JPWO2007105361A1 - 電子部品モジュール - Google Patents
電子部品モジュール Download PDFInfo
- Publication number
- JPWO2007105361A1 JPWO2007105361A1 JP2008504986A JP2008504986A JPWO2007105361A1 JP WO2007105361 A1 JPWO2007105361 A1 JP WO2007105361A1 JP 2008504986 A JP2008504986 A JP 2008504986A JP 2008504986 A JP2008504986 A JP 2008504986A JP WO2007105361 A1 JPWO2007105361 A1 JP WO2007105361A1
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- JP
- Japan
- Prior art keywords
- electronic component
- brazing material
- component module
- module according
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Abstract
Description
Claims (15)
- 第1の主面と、前記第1の主面とは反対側の第2の主面とを有するセラミックス基板と、前記セラミックス基板の前記第1の主面に接合された第1の金属板と、前記セラミックス基板の前記第2の主面に接合された第2の金属板とを備える回路基板と、
前記第1および第2の金属板の少なくとも一方にろう材層を介して接合され、少なくとも125℃で動作可能な電子部品とを具備し、
前記ろう材層は前記電子部品の使用温度より高い融点を有するろう材からなることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記ろう材は前記電子部品の動作環境温度より高い融点を有することを特徴とする電子部品モジュール。 - 請求項2記載の電子部品モジュールにおいて、
前記電子部品の前記動作環境温度は300℃以上であることを特徴とする電子部品モジュール。 - 請求項3記載の電子部品モジュールにおいて、
前記電子部品はSiC半導体素子であることを特徴とする電子部品モジュール。 - 請求項3記載の電子部品モジュールにおいて、
前記電子部品は熱電素子であることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記第1の金属板には複数の前記電子部品が接合されていることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記第2の金属板にはろう材層を介してベース板が接合されていることを特徴とする電子部品モジュール。 - 請求項7記載の電子部品モジュールにおいて、
前記ろう材層は前記電子部品の使用温度より高い融点を有するろう材からなることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記第2の金属板の厚さに対する前記第1の金属板の厚さの比は50%以上200%以下の範囲であることを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記ろう材はAgおよびCuを合計で85質量%以上含有するAg−Cu系ろう材であることを特徴とする電子部品モジュール。 - 請求項10記載の電子部品モジュールにおいて、
前記Ag−Cu系ろう材は、さらにTi、ZrおよびHfから選択される少なくとも1種を1質量%以上5質量%以下の範囲で含有し、残部がSnおよびInから選択される少なくとも1種からなる組成を有することを特徴とする電子部品モジュール。 - 請求項10記載の電子部品モジュールにおいて、
前記Ag−Cu系ろう材は、AgとCuの合計量を100質量部としたとき、Cuの割合が10〜35質量部の範囲の組成を有することを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
前記ろう材はAlを90質量%以上含有するAl系ろう材であることを特徴とする電子部品モジュール。 - 請求項13記載の電子部品モジュールにおいて、
前記Al系ろう材は、さらに希土類元素から選択される少なくとも1種を0.1質量%以上3質量%以下の範囲で含有し、残部がSiからなる組成を有することを特徴とする電子部品モジュール。 - 請求項1記載の電子部品モジュールにおいて、
さらに、前記電子部品が接合された前記回路基板を収容するケースと、前記ケースに設けられた電極と、前記電子部品と前記回路基板とを封止するように前記ケース内に充填された絶縁物質とを具備することを特徴とする電子部品モジュール。
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PCT/JP2007/000169 WO2007105361A1 (ja) | 2006-03-08 | 2007-03-05 | 電子部品モジュール |
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EP (1) | EP2006895B1 (ja) |
JP (2) | JPWO2007105361A1 (ja) |
CN (1) | CN101401197B (ja) |
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- 2007-03-05 US US12/281,856 patent/US8273993B2/en active Active
- 2007-03-05 WO PCT/JP2007/000169 patent/WO2007105361A1/ja active Application Filing
- 2007-03-05 CN CN2007800081204A patent/CN101401197B/zh active Active
- 2007-03-08 TW TW96108042A patent/TWI397979B/zh active
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2012
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- 2012-11-21 JP JP2012255067A patent/JP5656962B2/ja active Active
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Also Published As
Publication number | Publication date |
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WO2007105361A1 (ja) | 2007-09-20 |
US9214617B2 (en) | 2015-12-15 |
TW200802744A (en) | 2008-01-01 |
US20120305304A1 (en) | 2012-12-06 |
CN101401197B (zh) | 2011-05-18 |
CN101401197A (zh) | 2009-04-01 |
JP2013048294A (ja) | 2013-03-07 |
US20090056996A1 (en) | 2009-03-05 |
JP5656962B2 (ja) | 2015-01-21 |
EP2006895B1 (en) | 2019-09-18 |
US8273993B2 (en) | 2012-09-25 |
EP2006895A1 (en) | 2008-12-24 |
EP2006895A4 (en) | 2016-08-10 |
TWI397979B (zh) | 2013-06-01 |
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