JPS64121A - Polyimide resin composition and its production - Google Patents

Polyimide resin composition and its production

Info

Publication number
JPS64121A
JPS64121A JP3159188A JP3159188A JPS64121A JP S64121 A JPS64121 A JP S64121A JP 3159188 A JP3159188 A JP 3159188A JP 3159188 A JP3159188 A JP 3159188A JP S64121 A JPS64121 A JP S64121A
Authority
JP
Japan
Prior art keywords
formula
group
polyimide
solvent
polyamic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3159188A
Other languages
Japanese (ja)
Other versions
JPH01121A (en
Inventor
Tsuyoshi Ikeda
Hiroshi Sanami
Mikiro Nakazawa
Yuji Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Chemical Co Ltd
Original Assignee
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Chemical Co Ltd filed Critical New Japan Chemical Co Ltd
Priority to JP63-31591A priority Critical patent/JPH01121A/en
Priority claimed from JP63-31591A external-priority patent/JPH01121A/en
Publication of JPS64121A publication Critical patent/JPS64121A/en
Publication of JPH01121A publication Critical patent/JPH01121A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

PURPOSE: To produce the title composition excellent in heat resistance, mechanical and electrical properties and adhesion to a substrate, by dissolving a specified polyimide in an organic solvent.
CONSTITUTION: A polyamic acid is obtained by reacting diphenyl sulfone-3,3',4,4'- tetracarboxylic dianhydride with an aromatic diamine of formula I (wherein Z is -S-, a group of any one of formulas IIWIV, X is -O-, -S- a group of formula V, Y is a bivalent group selected from among a single bond, -O-, -S-, -SO2-, -CO- and a group of formula V, R1W2 are each H, a halogen or a 1W5C alkyl which may be substituted by a halogen atom at 0W120°C for 0.5W50hr at a molar ratio of 0.7W1.3 in an aprotic polar solvent and/or a phenolic solvent. This polyamic acid is imidated at 60W250°C for 0.5W50hr in an aprotic polar solvent and/or a phenolic solvent to obtain a polyimide having repeating units of formula VI and an intrinsic viscosity of 0.3W5.0dl/g. 1W50wt.% this polyimide and 0.1W20wt.% silane coupling agent are dissolved in an organic solvent.
COPYRIGHT: (C)1989,JPO&Japio
JP63-31591A 1987-02-13 1988-02-13 Polyimide resin composition and its manufacturing method Pending JPH01121A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63-31591A JPH01121A (en) 1987-02-13 1988-02-13 Polyimide resin composition and its manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-32030 1987-02-13
JP3203087 1987-02-13
JP63-31591A JPH01121A (en) 1987-02-13 1988-02-13 Polyimide resin composition and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS64121A true JPS64121A (en) 1989-01-05
JPH01121A JPH01121A (en) 1989-01-05

Family

ID=

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165624A (en) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPH02227460A (en) * 1988-12-30 1990-09-10 Amoco Corp Miscible composition of imido-containing polymer and poly (arylsulfone)
EP0518571A2 (en) * 1991-06-14 1992-12-16 MITSUI TOATSU CHEMICALS, Inc. Favorably processable polyimide and process for preparing polyimide
JPH05186590A (en) * 1991-06-14 1993-07-27 Mitsui Toatsu Chem Inc Polyimide excellent in moldability and its production
US5668695A (en) * 1995-03-03 1997-09-16 International Business Machines Corp. Portable computer utilizable by an over head projector and tilting mechanism thereof
JPH1045910A (en) * 1996-08-01 1998-02-17 New Japan Chem Co Ltd Polyimide resin and its production
US5768095A (en) * 1995-03-03 1998-06-16 International Business Machines Corp. Portable computer having overhead projection capability and back lid portion with switch controlling backlight
WO2007061005A1 (en) * 2005-11-22 2007-05-31 Showa Denko K.K. Solid electrolytic capacitor, method for manufacturing same, and base for solid electrolytic capacitor
JP2009067939A (en) * 2007-09-14 2009-04-02 Tokyo Institute Of Technology Polyamic acid and imidized polymer
WO2016024457A1 (en) * 2014-08-12 2016-02-18 株式会社カネカ Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
JP2016066053A (en) * 2014-09-19 2016-04-28 株式会社ジャパンディスプレイ Liquid crystal display device and material for alignment film
US9964490B2 (en) 2006-01-24 2018-05-08 Life Technologies Corporation Device and methods for quantifying analytes
US10435510B2 (en) 2013-02-07 2019-10-08 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230319A (en) * 1975-09-04 1977-03-08 Nippon Hoso Kyokai <Nhk> Compensation circuit of digital type gamma
JPS54149759A (en) * 1978-05-16 1979-11-24 Asahi Chem Ind Co Ltd Particulate material-containing polyimide composition
JPS58157190A (en) * 1982-03-12 1983-09-19 日立化成工業株式会社 Method of producing substrate for flexible printed circuit
JPS59179651A (en) * 1983-03-31 1984-10-12 Nitto Electric Ind Co Ltd Heat-resistant, electrically conductive paste composition
JPS60210661A (en) * 1984-04-04 1985-10-23 Mitsubishi Chem Ind Ltd Polyimide resin composition
JPS6153357A (en) * 1984-08-22 1986-03-17 Toray Ind Inc Molding resin composition
JPS61171762A (en) * 1985-01-28 1986-08-02 Japan Synthetic Rubber Co Ltd Soluble polyimide resin composition
JPS6232030A (en) * 1985-08-02 1987-02-12 Nippon Petrochem Co Ltd Method for molding polyethylene sheet with ultra-high molecular weight
JPS62116668A (en) * 1985-11-18 1987-05-28 Toshiba Chem Corp Resin composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5230319A (en) * 1975-09-04 1977-03-08 Nippon Hoso Kyokai <Nhk> Compensation circuit of digital type gamma
JPS54149759A (en) * 1978-05-16 1979-11-24 Asahi Chem Ind Co Ltd Particulate material-containing polyimide composition
JPS58157190A (en) * 1982-03-12 1983-09-19 日立化成工業株式会社 Method of producing substrate for flexible printed circuit
JPS59179651A (en) * 1983-03-31 1984-10-12 Nitto Electric Ind Co Ltd Heat-resistant, electrically conductive paste composition
JPS60210661A (en) * 1984-04-04 1985-10-23 Mitsubishi Chem Ind Ltd Polyimide resin composition
JPS6153357A (en) * 1984-08-22 1986-03-17 Toray Ind Inc Molding resin composition
JPS61171762A (en) * 1985-01-28 1986-08-02 Japan Synthetic Rubber Co Ltd Soluble polyimide resin composition
JPS6232030A (en) * 1985-08-02 1987-02-12 Nippon Petrochem Co Ltd Method for molding polyethylene sheet with ultra-high molecular weight
JPS62116668A (en) * 1985-11-18 1987-05-28 Toshiba Chem Corp Resin composition

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01165624A (en) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd Production of heat-resistant resin
JPH02227460A (en) * 1988-12-30 1990-09-10 Amoco Corp Miscible composition of imido-containing polymer and poly (arylsulfone)
EP0518571A2 (en) * 1991-06-14 1992-12-16 MITSUI TOATSU CHEMICALS, Inc. Favorably processable polyimide and process for preparing polyimide
JPH05186590A (en) * 1991-06-14 1993-07-27 Mitsui Toatsu Chem Inc Polyimide excellent in moldability and its production
US5768095A (en) * 1995-03-03 1998-06-16 International Business Machines Corp. Portable computer having overhead projection capability and back lid portion with switch controlling backlight
US5668695A (en) * 1995-03-03 1997-09-16 International Business Machines Corp. Portable computer utilizable by an over head projector and tilting mechanism thereof
JPH1045910A (en) * 1996-08-01 1998-02-17 New Japan Chem Co Ltd Polyimide resin and its production
WO2007061005A1 (en) * 2005-11-22 2007-05-31 Showa Denko K.K. Solid electrolytic capacitor, method for manufacturing same, and base for solid electrolytic capacitor
JP4905358B2 (en) * 2005-11-22 2012-03-28 株式会社村田製作所 Solid electrolytic capacitor, process for producing the same, and substrate for solid electrolytic capacitor
US11635383B2 (en) 2006-01-24 2023-04-25 Life Technologies Corporation Device and methods for quantifying analytes introduction
US10962480B2 (en) 2006-01-24 2021-03-30 Life Technologies Corporation Device and methods for quantifying analytes introduction
US10533946B2 (en) 2006-01-24 2020-01-14 Life Technologies Corporation Device and methods for quantifying analytes
US9964490B2 (en) 2006-01-24 2018-05-08 Life Technologies Corporation Device and methods for quantifying analytes
JP2009067939A (en) * 2007-09-14 2009-04-02 Tokyo Institute Of Technology Polyamic acid and imidized polymer
US10435510B2 (en) 2013-02-07 2019-10-08 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate
US10626218B2 (en) 2013-02-07 2020-04-21 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate
US10308767B2 (en) 2014-08-12 2019-06-04 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
JPWO2016024457A1 (en) * 2014-08-12 2017-05-25 株式会社カネカ Alkoxysilane-modified polyamic acid solution, laminate and flexible device using the same, and method for producing laminate
JP2020114919A (en) * 2014-08-12 2020-07-30 株式会社カネカ Method for manufacturing alkoxysilane-modified polyamic acid solution, laminate manufacturing method, and flexible device manufacturing method
WO2016024457A1 (en) * 2014-08-12 2016-02-18 株式会社カネカ Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
JP2016066053A (en) * 2014-09-19 2016-04-28 株式会社ジャパンディスプレイ Liquid crystal display device and material for alignment film

Similar Documents

Publication Publication Date Title
US3856752A (en) Soluble polyimides derived from phenylindane diamines and dianhydrides
Yang et al. Synthesis and properties of novel aromatic polyimides of 2, 3-bis (4-aminophenoxy) naphthalene
US4558110A (en) Crystalline silicone-imide copolymers
US7193030B2 (en) Acid anhydride and polyimide using the same
EP0267289A4 (en) Polyimide resin composition.
US5061784A (en) Polymers prepared from 4,4&#39;-bis(3,4-dicarboxyphenyl) hexafluoroisopropyl) diphenyl dianhydride
US4716216A (en) Crystalline polyimides containing cumulative phenylene sulfide units
JPS57143328A (en) Production of siloxane-modified polyimide precursor
EP0213573B1 (en) Crystalline polyimides containing cumulative phenylene sulfide units
US4338426A (en) Intermediate, copolymer resin and production thereof
US4831102A (en) Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine
US5587452A (en) Polyamide-imide
KR19980079256A (en) Polyimide precursor solution, preparation method thereof, film or film obtained from such solution and preparation method of film
JPS5827721A (en) Preparation of polyamide acid silicone intermediate and polyimide silicone copolymeric resin
JPS646025A (en) Production of silicon-containing polyimide having low thermal expansion and high adhesivity and precursor thereof
JPS64121A (en) Polyimide resin composition and its production
EP0398205B1 (en) Polyimides and co-polyimides based on dioxydiphthalic anhydride
US5608013A (en) Polyimides and thermosetting resin compositions containing the same
US4978742A (en) Polymers prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane
JPS5742732A (en) Production of polyamido acid silicone type intermediate and polyimidoisoindoloquinazolinedione/silicone copolymer resin
US5194579A (en) Fluorine-containing polyamide acid and polyamide
DE3615039A1 (en) POLYAMIDE CARBONIC ACIDS, POLYIMIDES PRODUCED THEREOF AND METHOD FOR THE PRODUCTION OF HIGH-TEMPERATURE-RESISTANT LAYERS
US5101006A (en) Polyimides and copolyimides based on halo-oxydiphthalic anhydrides
US4965339A (en) Method of preparing soluble aromatic polyimides and varnish compositions using same
JPH05112644A (en) Polyimide precursor, its cured polyimide and its production