KR101178755B1 - 노광 장치, 노광 방법 및 디바이스 제조 방법 - Google Patents

노광 장치, 노광 방법 및 디바이스 제조 방법 Download PDF

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Publication number
KR101178755B1
KR101178755B1 KR1020067022688A KR20067022688A KR101178755B1 KR 101178755 B1 KR101178755 B1 KR 101178755B1 KR 1020067022688 A KR1020067022688 A KR 1020067022688A KR 20067022688 A KR20067022688 A KR 20067022688A KR 101178755 B1 KR101178755 B1 KR 101178755B1
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South Korea
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liquid
substrate
delete delete
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optical system
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Expired - Fee Related
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KR1020067022688A
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English (en)
Korean (ko)
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KR20070032641A (ko
Inventor
히로유키 나가사카
다케시 오쿠야마
Original Assignee
가부시키가이샤 니콘 엔지니어링
가부시키가이샤 니콘
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Publication of KR20070032641A publication Critical patent/KR20070032641A/ko
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
KR1020067022688A 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법 Expired - Fee Related KR101178755B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2004172569 2004-06-10
JPJP-P-2004-00172569 2004-06-10
JPJP-P-2004-00245260 2004-08-25
JP2004245260 2004-08-25
JP2004330582 2004-11-15
JPJP-P-2004-00330582 2004-11-15
PCT/JP2005/010576 WO2005122221A1 (ja) 2004-06-10 2005-06-09 露光装置、露光方法及びデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020127006833A Division KR101310472B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20070032641A KR20070032641A (ko) 2007-03-22
KR101178755B1 true KR101178755B1 (ko) 2012-08-31

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KR1020067022688A Expired - Fee Related KR101178755B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020147015812A Expired - Fee Related KR101612656B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020177001781A Ceased KR20170010907A (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020187017618A Ceased KR20180072867A (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020127033098A Expired - Fee Related KR101485650B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020137022569A Expired - Fee Related KR101556454B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020127006833A Expired - Fee Related KR101310472B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020157005498A Expired - Fee Related KR101699965B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법

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KR1020147015812A Expired - Fee Related KR101612656B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020177001781A Ceased KR20170010907A (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020187017618A Ceased KR20180072867A (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020127033098A Expired - Fee Related KR101485650B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020137022569A Expired - Fee Related KR101556454B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020127006833A Expired - Fee Related KR101310472B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법
KR1020157005498A Expired - Fee Related KR101699965B1 (ko) 2004-06-10 2005-06-09 노광 장치, 노광 방법 및 디바이스 제조 방법

Country Status (9)

Country Link
US (7) US8482716B2 (cg-RX-API-DMAC7.html)
EP (4) EP3203321A1 (cg-RX-API-DMAC7.html)
JP (10) JP5295165B2 (cg-RX-API-DMAC7.html)
KR (8) KR101178755B1 (cg-RX-API-DMAC7.html)
CN (1) CN102736446B (cg-RX-API-DMAC7.html)
IL (4) IL179787A (cg-RX-API-DMAC7.html)
SG (3) SG188877A1 (cg-RX-API-DMAC7.html)
TW (6) TWI612393B (cg-RX-API-DMAC7.html)
WO (1) WO2005122221A1 (cg-RX-API-DMAC7.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101430508B (zh) * 2003-09-03 2011-08-10 株式会社尼康 为浸没光刻提供流体的装置和方法
JP4973754B2 (ja) * 2004-03-04 2012-07-11 株式会社ニコン 露光方法及び露光装置、デバイス製造方法
EP3203321A1 (en) * 2004-06-10 2017-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7481867B2 (en) 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7133114B2 (en) * 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TW200644079A (en) * 2005-03-31 2006-12-16 Nikon Corp Exposure apparatus, exposure method, and device production method
JP4872916B2 (ja) * 2005-04-18 2012-02-08 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI397945B (zh) 2005-11-14 2013-06-01 尼康股份有限公司 A liquid recovery member, an exposure apparatus, an exposure method, and an element manufacturing method
WO2007129753A1 (ja) * 2006-05-10 2007-11-15 Nikon Corporation 露光装置及びデバイス製造方法
US7532309B2 (en) * 2006-06-06 2009-05-12 Nikon Corporation Immersion lithography system and method having an immersion fluid containment plate for submerging the substrate to be imaged in immersion fluid
US7567338B2 (en) * 2006-08-30 2009-07-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004651B2 (en) * 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
KR100843709B1 (ko) * 2007-02-05 2008-07-04 삼성전자주식회사 액체 실링 유니트 및 이를 갖는 이멀젼 포토리소그래피장치
US8134685B2 (en) 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US8300207B2 (en) 2007-05-17 2012-10-30 Nikon Corporation Exposure apparatus, immersion system, exposing method, and device fabricating method
US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL1036253A1 (nl) * 2007-12-10 2009-06-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
ATE548679T1 (de) * 2008-05-08 2012-03-15 Asml Netherlands Bv Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung
EP2131241B1 (en) * 2008-05-08 2019-07-31 ASML Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
NL2004362A (en) * 2009-04-10 2010-10-12 Asml Netherlands Bv A fluid handling device, an immersion lithographic apparatus and a device manufacturing method.
KR20120101437A (ko) 2009-11-09 2012-09-13 가부시키가이샤 니콘 노광 장치, 노광 방법, 노광 장치의 메인터넌스 방법, 노광 장치의 조정 방법, 및 디바이스 제조 방법
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method
KR20120112615A (ko) * 2009-12-28 2012-10-11 가부시키가이샤 니콘 액침 부재, 액침 부재의 제조 방법, 노광 장치, 및 디바이스 제조 방법
US9223225B2 (en) * 2010-01-08 2015-12-29 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, and device manufacturing method
NL2007439A (en) * 2010-10-19 2012-04-23 Asml Netherlands Bv Gas manifold, module for a lithographic apparatus, lithographic apparatus and device manufacturing method.
US9329496B2 (en) 2011-07-21 2016-05-03 Nikon Corporation Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
US9256137B2 (en) 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
KR102050822B1 (ko) * 2012-12-27 2019-12-02 세메스 주식회사 기판 처리 장치
US9352073B2 (en) 2013-01-22 2016-05-31 Niko Corporation Functional film
US9057955B2 (en) 2013-01-22 2015-06-16 Nikon Corporation Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
JP5979302B2 (ja) 2013-02-28 2016-08-24 株式会社ニコン 摺動膜、摺動膜が形成された部材、及びその製造方法
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JP7194076B2 (ja) * 2019-05-27 2022-12-21 株式会社日立産機システム 油入変圧器
JP7536571B2 (ja) * 2020-09-15 2024-08-20 キオクシア株式会社 位置計測装置及び計測方法
CN116699947B (zh) * 2023-06-02 2025-03-11 浙江大学 光刻设备检测系统及其检测方法

Family Cites Families (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE221563C (cg-RX-API-DMAC7.html)
NL302731A (cg-RX-API-DMAC7.html) 1963-11-21
US3314219A (en) 1965-03-10 1967-04-18 Bass Brothers Entpr Inc Drilling mud degassers for oil wells
US3675395A (en) 1970-10-09 1972-07-11 Keene Corp Apparatus for the purification of oils and the like
US6420721B1 (en) 1975-01-20 2002-07-16 Bae Systems Information And Electronic Systems Integration, Inc. Modulated infrared source
US4315760A (en) 1980-01-17 1982-02-16 Bij De Leij Jan D Method and apparatus for degasing, during transportation, a confined volume of liquid to be measured
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
US4466253A (en) 1982-12-23 1984-08-21 General Electric Company Flow control at flash tank of open cycle vapor compression heat pumps
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
FI73950C (fi) 1985-02-15 1987-12-10 Hackman Ab Oy Foerfarande och anordning vid pumpning och volymmaetning av livsmedelsvaetskor.
CN85104763B (zh) 1985-06-13 1988-08-24 沈汉石 液压系统中消除气穴的方法和装置
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
US4730634A (en) 1986-06-19 1988-03-15 Amoco Corporation Method and apparatus for controlling production of fluids from a well
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JP3246615B2 (ja) 1992-07-27 2002-01-15 株式会社ニコン 照明光学装置、露光装置、及び露光方法
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
US5312552A (en) 1993-02-02 1994-05-17 Norman J M Method and apparatus for removing BTX-type gases from a liquid
JPH06232036A (ja) * 1993-02-04 1994-08-19 Tokyo Ohka Kogyo Co Ltd 液体回収装置及び回収方法
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5545072A (en) 1994-07-27 1996-08-13 Toy Biz, Inc. Image projective toy
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JP3260624B2 (ja) * 1995-04-19 2002-02-25 東京エレクトロン株式会社 塗布装置およびその制御方法
TW306011B (cg-RX-API-DMAC7.html) 1995-04-19 1997-05-21 Tokyo Electron Co Ltd
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
IL130137A (en) 1996-11-28 2003-07-06 Nikon Corp Exposure apparatus and an exposure method
KR100512450B1 (ko) 1996-12-24 2006-01-27 에이에스엠엘 네델란즈 비.브이. 두개의물체홀더를가진이차원적으로안정화된위치설정장치와이런위치설정장치를구비한리소그래픽장치
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
TW490596B (en) 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
US6716268B2 (en) 2000-01-17 2004-04-06 Lattice Intellectual Property Ltd. Slugging control
DE10011130A1 (de) 2000-03-10 2001-09-13 Mannesmann Vdo Ag Entlüftungseinrichtung für einen Kraftstoffbehälter
TW591653B (en) 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
SE517821C2 (sv) 2000-09-29 2002-07-16 Tetra Laval Holdings & Finance Metod och anordning för att kontinuerligt avlufta en vätska
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US20040154641A1 (en) 2002-05-17 2004-08-12 P.C.T. Systems, Inc. Substrate processing apparatus and method
WO2004019128A2 (en) 2002-08-23 2004-03-04 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1420298B1 (en) * 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
JP3953460B2 (ja) 2002-11-12 2007-08-08 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ投影装置
TWI232357B (en) * 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
CN101382738B (zh) 2002-11-12 2011-01-12 Asml荷兰有限公司 光刻投射装置
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP4171886B2 (ja) * 2002-11-29 2008-10-29 セイコーエプソン株式会社 キャリッジ速度制御装置、該キャリッジ速度制御装置を備えた液体噴射装置、キャリッジ速度制御プログラム
CN101424883B (zh) 2002-12-10 2013-05-15 株式会社尼康 曝光设备和器件制造法
JP4168325B2 (ja) 2002-12-10 2008-10-22 ソニー株式会社 高分子アクチュエータ
SG158745A1 (en) 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
AU2003276569A1 (en) 2002-12-13 2004-07-09 Koninklijke Philips Electronics N.V. Liquid removal in a method and device for irradiating spots on a layer
JP4364806B2 (ja) 2002-12-19 2009-11-18 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層上にスポットを照射する方法及び装置
CN1316482C (zh) 2002-12-19 2007-05-16 皇家飞利浦电子股份有限公司 照射层上斑点的方法和装置
TWI591445B (zh) * 2003-02-26 2017-07-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
JP2004310016A (ja) * 2003-03-25 2004-11-04 Tokai Rubber Ind Ltd 半導電性シームレスベルト
EP2950148B1 (en) 2003-04-10 2016-09-21 Nikon Corporation Environmental system including vaccum scavenge for an immersion lithography apparatus
CN101813892B (zh) 2003-04-10 2013-09-25 株式会社尼康 沉浸式光刻装置及使用光刻工艺制造微器件的方法
JP4428115B2 (ja) * 2003-04-11 2010-03-10 株式会社ニコン 液浸リソグラフィシステム
JP2004320016A (ja) * 2003-04-11 2004-11-11 Nikon Corp 液浸リソグラフィシステム
WO2004092917A2 (en) 2003-04-11 2004-10-28 United States Postal Service Methods and systems for providing an alternative delivery point code
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2004356205A (ja) * 2003-05-27 2004-12-16 Tadahiro Omi スキャン型露光装置および露光方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486827B1 (en) * 2003-06-11 2011-11-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317504B2 (en) 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1646075B1 (en) 2003-07-09 2011-06-15 Nikon Corporation Exposure apparatus and device manufacturing method
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
KR101403117B1 (ko) * 2003-07-28 2014-06-03 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법
US7779781B2 (en) * 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4405208B2 (ja) 2003-08-25 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置の製造方法
CN101430508B (zh) 2003-09-03 2011-08-10 株式会社尼康 为浸没光刻提供流体的装置和方法
JP4378136B2 (ja) 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
JP4444920B2 (ja) 2003-09-19 2010-03-31 株式会社ニコン 露光装置及びデバイス製造方法
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
JP2005123258A (ja) * 2003-10-14 2005-05-12 Canon Inc 液浸露光装置
EP1528433B1 (en) 2003-10-28 2019-03-06 ASML Netherlands B.V. Immersion lithographic apparatus and method of operating the same
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP2005175176A (ja) 2003-12-11 2005-06-30 Nikon Corp 露光方法及びデバイス製造方法
WO2005067013A1 (ja) 2004-01-05 2005-07-21 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2005081294A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光装置、液体処理方法、露光方法、及びデバイス製造方法
JP4510494B2 (ja) 2004-03-29 2010-07-21 キヤノン株式会社 露光装置
US7295283B2 (en) * 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101162938B1 (ko) 2004-04-19 2012-07-05 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
EP1747499A2 (en) * 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
KR101264936B1 (ko) 2004-06-04 2013-05-15 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US8373843B2 (en) * 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP4515335B2 (ja) * 2004-06-10 2010-07-28 株式会社ニコン 露光装置、ノズル部材、及びデバイス製造方法
EP3203321A1 (en) * 2004-06-10 2017-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7481867B2 (en) * 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
US7180572B2 (en) 2004-06-23 2007-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion optical projection system
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG124351A1 (en) 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) * 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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