JP7752172B2 - プラズマ処理システム用の可動エッジリング - Google Patents

プラズマ処理システム用の可動エッジリング

Info

Publication number
JP7752172B2
JP7752172B2 JP2023521034A JP2023521034A JP7752172B2 JP 7752172 B2 JP7752172 B2 JP 7752172B2 JP 2023521034 A JP2023521034 A JP 2023521034A JP 2023521034 A JP2023521034 A JP 2023521034A JP 7752172 B2 JP7752172 B2 JP 7752172B2
Authority
JP
Japan
Prior art keywords
ring
movable
edge
movable support
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023521034A
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English (en)
Japanese (ja)
Other versions
JP2023546350A (ja
JP2023546350A5 (https=
Inventor
キンボール・クリストファー
エンリッチ・ダレル
有麻 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2023546350A publication Critical patent/JP2023546350A/ja
Publication of JP2023546350A5 publication Critical patent/JP2023546350A5/ja
Priority to JP2025161362A priority Critical patent/JP2025186503A/ja
Application granted granted Critical
Publication of JP7752172B2 publication Critical patent/JP7752172B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023521034A 2020-10-05 2021-09-29 プラズマ処理システム用の可動エッジリング Active JP7752172B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025161362A JP2025186503A (ja) 2020-10-05 2025-09-29 プラズマ処理システム用の可動エッジリング

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063087814P 2020-10-05 2020-10-05
US63/087,814 2020-10-05
PCT/US2021/052732 WO2022076227A1 (en) 2020-10-05 2021-09-29 Moveable edge rings for plasma processing systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025161362A Division JP2025186503A (ja) 2020-10-05 2025-09-29 プラズマ処理システム用の可動エッジリング

Publications (3)

Publication Number Publication Date
JP2023546350A JP2023546350A (ja) 2023-11-02
JP2023546350A5 JP2023546350A5 (https=) 2024-10-04
JP7752172B2 true JP7752172B2 (ja) 2025-10-09

Family

ID=81126208

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023521034A Active JP7752172B2 (ja) 2020-10-05 2021-09-29 プラズマ処理システム用の可動エッジリング
JP2025161362A Pending JP2025186503A (ja) 2020-10-05 2025-09-29 プラズマ処理システム用の可動エッジリング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025161362A Pending JP2025186503A (ja) 2020-10-05 2025-09-29 プラズマ処理システム用の可動エッジリング

Country Status (7)

Country Link
US (1) US12562350B2 (https=)
EP (1) EP4226415A4 (https=)
JP (2) JP7752172B2 (https=)
KR (1) KR20230079226A (https=)
CN (1) CN116349002A (https=)
TW (1) TWI899341B (https=)
WO (1) WO2022076227A1 (https=)

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US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
WO2019103722A1 (en) 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
CN115440558A (zh) * 2021-06-03 2022-12-06 长鑫存储技术有限公司 半导体蚀刻设备
EP4526921A1 (en) * 2022-05-17 2025-03-26 Lam Research Corporation Self-centering edge ring
US20240030006A1 (en) * 2022-07-25 2024-01-25 Micron Technology, Inc. Erosion rate monitoring for wafer fabrication equipment
TW202433543A (zh) * 2022-11-03 2024-08-16 美商蘭姆研究公司 增加關聯於邊緣環之熱傳接觸面積的系統及方法
TWI885666B (zh) * 2023-12-27 2025-06-01 南韓商維人股份有限公司 淺蝕刻處理腔室
KR20250112005A (ko) * 2024-01-16 2025-07-23 삼성전자주식회사 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법
US12562351B2 (en) * 2024-01-30 2026-02-24 Applied Materials, Inc. Extreme edge sheath tunability with non-movable edge ring
WO2025174512A1 (en) * 2024-02-13 2025-08-21 Lam Research Corporation Edge ring with conductive contact interface
US12614701B2 (en) 2024-05-15 2026-04-28 Applied Materials, Inc. Substrate processing chamber with plasma confinement

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