 2006-11-17 | 2007-11-14 | Procédé de fabrication d'un cristal de nitrure d'élément du groupe iii |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090082367A KR20090082367A (ko) | 2009-07-30 |
| KR101410534B1 true KR101410534B1 (ko) | 2014-06-20 |
Family
ID=39401679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097008369A Expired - Fee Related KR101410534B1 (ko) | 2006-11-17 | 2007-11-14 | Ⅲ족 질화물 결정의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US8258051B2 (enExample) |
| EP (1) | EP2083099B1 (enExample) |
| JP (1) | JP5332168B2 (enExample) |
| KR (1) | KR101410534B1 (enExample) |
| WO (1) | WO2008059875A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI739446B (zh) * | 2019-07-26 | 2021-09-11 | 日商Jx金屬股份有限公司 | 磷化銦基板、及磷化銦基板之製造方法 |
Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9518340B2 (en) | 2006-04-07 | 2016-12-13 | Sixpoint Materials, Inc. | Method of growing group III nitride crystals |
| JP5332168B2 (ja) | 2006-11-17 | 2013-11-06 | 住友電気工業株式会社 | Iii族窒化物結晶の製造方法 |
| US9064706B2 (en) | 2006-11-17 | 2015-06-23 | Sumitomo Electric Industries, Ltd. | Composite of III-nitride crystal on laterally stacked substrates |
| JP5363996B2 (ja) * | 2007-02-12 | 2013-12-11 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | Al(x)Ga(1−x)Nクラッディングフリー非極性III族窒化物ベースのレーザダイオードおよび発光ダイオード |
| JP2009286652A (ja) * | 2008-05-28 | 2009-12-10 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶、iii族窒化物結晶基板および半導体デバイスの製造方法 |
| JP2010006685A (ja) * | 2008-05-28 | 2010-01-14 | Sumitomo Electric Ind Ltd | AlxGa1−xN単結晶および電磁波透過体 |
| JPWO2010001804A1 (ja) * | 2008-07-01 | 2011-12-22 | 住友電気工業株式会社 | AlxGa(1−x)N単結晶の製造方法、AlxGa(1−x)N単結晶および光学部品 |
| JP5012700B2 (ja) * | 2008-07-01 | 2012-08-29 | 住友電気工業株式会社 | Iii族窒化物結晶接合基板およびその製造方法ならびにiii族窒化物結晶の製造方法 |
| US8673074B2 (en) | 2008-07-16 | 2014-03-18 | Ostendo Technologies, Inc. | Growth of planar non-polar {1 -1 0 0} M-plane and semi-polar {1 1 -2 2} gallium nitride with hydride vapor phase epitaxy (HVPE) |
| JP2010042980A (ja) * | 2008-07-17 | 2010-02-25 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶の製造方法およびiii族窒化物結晶 |
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| JP5112983B2 (ja) * | 2008-08-06 | 2013-01-09 | 豊田合成株式会社 | Iii族窒化物半導体製造方法およびiii族窒化物半導体育成用の種結晶 |
| JPWO2010024285A1 (ja) * | 2008-09-01 | 2012-01-26 | 住友電気工業株式会社 | 窒化物基板の製造方法および窒化物基板 |
| JP2010068097A (ja) * | 2008-09-09 | 2010-03-25 | Sumitomo Electric Ind Ltd | 弾性表面波素子 |
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| JP4730422B2 (ja) * | 2008-10-24 | 2011-07-20 | 住友電気工業株式会社 | Iii族窒化物半導体電子デバイス、iii族窒化物半導体電子デバイスを作製する方法、及びiii族窒化物半導体エピタキシャルウエハ |
| JP5515341B2 (ja) * | 2009-03-16 | 2014-06-11 | 住友電気工業株式会社 | Iii族窒化物結晶の成長方法 |
| US8742459B2 (en) | 2009-05-14 | 2014-06-03 | Transphorm Inc. | High voltage III-nitride semiconductor devices |
| WO2010140564A1 (ja) | 2009-06-01 | 2010-12-09 | 三菱化学株式会社 | 窒化物半導体結晶およびその製造方法 |
| JP5509680B2 (ja) * | 2009-06-01 | 2014-06-04 | 三菱化学株式会社 | Iii族窒化物結晶及びその製造方法 |
| JP5446622B2 (ja) * | 2009-06-29 | 2014-03-19 | 住友電気工業株式会社 | Iii族窒化物結晶およびその製造方法 |
| JP5888317B2 (ja) * | 2009-06-29 | 2016-03-22 | 住友電気工業株式会社 | Iii族窒化物結晶 |
| JP2011016676A (ja) | 2009-07-07 | 2011-01-27 | Sumitomo Electric Ind Ltd | 窒化物半導体基板の製造方法 |
| JP5447289B2 (ja) * | 2009-08-19 | 2014-03-19 | 三菱化学株式会社 | 窒化物半導体結晶およびその製造方法 |
| JP5471251B2 (ja) * | 2009-09-30 | 2014-04-16 | 住友電気工業株式会社 | GaN単結晶基板およびGaN系半導体デバイス |
| JP5549157B2 (ja) * | 2009-09-04 | 2014-07-16 | 住友電気工業株式会社 | GaN単結晶基板およびその製造方法、ならびにGaN系半導体デバイスおよびその製造方法 |
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| US9257547B2 (en) | 2011-09-13 | 2016-02-09 | Transphorm Inc. | III-N device structures having a non-insulating substrate |
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| CN104040039B (zh) * | 2012-01-11 | 2016-08-31 | 国立大学法人大阪大学 | Iii族氮化物结晶的制造方法、iii族氮化物结晶及半导体装置 |
| US9165766B2 (en) | 2012-02-03 | 2015-10-20 | Transphorm Inc. | Buffer layer structures suited for III-nitride devices with foreign substrates |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2083099B1 (en) | 2019-09-18 |
| US20090236694A1 (en) | 2009-09-24 |
| WO2008059875A1 (fr) | 2008-05-22 |
| US8404042B2 (en) | 2013-03-26 |
| US8872309B2 (en) | 2014-10-28 |
| EP2083099A1 (en) | 2009-07-29 |
| JP2008143772A (ja) | 2008-06-26 |
| KR20090082367A (ko) | 2009-07-30 |
| US20120315445A1 (en) | 2012-12-13 |
| US20140175616A1 (en) | 2014-06-26 |
| US8258051B2 (en) | 2012-09-04 |
| EP2083099A4 (en) | 2016-01-20 |
| US20130160699A1 (en) | 2013-06-27 |
| US8709923B2 (en) | 2014-04-29 |
| JP5332168B2 (ja) | 2013-11-06 |
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