JP4428115B2 - 液浸リソグラフィシステム - Google Patents
液浸リソグラフィシステム Download PDFInfo
- Publication number
- JP4428115B2 JP4428115B2 JP2004113926A JP2004113926A JP4428115B2 JP 4428115 B2 JP4428115 B2 JP 4428115B2 JP 2004113926 A JP2004113926 A JP 2004113926A JP 2004113926 A JP2004113926 A JP 2004113926A JP 4428115 B2 JP4428115 B2 JP 4428115B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- wafer
- immersion lithography
- lithography system
- projection lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
液体の供給を行なう供給口1と液体の回収を行なう回収口2が一つずつリング3に取り付けられている。リング3は投影レンズPLを取り囲むように配置されている。ウエハステージの移動方向が変わると、リング3は光軸周りに回転して、液体の流れを所望の方向に維持する。
2…回収口
3…リング
W…ウエハ
PL…投影レンズ
Claims (1)
- 液浸リソグラフィシステムにおいて、
投影レンズと、
一対の液体供給口と液体回収口とが取り付けられ、前記投影レンズを囲むように配置されたリングとを備え、
ウエハの移動方向が変わったときに、前記リングが回転する液浸リソグラフィシステム。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46206603P | 2003-04-11 | 2003-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004320017A JP2004320017A (ja) | 2004-11-11 |
| JP4428115B2 true JP4428115B2 (ja) | 2010-03-10 |
Family
ID=33490476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004113926A Expired - Fee Related JP4428115B2 (ja) | 2003-04-11 | 2004-04-08 | 液浸リソグラフィシステム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4428115B2 (ja) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2157480B1 (en) | 2003-04-09 | 2015-05-27 | Nikon Corporation | Exposure method and apparatus, and device manufacturing method |
| TWI295414B (en) * | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| TWI609409B (zh) | 2003-10-28 | 2017-12-21 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造方法 |
| TWI519819B (zh) | 2003-11-20 | 2016-02-01 | 尼康股份有限公司 | 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法 |
| TWI494972B (zh) | 2004-02-06 | 2015-08-01 | 尼康股份有限公司 | 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法 |
| US7091502B2 (en) * | 2004-05-12 | 2006-08-15 | Taiwan Semiconductor Manufacturing, Co., Ltd. | Apparatus and method for immersion lithography |
| US8373843B2 (en) | 2004-06-10 | 2013-02-12 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| US8508713B2 (en) | 2004-06-10 | 2013-08-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| SG10201607447RA (en) * | 2004-06-10 | 2016-10-28 | Nikon Corp | Exposure equipment, exposure method and device manufacturing method |
| US8717533B2 (en) | 2004-06-10 | 2014-05-06 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| US7481867B2 (en) | 2004-06-16 | 2009-01-27 | Edwards Limited | Vacuum system for immersion photolithography |
| US7379155B2 (en) | 2004-10-18 | 2008-05-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7161654B2 (en) * | 2004-12-02 | 2007-01-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG124351A1 (en) * | 2005-01-14 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| EP3232270A3 (en) | 2005-05-12 | 2017-12-13 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| US7468779B2 (en) | 2005-06-28 | 2008-12-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| NL1030446C2 (nl) * | 2005-11-16 | 2007-05-21 | Taiwan Semiconductor Mfg | Inrichting en werkwijze voor immersielithografie. |
| FR2893429B1 (fr) * | 2005-11-17 | 2009-05-08 | Taiwan Semiconductor Mfg | Dispositif et procede pour la lithographie par immersion |
| JP5267029B2 (ja) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | 照明光学装置、露光装置及びデバイスの製造方法 |
| US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
| NL1036253A1 (nl) | 2007-12-10 | 2009-06-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| NL2004102A (en) * | 2009-02-25 | 2010-08-26 | Asml Holding Nv | A fluid handling device, an immersion lithographic apparatus and a device manufacturing method. |
-
2004
- 2004-04-08 JP JP2004113926A patent/JP4428115B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004320017A (ja) | 2004-11-11 |
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