TWI899341B - 電漿處理系統用的可移動邊緣環 - Google Patents

電漿處理系統用的可移動邊緣環

Info

Publication number
TWI899341B
TWI899341B TW110136825A TW110136825A TWI899341B TW I899341 B TWI899341 B TW I899341B TW 110136825 A TW110136825 A TW 110136825A TW 110136825 A TW110136825 A TW 110136825A TW I899341 B TWI899341 B TW I899341B
Authority
TW
Taiwan
Prior art keywords
ring
movable
substrate processing
edge
processing system
Prior art date
Application number
TW110136825A
Other languages
English (en)
Chinese (zh)
Other versions
TW202234572A (zh
Inventor
克利斯多夫 肯伯
達瑞爾 艾爾利奇
大倉有麻
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW202234572A publication Critical patent/TW202234572A/zh
Application granted granted Critical
Publication of TWI899341B publication Critical patent/TWI899341B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW110136825A 2020-10-05 2021-10-04 電漿處理系統用的可移動邊緣環 TWI899341B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063087814P 2020-10-05 2020-10-05
US63/087,814 2020-10-05

Publications (2)

Publication Number Publication Date
TW202234572A TW202234572A (zh) 2022-09-01
TWI899341B true TWI899341B (zh) 2025-10-01

Family

ID=81126208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110136825A TWI899341B (zh) 2020-10-05 2021-10-04 電漿處理系統用的可移動邊緣環

Country Status (7)

Country Link
US (1) US12562350B2 (https=)
EP (1) EP4226415A4 (https=)
JP (2) JP7752172B2 (https=)
KR (1) KR20230079226A (https=)
CN (1) CN116349002A (https=)
TW (1) TWI899341B (https=)
WO (1) WO2022076227A1 (https=)

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CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
CN115440558A (zh) * 2021-06-03 2022-12-06 长鑫存储技术有限公司 半导体蚀刻设备
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US20240030006A1 (en) * 2022-07-25 2024-01-25 Micron Technology, Inc. Erosion rate monitoring for wafer fabrication equipment
TW202433543A (zh) * 2022-11-03 2024-08-16 美商蘭姆研究公司 增加關聯於邊緣環之熱傳接觸面積的系統及方法
TWI885666B (zh) * 2023-12-27 2025-06-01 南韓商維人股份有限公司 淺蝕刻處理腔室
KR20250112005A (ko) * 2024-01-16 2025-07-23 삼성전자주식회사 포커스 링, 이를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법
US12562351B2 (en) * 2024-01-30 2026-02-24 Applied Materials, Inc. Extreme edge sheath tunability with non-movable edge ring
WO2025174512A1 (en) * 2024-02-13 2025-08-21 Lam Research Corporation Edge ring with conductive contact interface
US12614701B2 (en) 2024-05-15 2026-04-28 Applied Materials, Inc. Substrate processing chamber with plasma confinement

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US20170133283A1 (en) * 2015-11-06 2017-05-11 Lam Research Corporation Sensor and adjuster for a consumable
TW201742102A (zh) * 2016-03-04 2017-12-01 應用材料股份有限公司 通用處理套件
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US20190228952A1 (en) * 2018-01-22 2019-07-25 Applied Materials, Inc. Processing with powered edge ring
US20190363003A1 (en) * 2018-05-28 2019-11-28 Applied Materials, Inc. Process kit with adjustable tuning ring for edge uniformity control

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