JPS58157190A - フレキシブル印刷回路用基板の製造法 - Google Patents
フレキシブル印刷回路用基板の製造法Info
- Publication number
- JPS58157190A JPS58157190A JP3992182A JP3992182A JPS58157190A JP S58157190 A JPS58157190 A JP S58157190A JP 3992182 A JP3992182 A JP 3992182A JP 3992182 A JP3992182 A JP 3992182A JP S58157190 A JPS58157190 A JP S58157190A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- minutes
- producing substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 title 1
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 150000000000 tetracarboxylic acids Chemical group 0.000 claims description 2
- 125000004427 diamine group Chemical group 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 4
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- PPKPKFIWDXDAGC-IHWYPQMZSA-N (z)-1,2-dichloroprop-1-ene Chemical compound C\C(Cl)=C\Cl PPKPKFIWDXDAGC-IHWYPQMZSA-N 0.000 description 1
- NUMXHEUHHRTBQT-AATRIKPKSA-N 2,4-dimethoxy-1-[(e)-2-nitroethenyl]benzene Chemical compound COC1=CC=C(\C=C\[N+]([O-])=O)C(OC)=C1 NUMXHEUHHRTBQT-AATRIKPKSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- PPDFQRAASCRJAH-UHFFFAOYSA-N 2-methylthiolane 1,1-dioxide Chemical compound CC1CCCS1(=O)=O PPDFQRAASCRJAH-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100029133 DNA damage-induced apoptosis suppressor protein Human genes 0.000 description 1
- 241000283074 Equus asinus Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101000918646 Homo sapiens DNA damage-induced apoptosis suppressor protein Proteins 0.000 description 1
- 241001436793 Meru Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- -1 Tetracarboxylic anhydride Chemical class 0.000 description 1
- 241000190021 Zelkova Species 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- RJIWZDNTCBHXAL-UHFFFAOYSA-N nitroxoline Chemical compound C1=CN=C2C(O)=CC=C([N+]([O-])=O)C2=C1 RJIWZDNTCBHXAL-UHFFFAOYSA-N 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- QQBPIHBUCMDKFG-UHFFFAOYSA-N phenazopyridine hydrochloride Chemical compound Cl.NC1=NC(N)=CC=C1N=NC1=CC=CC=C1 QQBPIHBUCMDKFG-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3992182A JPS58157190A (ja) | 1982-03-12 | 1982-03-12 | フレキシブル印刷回路用基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3992182A JPS58157190A (ja) | 1982-03-12 | 1982-03-12 | フレキシブル印刷回路用基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58157190A true JPS58157190A (ja) | 1983-09-19 |
| JPH0231516B2 JPH0231516B2 (enExample) | 1990-07-13 |
Family
ID=12566395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3992182A Granted JPS58157190A (ja) | 1982-03-12 | 1982-03-12 | フレキシブル印刷回路用基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58157190A (enExample) |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60243120A (ja) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
| JPS6195031A (ja) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | ポリイミドフイルムの製造方法 |
| JPS6195030A (ja) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | ポリイミドフイルムの製造方法 |
| JPS61143478A (ja) * | 1984-12-18 | 1986-07-01 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| JPS61250031A (ja) * | 1985-04-29 | 1986-11-07 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | 熔融可能なポリイミド共重合体 |
| JPS61291669A (ja) * | 1985-06-18 | 1986-12-22 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| JPS627733A (ja) * | 1985-03-10 | 1987-01-14 | Nitto Electric Ind Co Ltd | 無色透明なポリイミド成形体およびその製法 |
| JPS6215228A (ja) * | 1985-07-15 | 1987-01-23 | Mitsubishi Petrochem Co Ltd | 芳香族チオエ−テルイミド重合体 |
| JPS6248782A (ja) * | 1985-08-27 | 1987-03-03 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| WO1987001378A1 (fr) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides et adhesifs thermoresistants les contenant |
| JPS6284124A (ja) * | 1985-08-30 | 1987-04-17 | ゼネラル・エレクトリツク・カンパニイ | 累積フエニレンスルフイド単位を含有する結晶性ポリイミド |
| JPS6286021A (ja) * | 1985-10-11 | 1987-04-20 | Mitsui Toatsu Chem Inc | ポリイミドよりなる耐熱性接着剤 |
| JPS62185715A (ja) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | 無色ポリイミドフイルム |
| JPS63130633A (ja) * | 1986-11-20 | 1988-06-02 | Kanegafuchi Chem Ind Co Ltd | 新規なポリアミド酸及びポリイミドの製造法 |
| JPS63170421A (ja) * | 1986-11-19 | 1988-07-14 | ゼネラル・エレクトリック・カンパニイ | 累積フェニレンスルフィド単位を含む結晶性ポリイミド |
| JPS63170420A (ja) * | 1987-01-08 | 1988-07-14 | Nitto Electric Ind Co Ltd | 無色透明ポリイミド成形体およびその製法 |
| US4795798A (en) * | 1986-02-25 | 1989-01-03 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane |
| JPS64121A (en) * | 1987-02-13 | 1989-01-05 | New Japan Chem Co Ltd | Polyimide resin composition and its production |
| US4797466A (en) * | 1985-09-03 | 1989-01-10 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine |
| JPH0195155A (ja) * | 1987-10-05 | 1989-04-13 | Mitsubishi Kasei Corp | ポリイミド樹脂組成物 |
| JPH01131239A (ja) * | 1987-11-16 | 1989-05-24 | Mitsui Toatsu Chem Inc | 成形加工性良好なポリイミドの製造方法 |
| JPH01268778A (ja) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板 |
| JPH01282283A (ja) * | 1988-05-10 | 1989-11-14 | Hitachi Chem Co Ltd | ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板 |
| US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
| JPH0260934A (ja) * | 1988-06-28 | 1990-03-01 | Amoco Corp | 中間層絶縁体および基板被膜用の低誘電率、低水分吸収ポリイミドおよびコポリイミド |
| JPH02253551A (ja) * | 1989-03-27 | 1990-10-12 | Nippon Telegr & Teleph Corp <Ntt> | 電子顕微鏡検体調整法及び電子顕微鏡検体調整器具 |
| JPH036226A (ja) * | 1989-05-31 | 1991-01-11 | Shin Etsu Chem Co Ltd | ポリイミド樹脂の製造方法 |
| JPH0364355A (ja) * | 1989-08-02 | 1991-03-19 | Shin Etsu Chem Co Ltd | 半導体素子保護用組成物 |
| JPH03166227A (ja) * | 1989-11-24 | 1991-07-18 | Ube Ind Ltd | 熱可塑性芳香族ポリイミド |
| JPH05117596A (ja) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | 熱圧着可能な高熱伝導性フイルム状接着剤 |
| JPH05125332A (ja) * | 1991-11-01 | 1993-05-21 | Sumitomo Bakelite Co Ltd | 熱圧着可能な導電性フイルム状接着剤 |
| JPH05331424A (ja) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | フィルム接着剤 |
| US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
| JPH06106678A (ja) * | 1991-10-07 | 1994-04-19 | Internatl Business Mach Corp <Ibm> | 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス |
| JPH07278393A (ja) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
| JPH07292246A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
| JPH07292249A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂の組成物 |
| JPH07292247A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | 新規ポリイミド樹脂組成物 |
| JPH0841338A (ja) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | ポリイミド樹脂用組成物 |
| JPH08225645A (ja) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | 無色透明なポリイミド成形体およびその製法 |
| JPH08231715A (ja) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性良好なポリイミド |
| JPH08231714A (ja) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性の良好なポリイミド |
| US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153948A (en) * | 1976-06-15 | 1977-12-21 | Ciba Geigy Ag | Aromatic diamine polyamide compound consisting of said diamine and process for preparing same |
| JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
-
1982
- 1982-03-12 JP JP3992182A patent/JPS58157190A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153948A (en) * | 1976-06-15 | 1977-12-21 | Ciba Geigy Ag | Aromatic diamine polyamide compound consisting of said diamine and process for preparing same |
| JPS5518426A (en) * | 1978-07-27 | 1980-02-08 | Asahi Chem Ind Co Ltd | Heat-resistant flexible electronic parts |
Cited By (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60243120A (ja) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
| JPS6195031A (ja) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | ポリイミドフイルムの製造方法 |
| JPS6195030A (ja) * | 1984-10-15 | 1986-05-13 | Mitsui Toatsu Chem Inc | ポリイミドフイルムの製造方法 |
| JPS61143478A (ja) * | 1984-12-18 | 1986-07-01 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| US4883718A (en) * | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
| JPS627733A (ja) * | 1985-03-10 | 1987-01-14 | Nitto Electric Ind Co Ltd | 無色透明なポリイミド成形体およびその製法 |
| JPS61250031A (ja) * | 1985-04-29 | 1986-11-07 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | 熔融可能なポリイミド共重合体 |
| JPS61291669A (ja) * | 1985-06-18 | 1986-12-22 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| JPS6215228A (ja) * | 1985-07-15 | 1987-01-23 | Mitsubishi Petrochem Co Ltd | 芳香族チオエ−テルイミド重合体 |
| JPS6248782A (ja) * | 1985-08-27 | 1987-03-03 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
| US5205894A (en) * | 1985-08-27 | 1993-04-27 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide |
| US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
| WO1987001378A1 (fr) * | 1985-08-27 | 1987-03-12 | Mitsui Toatsu Chemicals, Incorporated | Polyimides et adhesifs thermoresistants les contenant |
| EP0729995A1 (en) * | 1985-08-27 | 1996-09-04 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and high-temperature adhesive of polyimide |
| US5087689A (en) * | 1985-08-27 | 1992-02-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines |
| US4847349A (en) * | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
| JPS6284124A (ja) * | 1985-08-30 | 1987-04-17 | ゼネラル・エレクトリツク・カンパニイ | 累積フエニレンスルフイド単位を含有する結晶性ポリイミド |
| US4797466A (en) * | 1985-09-03 | 1989-01-10 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine |
| JPS6286021A (ja) * | 1985-10-11 | 1987-04-20 | Mitsui Toatsu Chem Inc | ポリイミドよりなる耐熱性接着剤 |
| JPS62185715A (ja) * | 1986-02-13 | 1987-08-14 | Mitsui Toatsu Chem Inc | 無色ポリイミドフイルム |
| US4795798A (en) * | 1986-02-25 | 1989-01-03 | Mitsui Toatsu Chemicals, Inc. | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane |
| JPS63170421A (ja) * | 1986-11-19 | 1988-07-14 | ゼネラル・エレクトリック・カンパニイ | 累積フェニレンスルフィド単位を含む結晶性ポリイミド |
| JPS63130633A (ja) * | 1986-11-20 | 1988-06-02 | Kanegafuchi Chem Ind Co Ltd | 新規なポリアミド酸及びポリイミドの製造法 |
| JPS63170420A (ja) * | 1987-01-08 | 1988-07-14 | Nitto Electric Ind Co Ltd | 無色透明ポリイミド成形体およびその製法 |
| JPS64121A (en) * | 1987-02-13 | 1989-01-05 | New Japan Chem Co Ltd | Polyimide resin composition and its production |
| JPH0195155A (ja) * | 1987-10-05 | 1989-04-13 | Mitsubishi Kasei Corp | ポリイミド樹脂組成物 |
| JPH01131239A (ja) * | 1987-11-16 | 1989-05-24 | Mitsui Toatsu Chem Inc | 成形加工性良好なポリイミドの製造方法 |
| JPH01268778A (ja) * | 1988-04-20 | 1989-10-26 | Hitachi Chem Co Ltd | ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板 |
| JPH01282283A (ja) * | 1988-05-10 | 1989-11-14 | Hitachi Chem Co Ltd | ホツトメルト接着剤，ホツトメルト接着剤層付ポリイミドフイルム及び印刷回路用基板 |
| JPH0260934A (ja) * | 1988-06-28 | 1990-03-01 | Amoco Corp | 中間層絶縁体および基板被膜用の低誘電率、低水分吸収ポリイミドおよびコポリイミド |
| JPH02253551A (ja) * | 1989-03-27 | 1990-10-12 | Nippon Telegr & Teleph Corp <Ntt> | 電子顕微鏡検体調整法及び電子顕微鏡検体調整器具 |
| JPH036226A (ja) * | 1989-05-31 | 1991-01-11 | Shin Etsu Chem Co Ltd | ポリイミド樹脂の製造方法 |
| JPH0364355A (ja) * | 1989-08-02 | 1991-03-19 | Shin Etsu Chem Co Ltd | 半導体素子保護用組成物 |
| JPH03166227A (ja) * | 1989-11-24 | 1991-07-18 | Ube Ind Ltd | 熱可塑性芳香族ポリイミド |
| JPH06106678A (ja) * | 1991-10-07 | 1994-04-19 | Internatl Business Mach Corp <Ibm> | 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス |
| JPH05117596A (ja) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | 熱圧着可能な高熱伝導性フイルム状接着剤 |
| JPH05125332A (ja) * | 1991-11-01 | 1993-05-21 | Sumitomo Bakelite Co Ltd | 熱圧着可能な導電性フイルム状接着剤 |
| JPH05331424A (ja) * | 1992-06-04 | 1993-12-14 | Sumitomo Bakelite Co Ltd | フィルム接着剤 |
| JPH07292246A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
| JPH07292249A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | ポリイミド樹脂の組成物 |
| JPH07292247A (ja) * | 1995-03-20 | 1995-11-07 | Mitsui Toatsu Chem Inc | 新規ポリイミド樹脂組成物 |
| JPH0841338A (ja) * | 1995-03-20 | 1996-02-13 | Mitsui Toatsu Chem Inc | ポリイミド樹脂用組成物 |
| JPH07278393A (ja) * | 1995-04-17 | 1995-10-24 | Mitsui Toatsu Chem Inc | ポリイミド樹脂組成物 |
| JPH08225645A (ja) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | 無色透明なポリイミド成形体およびその製法 |
| JPH08231714A (ja) * | 1996-01-24 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性の良好なポリイミド |
| JPH08231715A (ja) * | 1996-03-08 | 1996-09-10 | Mitsui Toatsu Chem Inc | 熱安定性良好なポリイミド |
| US6468664B1 (en) | 1999-10-19 | 2002-10-22 | Samsung Electronics Co., Ltd. | Poly(imide-siloxane) compound for tapeless LOC packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231516B2 (enExample) | 1990-07-13 |
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