JPH05393B2 - - Google Patents

Info

Publication number
JPH05393B2
JPH05393B2 JP1224520A JP22452089A JPH05393B2 JP H05393 B2 JPH05393 B2 JP H05393B2 JP 1224520 A JP1224520 A JP 1224520A JP 22452089 A JP22452089 A JP 22452089A JP H05393 B2 JPH05393 B2 JP H05393B2
Authority
JP
Japan
Prior art keywords
naphthol
resin
general formula
hydrogen atom
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1224520A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0390075A (ja
Inventor
Masashi Kaji
Takanori Aramaki
Tokuhito Nakahara
Yasuji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP1224520A priority Critical patent/JPH0390075A/ja
Priority to US07/575,022 priority patent/US5068293A/en
Priority to EP90309566A priority patent/EP0415790B1/en
Priority to KR1019900013565A priority patent/KR0182263B1/ko
Priority to DE69033049T priority patent/DE69033049T2/de
Publication of JPH0390075A publication Critical patent/JPH0390075A/ja
Publication of JPH05393B2 publication Critical patent/JPH05393B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP1224520A 1989-09-01 1989-09-01 エポキシ樹脂及びその中間体並びにその製造法 Granted JPH0390075A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1224520A JPH0390075A (ja) 1989-09-01 1989-09-01 エポキシ樹脂及びその中間体並びにその製造法
US07/575,022 US5068293A (en) 1989-09-01 1990-08-30 Naphthol-based epoxy resins, intermediates for the same, process for preparing the same, and epoxy resin compositions containing the same
EP90309566A EP0415790B1 (en) 1989-09-01 1990-08-31 Naphthol-based epoxy resins, process for preparing the same, and epoxy resin compositions containing the same
KR1019900013565A KR0182263B1 (ko) 1989-09-01 1990-08-31 나프톨계 에폭시 수지, 그의 중간체와 그의 제조법 및 이러한 나프톨계 에폭시 수지를 함유하는 에폭시 수지 조성물
DE69033049T DE69033049T2 (de) 1989-09-01 1990-08-31 Epoxydharze auf Basis von Naphthol, Verfahren für ihre Herstellung und diese enthaltende Epoxydharzverbindungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1224520A JPH0390075A (ja) 1989-09-01 1989-09-01 エポキシ樹脂及びその中間体並びにその製造法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4212303A Division JP2579405B2 (ja) 1992-07-17 1992-07-17 エポキシ樹脂硬化剤

Publications (2)

Publication Number Publication Date
JPH0390075A JPH0390075A (ja) 1991-04-16
JPH05393B2 true JPH05393B2 (en, 2012) 1993-01-05

Family

ID=16815087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1224520A Granted JPH0390075A (ja) 1989-09-01 1989-09-01 エポキシ樹脂及びその中間体並びにその製造法

Country Status (5)

Country Link
US (1) US5068293A (en, 2012)
EP (1) EP0415790B1 (en, 2012)
JP (1) JPH0390075A (en, 2012)
KR (1) KR0182263B1 (en, 2012)
DE (1) DE69033049T2 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014172923A (ja) * 2013-03-06 2014-09-22 Dic Corp エポキシ樹脂、硬化性樹脂組成物、その硬化物及び半導体封止材料

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190995A (en) * 1990-01-25 1993-03-02 Shin-Etsu Chemical Co., Ltd. Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
JPH06102714B2 (ja) * 1990-06-18 1994-12-14 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO1992001011A1 (en) * 1990-07-10 1992-01-23 Mitsui Toatsu Chemicals, Inc. Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same
JP2690825B2 (ja) * 1990-07-10 1997-12-17 三井東圧化学株式会社 低軟化点ナフトールアラルキル樹脂およびその樹脂を用いたエポキシ樹脂組成物
JPH06102715B2 (ja) * 1990-08-14 1994-12-14 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2780559B2 (ja) * 1991-01-25 1998-07-30 信越化学工業株式会社 アリル基又はプロペニル基を持つナフタレン誘導体
JPH04300914A (ja) * 1991-03-29 1992-10-23 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2526747B2 (ja) * 1991-05-21 1996-08-21 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
US5334674A (en) * 1991-06-19 1994-08-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions
US5223602A (en) * 1992-01-24 1993-06-29 Nippon Steel Chemical Co., Ltd. Naphthol aralkyl resins and cured products thereof
US5780571A (en) * 1993-03-22 1998-07-14 Nippon Kayaku Kabushiki Kaisha Naphthalene ring-containing resins, resin compositions and cured products thereof
JP2797964B2 (ja) * 1994-05-16 1998-09-17 住友金属工業株式会社 半導体封止用エポキシ樹脂硬化剤および組成物
JP2006056969A (ja) * 2004-08-19 2006-03-02 Nippon Steel Chem Co Ltd エポキシ樹脂組成物およびその硬化物
JP5334373B2 (ja) 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
GB2460050A (en) * 2008-05-14 2009-11-18 Hexcel Composites Ltd Epoxy composite
JP5166232B2 (ja) * 2008-12-26 2013-03-21 新日鉄住金化学株式会社 ナフトール樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP5513840B2 (ja) * 2009-10-22 2014-06-04 電気化学工業株式会社 絶縁シート、回路基板及び絶縁シートの製造方法
JP6090765B2 (ja) * 2012-07-02 2017-03-08 日本化薬株式会社 フェノール樹脂、エポキシ樹脂、および硬化性樹脂組成物
WO2016029453A1 (en) * 2014-08-29 2016-03-03 Blue Cube Ip Llc Halogen-free and flame retardant compositions with low thermal expansion for high density printed wiring boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR808248A (fr) * 1934-11-06 1937-02-01 Deutsche Hydrierwerke Ag Procédé de préparation de produits de condensation analogues à des résines
DE1131018B (de) * 1958-08-07 1962-06-07 Basf Ag Verfahren zur Herstellung von Glycidylpolyaethern
US3001972A (en) * 1959-01-26 1961-09-26 Pittsburgh Plate Glass Co Epoxy resins with high heat distortions
US3936510A (en) * 1969-02-17 1976-02-03 Albright & Wilson Limited Cured aromatic resins
US3980877A (en) * 1975-10-01 1976-09-14 General Electric Company Photoflash array with discharge path for electrostatically charged person
GB2003896B (en) * 1977-07-11 1982-01-27 Ciba Geigy Ag Reinforced composites containing a friedel-crafts resin
JPS59230017A (ja) * 1983-05-25 1984-12-24 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テル及びその製法
JPS60237081A (ja) * 1984-05-10 1985-11-25 Agency Of Ind Science & Technol 新規ポリグリシジルエ−テル及びその製法
JPS6115882A (ja) * 1984-07-02 1986-01-23 Hokuriku Seiyaku Co Ltd Ｎ−アシル−２，６−キシリジン誘導体
JPS6220206A (ja) * 1985-07-18 1987-01-28 アルプス電気株式会社 押ボタンスイツチとその製造方法
JPH0753790B2 (ja) * 1987-03-26 1995-06-07 三井東圧化学株式会社 エポキシ樹脂組成物およびその製造方法
US4908424A (en) * 1987-10-09 1990-03-13 Shell Oil Company Bis-anthrols and bis-naphthols and diglycidyl ethers thereof
JP2926733B2 (ja) * 1988-02-26 1999-07-28 住金ケミカル株式会社 熱硬化性樹脂ならびにその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014172923A (ja) * 2013-03-06 2014-09-22 Dic Corp エポキシ樹脂、硬化性樹脂組成物、その硬化物及び半導体封止材料

Also Published As

Publication number Publication date
KR0182263B1 (ko) 1999-05-15
JPH0390075A (ja) 1991-04-16
EP0415790A2 (en) 1991-03-06
DE69033049T2 (de) 1999-09-09
US5068293A (en) 1991-11-26
KR910006365A (ko) 1991-04-29
DE69033049D1 (de) 1999-05-20
EP0415790A3 (en) 1992-04-29
EP0415790B1 (en) 1999-04-14

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