JP5690596B2 - フォーカスリング及び該フォーカスリングを備える基板処理装置 - Google Patents
フォーカスリング及び該フォーカスリングを備える基板処理装置 Download PDFInfo
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- JP5690596B2 JP5690596B2 JP2011002250A JP2011002250A JP5690596B2 JP 5690596 B2 JP5690596 B2 JP 5690596B2 JP 2011002250 A JP2011002250 A JP 2011002250A JP 2011002250 A JP2011002250 A JP 2011002250A JP 5690596 B2 JP5690596 B2 JP 5690596B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
- B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
- B08B9/283—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking by gas jets
- B08B9/286—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking by gas jets the gas being ionized
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32366—Localised processing
- H01J37/32385—Treating the edge of the workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Description
請求項2記載のフォーカスリングは、請求項1記載のフォーカスリングにおいて、前記内側フォーカスリングと前記石英部材との間、及び前記石英部材と前記載置台との間のそれぞれに伝熱シートが配置されることを特徴とする。
請求項5記載の基板処理装置は、請求項4記載の基板処理装置において、前記内側フォーカスリングと前記石英部材との間、及び前記石英部材と前記載置台との間のそれぞれに伝熱シートが配置されることを特徴とする。
請求項7記載の基板処理装置は、請求項4乃至6のいずれか1項に記載の基板処理装置において、前記載置台は冷却されて前記内側フォーカスリングよりも低温となることを特徴とする。
10 基板処理装置
12 サセプタ
25 フォーカスリング
25a 内側フォーカスリング
25b 外側フォーカスリング
25c,25d ブロック部材
25e フランジ部
35 ガス供給口
36,38 レーザ光
37 レーザ光ガイド部材
39,40 プッシャーピン
41 接地部材
42 接地電極
43 正電位電極
44 電磁石
Claims (7)
- 基板処理装置の処理室内に配置された基板の周縁を囲むフォーカスリングであって、
前記基板に隣接して配置され且つ冷却される内側フォーカスリングと、
該内側フォーカスリングを囲み且つ冷却されない外側フォーカスリングと、
前記内側フォーカスリング及び前記外側フォーカスリングの隙間に配された石英部材とを有し、
前記処理室内には少なくとも前記基板及び前記内側フォーカスリングを載置する載置台が配置され、
前記石英部材は前記内側フォーカスリング及び前記載置台の間にも介在することを特徴とするフォーカスリング。 - 前記内側フォーカスリングと前記石英部材との間、及び前記石英部材と前記載置台との間のそれぞれに伝熱シートが配置されることを特徴とする請求項1記載のフォーカスリング。
- 前記石英部材は前記処理室内におけるプラズマが生じる処理空間に晒されることを特徴とする請求項1又は2記載のフォーカスリング。
- 基板を収容する処理室と、前記処理室内に配置された基板の周縁を囲むフォーカスリングと、前記基板及び前記フォーカスリングを載置する載置台とを備える基板処理装置であって、
前記フォーカスリングは、前記基板に隣接して配置され且つ冷却される内側フォーカスリングと、該内側フォーカスリングを囲み且つ冷却されない外側フォーカスリングとを有し、
前記内側フォーカスリング及び前記載置台の隙間には石英部材が配され、
前記石英部材は、延伸されて前記内側フォーカスリング及び前記外側フォーカスリングの隙間にも配されることを特徴とする基板処理装置。 - 前記内側フォーカスリングと前記石英部材との間、及び前記石英部材と前記載置台との間のそれぞれに伝熱シートが配置されることを特徴とする請求項4記載の基板処理装置。
- 前記石英部材は、前記載置台において前記内側フォーカスリングが載置される載置面と、前記内側フォーカスリングとの間に介在することを特徴とする請求項4又は5記載の基板処理装置。
- 前記載置台は冷却されて前記内側フォーカスリングよりも低温となることを特徴とする請求項4乃至6のいずれか1項に記載の基板処理装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011002250A JP5690596B2 (ja) | 2011-01-07 | 2011-01-07 | フォーカスリング及び該フォーカスリングを備える基板処理装置 |
US13/344,926 US20120176692A1 (en) | 2011-01-07 | 2012-01-06 | Focus ring and substrate processing apparatus having same |
KR1020120001771A KR101933077B1 (ko) | 2011-01-07 | 2012-01-06 | 포커스 링 및 이 포커스 링을 구비하는 기판 처리 장치 |
CN201210003658.9A CN102592936B (zh) | 2011-01-07 | 2012-01-06 | 聚焦环和具有该聚焦环的基板处理装置 |
TW101100542A TWI553717B (zh) | 2011-01-07 | 2012-01-06 | A focusing ring and a substrate processing device provided with the focusing ring |
US15/935,275 US10777392B2 (en) | 2011-01-07 | 2018-03-26 | Substrate processing apparatus |
KR1020180166229A KR101989324B1 (ko) | 2011-01-07 | 2018-12-20 | 포커스 링 및 이 포커스 링을 구비하는 기판 처리 장치 |
US16/990,166 US11935727B2 (en) | 2011-01-07 | 2020-08-11 | Substrate processing method |
Applications Claiming Priority (1)
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JP2011002250A JP5690596B2 (ja) | 2011-01-07 | 2011-01-07 | フォーカスリング及び該フォーカスリングを備える基板処理装置 |
Publications (2)
Publication Number | Publication Date |
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JP2012146742A JP2012146742A (ja) | 2012-08-02 |
JP5690596B2 true JP5690596B2 (ja) | 2015-03-25 |
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JP2011002250A Active JP5690596B2 (ja) | 2011-01-07 | 2011-01-07 | フォーカスリング及び該フォーカスリングを備える基板処理装置 |
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US (3) | US20120176692A1 (ja) |
JP (1) | JP5690596B2 (ja) |
KR (2) | KR101933077B1 (ja) |
CN (1) | CN102592936B (ja) |
TW (1) | TWI553717B (ja) |
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US20200373131A1 (en) | 2020-11-26 |
US10777392B2 (en) | 2020-09-15 |
US20120176692A1 (en) | 2012-07-12 |
US11935727B2 (en) | 2024-03-19 |
KR101933077B1 (ko) | 2018-12-27 |
US20180218884A1 (en) | 2018-08-02 |
JP2012146742A (ja) | 2012-08-02 |
CN102592936A (zh) | 2012-07-18 |
KR101989324B1 (ko) | 2019-06-14 |
CN102592936B (zh) | 2015-01-21 |
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KR20190002384A (ko) | 2019-01-08 |
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