JPH0231516B2 - - Google Patents

Info

Publication number
JPH0231516B2
JPH0231516B2 JP57039921A JP3992182A JPH0231516B2 JP H0231516 B2 JPH0231516 B2 JP H0231516B2 JP 57039921 A JP57039921 A JP 57039921A JP 3992182 A JP3992182 A JP 3992182A JP H0231516 B2 JPH0231516 B2 JP H0231516B2
Authority
JP
Japan
Prior art keywords
aminophenoxy
minutes
adhesive
film
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57039921A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58157190A (ja
Inventor
Yasuo Myadera
Masatoshi Yoshida
Susumu Koarai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP3992182A priority Critical patent/JPS58157190A/ja
Publication of JPS58157190A publication Critical patent/JPS58157190A/ja
Publication of JPH0231516B2 publication Critical patent/JPH0231516B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structure Of Printed Boards (AREA)
JP3992182A 1982-03-12 1982-03-12 フレキシブル印刷回路用基板の製造法 Granted JPS58157190A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3992182A JPS58157190A (ja) 1982-03-12 1982-03-12 フレキシブル印刷回路用基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3992182A JPS58157190A (ja) 1982-03-12 1982-03-12 フレキシブル印刷回路用基板の製造法

Publications (2)

Publication Number Publication Date
JPS58157190A JPS58157190A (ja) 1983-09-19
JPH0231516B2 true JPH0231516B2 (enExample) 1990-07-13

Family

ID=12566395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3992182A Granted JPS58157190A (ja) 1982-03-12 1982-03-12 フレキシブル印刷回路用基板の製造法

Country Status (1)

Country Link
JP (1) JPS58157190A (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JP2615002B2 (ja) * 1984-10-15 1997-05-28 三井東圧化学株式会社 ポリイミドフィルムからなる耐熱性接着剤
JP2610804B2 (ja) * 1984-10-15 1997-05-14 三井東圧化学株式会社 ポリイミドフィルムからなる耐熱性接着剤
JP2533841B2 (ja) * 1984-12-18 1996-09-11 三井東圧化学株式会社 耐熱性接着剤
US4883718A (en) * 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
JPS627733A (ja) * 1985-03-10 1987-01-14 Nitto Electric Ind Co Ltd 無色透明なポリイミド成形体およびその製法
US4725642A (en) * 1985-04-29 1988-02-16 E. I. Du Pont De Nemours And Company Melt-fusible co-polyimide from diamine mixture
JPS61291669A (ja) * 1985-06-18 1986-12-22 Mitsui Toatsu Chem Inc 耐熱性接着剤
JPH0678431B2 (ja) * 1985-07-15 1994-10-05 三菱油化株式会社 芳香族チオエ−テルイミド重合体
JP2587810B2 (ja) * 1985-10-11 1997-03-05 三井東圧化学株式会社 ポリイミドよりなる耐熱性接着剤
US5278276A (en) * 1985-08-27 1994-01-11 Mitsui Toatsu Chemicals, Incorporated Polyimide and high-temperature adhesive of polyimide
JPS6248782A (ja) * 1985-08-27 1987-03-03 Mitsui Toatsu Chem Inc 耐熱性接着剤
DE3650656T2 (de) * 1985-08-27 1998-04-30 Mitsui Toatsu Chemicals Polyimide und diese enthaltende hitzebeständige klebemittel
DE3682549D1 (de) * 1985-08-30 1992-01-02 Gen Electric Kristalline polyimide mit kumulierten phenylensulfid-einheiten.
US4716216A (en) * 1985-08-30 1987-12-29 General Electric Company Crystalline polyimides containing cumulative phenylene sulfide units
JPS6253388A (ja) * 1985-09-03 1987-03-09 Mitsui Toatsu Chem Inc 耐熱性接着剤
JP2567375B2 (ja) * 1986-02-13 1996-12-25 三井東圧化学株式会社 無色ポリイミドフイルム
DE3783477T2 (de) * 1986-02-25 1993-06-17 Mitsui Toatsu Chemicals Hochtemperatur-polyimidklebstoff.
JPS63130633A (ja) * 1986-11-20 1988-06-02 Kanegafuchi Chem Ind Co Ltd 新規なポリアミド酸及びポリイミドの製造法
JP2519228B2 (ja) * 1987-01-08 1996-07-31 日東電工株式会社 無色透明ポリイミド成形体およびその製法
JPS64121A (en) * 1987-02-13 1989-01-05 New Japan Chem Co Ltd Polyimide resin composition and its production
JPH0195155A (ja) * 1987-10-05 1989-04-13 Mitsubishi Kasei Corp ポリイミド樹脂組成物
JP2553110B2 (ja) * 1987-11-16 1996-11-13 三井東圧化学株式会社 成形加工性良好なポリイミドの製造方法
JP2866654B2 (ja) * 1988-04-20 1999-03-08 日立化成工業株式会社 ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板
JPH0721442B2 (ja) * 1989-03-27 1995-03-08 日本電信電話株式会社 電子顕微鏡検体調整法及び電子顕微鏡検体調整器具
JP2890408B2 (ja) * 1988-05-10 1999-05-17 日立化成工業株式会社 ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板
JPH0260934A (ja) * 1988-06-28 1990-03-01 Amoco Corp 中間層絶縁体および基板被膜用の低誘電率、低水分吸収ポリイミドおよびコポリイミド
JP2536620B2 (ja) * 1989-05-31 1996-09-18 信越化学工業株式会社 ポリイミド樹脂の製造方法
JP2536628B2 (ja) * 1989-08-02 1996-09-18 信越化学工業株式会社 半導体素子保護用組成物
JP2785394B2 (ja) * 1989-11-24 1998-08-13 宇部興産株式会社 熱可塑性芳香族ポリイミド
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
JPH05117596A (ja) * 1991-10-29 1993-05-14 Sumitomo Bakelite Co Ltd 熱圧着可能な高熱伝導性フイルム状接着剤
JPH05125332A (ja) * 1991-11-01 1993-05-21 Sumitomo Bakelite Co Ltd 熱圧着可能な導電性フイルム状接着剤
JPH05331424A (ja) * 1992-06-04 1993-12-14 Sumitomo Bakelite Co Ltd フィルム接着剤
JP2672477B2 (ja) * 1995-03-20 1997-11-05 三井東圧化学株式会社 ポリイミド樹脂用組成物
JP2672476B2 (ja) * 1995-03-20 1997-11-05 三井東圧化学株式会社 ポリイミド樹脂組成物
JP2593634B2 (ja) * 1995-03-20 1997-03-26 三井東圧化学株式会社 新規ポリイミド樹脂組成物
JP2593635B2 (ja) * 1995-03-20 1997-03-26 三井東圧化学株式会社 ポリイミド樹脂の組成物
JP2593636B2 (ja) * 1995-04-17 1997-03-26 三井東圧化学株式会社 ポリイミド樹脂組成物
JPH08225645A (ja) * 1995-12-18 1996-09-03 Nitto Denko Corp 無色透明なポリイミド成形体およびその製法
JP2764392B2 (ja) * 1996-01-24 1998-06-11 三井化学株式会社 溶融成形用ポリイミドの製造方法
JP2769497B2 (ja) * 1996-03-08 1998-06-25 三井化学株式会社 溶融成形用ポリイミドの製造方法
KR100335663B1 (ko) 1999-10-19 2002-05-06 윤종용 테입리스 ｌｏｃ 패키징용 폴리(이미드-실록산) 화합물

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH621768A5 (enExample) * 1976-06-15 1981-02-27 Ciba Geigy Ag
JPS5518426A (en) * 1978-07-27 1980-02-08 Asahi Chem Ind Co Ltd Heat-resistant flexible electronic parts

Also Published As

Publication number Publication date
JPS58157190A (ja) 1983-09-19

Similar Documents

Publication Publication Date Title
JPH0231516B2 (enExample)
JP5293182B2 (ja) 熱硬化性ポリイミド樹脂組成物
JP2943953B2 (ja) 耐熱性接着剤
JP2952868B2 (ja) 耐熱性の接着剤
CN105367794A (zh) 可溶性热塑性聚酰亚胺组合物及由其制成的积层板
KR900003810B1 (ko) 플렉시블 프린트회로 기판 및 그 제법
JPH0332919B2 (enExample)
KR20070034007A (ko) 폴리이미드 적층체 및 그의 제조 방법
KR100852943B1 (ko) 플랙시블 금속박 폴리이미드 적층판의 제조방법
JPH02115265A (ja) 耐熱性フイルムおよびその積層物
JP4925619B2 (ja) ポリイミド樹脂およびそれを用いた導体付きフィルム
JP3039818B2 (ja) 耐熱性の接着剤
JPS62104840A (ja) フレキシブルプリント回路基板の製造法
JPS645475B2 (enExample)
JP2834544B2 (ja) カバーレイ用接着剤
JP2729063B2 (ja) フレキシブル金属箔積層板の製造方法
JPH0423879A (ja) 耐熱性イミド接着剤
JP3031027B2 (ja) 耐熱性接着剤組成物
WO2005084088A1 (ja) 配線基板用積層体
JP2668752B2 (ja) 耐熱性接着剤
JPH0446983A (ja) ポリイミド系接着剤
JP2870114B2 (ja) 耐熱性の接着剤
JPH04153224A (ja) 両面フレキシブルプリント回路基板用樹脂。
JP2001139807A (ja) 耐熱性ボンディングシートの製造方法
JP3063928B2 (ja) 耐熱性接着剤組成物