KR910006365A - 나프톨계 에폭시 수지, 그의 중간체와 그의 제조법 및 이러한 나프톨계 에폭시 수지를 함유하는 에폭시 수지 조성물 - Google Patents
나프톨계 에폭시 수지, 그의 중간체와 그의 제조법 및 이러한 나프톨계 에폭시 수지를 함유하는 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR910006365A KR910006365A KR1019900013565A KR900013565A KR910006365A KR 910006365 A KR910006365 A KR 910006365A KR 1019900013565 A KR1019900013565 A KR 1019900013565A KR 900013565 A KR900013565 A KR 900013565A KR 910006365 A KR910006365 A KR 910006365A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- naphthol
- hydrogen atom
- type epoxy
- naphthol type
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Epoxy Resins (AREA)
- Epoxy Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (4)
- 하기 일반식(Ⅰ)(단, 식중 A는 나플탈렌핵을 나타내고, R은 수소원자 또는 메틸기를 나타내고, n은 0-15의 정수를 나타낸다)로 표현되는 나프톨계 에폭시 수지.
- 하기 일반식(Ⅱ)(단, 식중 A는 나플탈렌핵을 나타내며, R은 수소원자 또는 메틸기를 나타내고, n은 0-15의 정수를 나타낸다)로 표현되는 나프톨아르알킬 수지.
- 나프톨 1몰과, 이 나프톨에 대해서 0.1-0.9몰의 하기 일반식(Ⅲ)(단, 식중 R은 수소원자 또는 메틸기를 나타내고, R´은 수소원자 또는 탄소수 1-4의 탄화수소기를 나타낸다)으로 표현되는 축합제를 반응시켜서 하기 일반식(Ⅱ)(단, 식중 A는 나플탈렌핵을 나타내고, R은 수소원자 또는 메틸기를 나타내며, n은 0-15의 정수를 나타낸다)로 표현되는 나프톨아르알킬 수지를 제조하고, 그 다음에 이 나프톨아르알킬 수지를 에피클로로히드린과 반응시키는 것을 특징으로 하는 나프톨계 에폭시 수지의 제조 방법.
- 적어도 하기 (a), (b) 및 (c)의 배합성분, 즉 (a)하기 일반식(Ⅰ),(단, 식중 A는 나플탈렌핵을 나타내고, R은 수소원자 또는 메틸기를 나타내고, n은 0-15의 정수를 나타낸다)로 표현되는 나프톨계 에폭시 수지, (b)경화제 및 (c)겨오하촉진제를 함유하는 것을 특징으로 하는 에폭시 수지 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1224520A JPH0390075A (ja) | 1989-09-01 | 1989-09-01 | エポキシ樹脂及びその中間体並びにその製造法 |
JP1-224520 | 1989-09-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910006365A true KR910006365A (ko) | 1991-04-29 |
KR0182263B1 KR0182263B1 (ko) | 1999-05-15 |
Family
ID=16815087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900013565A KR0182263B1 (ko) | 1989-09-01 | 1990-08-31 | 나프톨계 에폭시 수지, 그의 중간체와 그의 제조법 및 이러한 나프톨계 에폭시 수지를 함유하는 에폭시 수지 조성물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5068293A (ko) |
EP (1) | EP0415790B1 (ko) |
JP (1) | JPH0390075A (ko) |
KR (1) | KR0182263B1 (ko) |
DE (1) | DE69033049T2 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190995A (en) * | 1990-01-25 | 1993-03-02 | Shin-Etsu Chemical Co., Ltd. | Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith |
JPH06102714B2 (ja) * | 1990-06-18 | 1994-12-14 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
EP0491045A4 (en) * | 1990-07-10 | 1992-11-25 | Mitsui Toatsu Chemicals, Inc. | Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same |
JP2690825B2 (ja) * | 1990-07-10 | 1997-12-17 | 三井東圧化学株式会社 | 低軟化点ナフトールアラルキル樹脂およびその樹脂を用いたエポキシ樹脂組成物 |
JPH06102715B2 (ja) * | 1990-08-14 | 1994-12-14 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2780559B2 (ja) * | 1991-01-25 | 1998-07-30 | 信越化学工業株式会社 | アリル基又はプロペニル基を持つナフタレン誘導体 |
JPH04300914A (ja) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2526747B2 (ja) * | 1991-05-21 | 1996-08-21 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
US5334674A (en) * | 1991-06-19 | 1994-08-02 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions |
US5223602A (en) * | 1992-01-24 | 1993-06-29 | Nippon Steel Chemical Co., Ltd. | Naphthol aralkyl resins and cured products thereof |
US5780571A (en) * | 1993-03-22 | 1998-07-14 | Nippon Kayaku Kabushiki Kaisha | Naphthalene ring-containing resins, resin compositions and cured products thereof |
JP2797964B2 (ja) * | 1994-05-16 | 1998-09-17 | 住友金属工業株式会社 | 半導体封止用エポキシ樹脂硬化剤および組成物 |
JP2006056969A (ja) * | 2004-08-19 | 2006-03-02 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物およびその硬化物 |
JP5334373B2 (ja) | 2007-03-05 | 2013-11-06 | 新日鉄住金化学株式会社 | 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物 |
GB2460050A (en) * | 2008-05-14 | 2009-11-18 | Hexcel Composites Ltd | Epoxy composite |
JP5166232B2 (ja) * | 2008-12-26 | 2013-03-21 | 新日鉄住金化学株式会社 | ナフトール樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
JP5513840B2 (ja) * | 2009-10-22 | 2014-06-04 | 電気化学工業株式会社 | 絶縁シート、回路基板及び絶縁シートの製造方法 |
JP6090765B2 (ja) * | 2012-07-02 | 2017-03-08 | 日本化薬株式会社 | フェノール樹脂、エポキシ樹脂、および硬化性樹脂組成物 |
JP6065215B2 (ja) * | 2013-03-06 | 2017-01-25 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物、その硬化物及び半導体封止材料 |
WO2016029453A1 (en) * | 2014-08-29 | 2016-03-03 | Blue Cube Ip Llc | Halogen-free and flame retardant compositions with low thermal expansion for high density printed wiring boards |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR808248A (fr) * | 1934-11-06 | 1937-02-01 | Deutsche Hydrierwerke Ag | Procédé de préparation de produits de condensation analogues à des résines |
DE1131018B (de) * | 1958-08-07 | 1962-06-07 | Basf Ag | Verfahren zur Herstellung von Glycidylpolyaethern |
US3001972A (en) * | 1959-01-26 | 1961-09-26 | Pittsburgh Plate Glass Co | Epoxy resins with high heat distortions |
US3936510A (en) * | 1969-02-17 | 1976-02-03 | Albright & Wilson Limited | Cured aromatic resins |
US3980877A (en) * | 1975-10-01 | 1976-09-14 | General Electric Company | Photoflash array with discharge path for electrostatically charged person |
GB2003896B (en) * | 1977-07-11 | 1982-01-27 | Ciba Geigy Ag | Reinforced composites containing a friedel-crafts resin |
JPS59230017A (ja) * | 1983-05-25 | 1984-12-24 | Agency Of Ind Science & Technol | 新規ポリグリシジルエ−テル及びその製法 |
JPS60237081A (ja) * | 1984-05-10 | 1985-11-25 | Agency Of Ind Science & Technol | 新規ポリグリシジルエ−テル及びその製法 |
JPS6115882A (ja) * | 1984-07-02 | 1986-01-23 | Hokuriku Seiyaku Co Ltd | N−アシル−2,6−キシリジン誘導体 |
JPS6220206A (ja) * | 1985-07-18 | 1987-01-28 | アルプス電気株式会社 | 押ボタンスイツチとその製造方法 |
JPH0753790B2 (ja) * | 1987-03-26 | 1995-06-07 | 三井東圧化学株式会社 | エポキシ樹脂組成物およびその製造方法 |
US4908424A (en) * | 1987-10-09 | 1990-03-13 | Shell Oil Company | Bis-anthrols and bis-naphthols and diglycidyl ethers thereof |
JP2926733B2 (ja) * | 1988-02-26 | 1999-07-28 | 住金ケミカル株式会社 | 熱硬化性樹脂ならびにその製造方法 |
-
1989
- 1989-09-01 JP JP1224520A patent/JPH0390075A/ja active Granted
-
1990
- 1990-08-30 US US07/575,022 patent/US5068293A/en not_active Expired - Lifetime
- 1990-08-31 EP EP90309566A patent/EP0415790B1/en not_active Expired - Lifetime
- 1990-08-31 DE DE69033049T patent/DE69033049T2/de not_active Expired - Lifetime
- 1990-08-31 KR KR1019900013565A patent/KR0182263B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0182263B1 (ko) | 1999-05-15 |
EP0415790A2 (en) | 1991-03-06 |
DE69033049D1 (de) | 1999-05-20 |
DE69033049T2 (de) | 1999-09-09 |
JPH0390075A (ja) | 1991-04-16 |
JPH05393B2 (ko) | 1993-01-05 |
US5068293A (en) | 1991-11-26 |
EP0415790B1 (en) | 1999-04-14 |
EP0415790A3 (en) | 1992-04-29 |
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