JP6605549B2 - 貫通部 - Google Patents
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- Publication number
- JP6605549B2 JP6605549B2 JP2017157386A JP2017157386A JP6605549B2 JP 6605549 B2 JP6605549 B2 JP 6605549B2 JP 2017157386 A JP2017157386 A JP 2017157386A JP 2017157386 A JP2017157386 A JP 2017157386A JP 6605549 B2 JP6605549 B2 JP 6605549B2
- Authority
- JP
- Japan
- Prior art keywords
- support
- glass
- housing part
- housing
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000035515 penetration Effects 0.000 title claims description 95
- 239000004020 conductor Substances 0.000 claims description 136
- 239000011521 glass Substances 0.000 claims description 99
- 239000000463 material Substances 0.000 claims description 74
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000002184 metal Substances 0.000 claims description 68
- 238000002844 melting Methods 0.000 claims description 44
- 230000008018 melting Effects 0.000 claims description 44
- 238000003466 welding Methods 0.000 claims description 37
- 239000006112 glass ceramic composition Substances 0.000 claims description 26
- 229910000831 Steel Inorganic materials 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 239000010959 steel Substances 0.000 claims description 21
- 238000005304 joining Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 11
- 229910000962 AlSiC Inorganic materials 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 9
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 9
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000011777 magnesium Substances 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- -1 CuSiC Inorganic materials 0.000 claims description 4
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- 229910052701 rubidium Inorganic materials 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910001315 Tool steel Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000000560 biocompatible material Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 28
- 229910001416 lithium ion Inorganic materials 0.000 description 25
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 17
- 150000002739 metals Chemical class 0.000 description 14
- 230000000149 penetrating effect Effects 0.000 description 13
- 230000008901 benefit Effects 0.000 description 12
- 239000011734 sodium Substances 0.000 description 12
- 239000003792 electrolyte Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000005365 phosphate glass Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 3
- 229910013870 LiPF 6 Inorganic materials 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000011255 nonaqueous electrolyte Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000006219 crystal-free glass Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
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- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910004654 CaO—MgO—Al2O3—B2O3 Inorganic materials 0.000 description 1
- 241000687983 Cerobasis alpha Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001313 Cobalt-iron alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 101100005555 Rattus norvegicus Ccl20 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000005486 organic electrolyte Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/0046—Welding
- B23K15/0093—Welding characterised by the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/19—Silica-free oxide glass compositions containing phosphorus containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/20—Compositions for glass with special properties for chemical resistant glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M10/0564—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of organic materials only
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- H01M10/0569—Liquid materials characterised by the solvents
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- H01M50/528—Fixed electrical connections, i.e. not intended for disconnection
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- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
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- H—ELECTRICITY
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- H01M50/50—Current conducting connections for cells or batteries
- H01M50/543—Terminals
- H01M50/564—Terminals characterised by their manufacturing process
- H01M50/566—Terminals characterised by their manufacturing process by welding, soldering or brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2204/00—Glasses, glazes or enamels with special properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2207/00—Compositions specially applicable for the manufacture of vitreous enamels
- C03C2207/08—Compositions specially applicable for the manufacture of vitreous enamels for light metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2300/00—Electrolytes
- H01M2300/0017—Non-aqueous electrolytes
- H01M2300/0025—Organic electrolyte
- H01M2300/0028—Organic electrolyte characterised by the solvent
- H01M2300/0037—Mixture of solvents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49108—Electric battery cell making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49108—Electric battery cell making
- Y10T29/4911—Electric battery cell making including sealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49108—Electric battery cell making
- Y10T29/49115—Electric battery cell making including coating or impregnating
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- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Glass Compositions (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Secondary Cells (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
EN AW−1050 A
EN AW−1350
EN AW−2014
EN AW−3003
EN AW−4032
EN AW−5019
EN AW−5056
EN AW−5083
EN AW−5556A
EN AW−6060
EN AW−6061
Cu−PHC 2.0070
Cu−OF 2.0070
Cu−ETP 2.0065
Cu−HCP 2.0070
Cu−DHP 2.0090
P2O5 35〜50mol%、特に39〜48mol%、
Al2O3 0〜14mol%、特に2〜12mol%、
B2O3 2から10mol%、特に4〜8mol%、
Na2O 0〜30mol%、特に0〜20mol%、
M2O 0〜20mol%、特に12〜20mol%(ここで、M=K、Cs、Rbであってよい)、
PbO 0〜10mol%、特に0〜9mol%、
Li2O 0〜45mol%、特に0〜40mol%、好ましくは17〜40mol%、
BaO 0〜20mol%、特に0〜20mol%、好ましくは5〜20mol%、
Bi2O3 0〜10mol%、特に1〜5mol%、好ましくは2〜5mol%。
P2O5 38〜50mol%、特に39〜48mol%、
Al2O3 3〜14mol%、特に2〜12mol%、
B2O3 4〜10mol%、特に4〜8mol%、
Na2O 10〜30mol%、特に0〜20mol%、
K2O 10〜20mol%、特に12〜19mol%、
PbO 0〜10mol%、特に0〜9mol%。
導体、特に本質的にピン形の導体および支持体を用意するステップと、
導体、特に本質的にピン形の導体を、ガラス材料またはガラスセラミック材料中で、支持体にガラス付けして、ハウジング、特にバッテリーセルハウジングのハウジング部分のための貫通部を生じさせるステップとを含む。
P2O5 35〜50mol%、特に39〜48mol%、
Al2O3 0〜14mol%、特に2〜12mol%、
B2O3 2〜10mol%、特に4〜8mol%、
Na2O 0〜30mol%、特に0〜20mol%、
M2O 0〜20mol%、特に12〜20mol%(ここで、M=K、Cs、Rbであってよい)、
PbO 0〜10mol%、特に0〜9mol%、
Li2O 0〜45mol%、特に0〜40mol%、好ましくは17〜40mol%、
BaO 0〜20mol%、特に0〜20mol%、好ましくは5〜20mol%、
Bi2O3 0〜10mol%、特に1〜5mol%、好ましくは2〜5mol%。
P2O5 38〜50mol%、特に39〜48mol%、
Al2O3 3〜14mol%、特に4〜12mol%、
B2O3 4〜10mol%、特に4〜8mol%、
Na2O 10〜30mol%、特に14〜20mol%、
K2O 10〜20mol%、特に12〜19mol%、
PbO 0〜10mol%、特に0〜9mol%。
Claims (22)
- ハウジングのハウジング部分であって、少なくとも1つの開口部を有し、該ハウジング部分は、少なくとも1つの該開口部に配置された貫通部を有しており、
該貫通部が、
ガラス材料およびガラスセラミック材料の一方、
該ガラス材料および該ガラスセラミック材料の一方に封入された少なくとも1つの導体、並びに
該ガラス材料および該ガラスセラミック材料の一方に埋め込まれた少なくとも1つの該導体が導入された支持体
を含み、
該支持体が該開口部の範囲で、該ハウジング部分と溶接、はんだ付け、押し込み、フランジ付けまたは収縮によって、1×108mbar l/秒未満のヘリウム漏出速度となるように気密に接合されており、
該ハウジング部分が生体適合材料としてチタンまたはチタン合金を含むことを特徴とするハウジング部分。 - 前記ハウジングが、金属からなる側壁とカバー部を有し、該カバー部が少なくとも1つの前記開口部を含むことを特徴とする、請求項1に記載のハウジング部分。
- 前記支持体が、リング形の支持体であることを特徴とする、請求項1または2に記載のハウジング部分。
- 前記支持体が、金属を含むことを特徴とする、請求項1から3のいずれか1項に記載のハウジング部分。
- 前記金属が、軽金属であることを特徴とする、請求項4に記載のハウジング部分。
- 前記支持体に含まれる軽金属が、アルミニウム、アルミニウム合金、AlSiC、マグネシウム、マグネシウム合金、チタン、およびチタン合金からなるグループから選ばれることを特徴とする、請求項5に記載のハウジング部分。
- 前記支持体に含まれる金属が、鋼、工具鋼、特殊鋼、ステンレス鋼、および標準鋼からなるグループから選ばれることを特徴とする、請求項4に記載のハウジング部分。
- 前記支持体が、ノッチおよび/または張り出し部を有することを特徴とする、請求項1から7のいずれか1項に記載のハウジング部分。
- 前記ハウジング部分の材料厚さは、1.5mm以下であり、前記支持体の材料厚さは、3.0mm以上であることを特徴とする、請求項1から8のいずれか1項に記載のハウジング部分。
- 前記ガラス材料または前記ガラスセラミック材料が、前記支持体と前記導体との間に導入されており、該ガラス材料または該ガラスセラミック材料が、前記支持体および/または前記導体の溶融温度よりも低い融解温度を有することを特徴とする、請求項1から9のいずれか1項に記載のハウジング部分。
- 前記ガラス材料または前記ガラスセラミック材料が以下の成分を以下のmol%で含むことを特徴とする、請求項1から10のいずれか1項に記載のハウジング部分:
P2O5 35〜50mol%、
Al2O3 0〜14mol%、
B2O3 2〜10mol%、
Na2O 0〜30mol%、
M2O 0〜20mol%(ここで、M=K、Cs、Rbであってよい)、
PbO 0〜10mol%、
Li2O 0〜45mol%、
BaO 0〜20mol%、
Bi2O3 0〜10mol%。 - 前記導体が、ピン形の導体であることを特徴とする、請求項1から11のいずれか1項に記載のハウジング部分。
- 前記導体が、軽金属を含むことを特徴とする、請求項1から12のいずれか1項に記載のハウジング部分。
- 前記導体に含まれる金属が、銅、CuSiC、銅合金、アルミニウム、AlSiC、アルミニウム合金、マグネシウム、マグネシウム合金、NiFe、銅内部を有するNiFe−ジャケット、銀、銀合金、金、金合金、またはコバルト−鉄合金を含むことを特徴とする、請求項1から12のいずれか1項に記載のハウジング部分。
- 前記軽金属が、5×10−6S/m〜50×10−6S/mの範囲の比導電率を有することを特徴とする、請求項13に記載のハウジング部分。
- 前記軽金属が、20℃〜300℃で18×10−6/K〜30×10−6/Kの範囲の熱膨張率αを有することを特徴とする、請求項13または15に記載のハウジング部分。
- 前記軽金属が、350℃〜800℃の範囲の溶融温度を有することを特徴とする、請求項13、15、16のいずれか1項に記載のハウジング部分。
- 前記ガラス材料または前記ガラスセラミック材料が、20℃〜300℃で15×10−6/K〜25×10−6/Kの範囲の熱膨張率αを有することを特徴とする、請求項1から17のいずれか1項に記載のハウジング部分。
- 前記貫通部が、加圧ガラス貫通部であることを特徴とする、請求項1から18のいずれか1項に記載のハウジング部分。
- 前記導体がヘッド部分を含み、該ヘッド部分が、前記導体の面積(F導体)よりも大きなヘッド面積(Fヘッド部分)を有することを特徴とする、請求項1乃至12のいずれか1項に記載のハウジング部分。
- 請求項1から20のいずれか1項に記載の、少なくとも1つの前記導体を備えた前記ハウジング部分を製造する方法であって、
前記導体および前記支持体を用意するステップと、
前記導体を、前記ガラス材料または前記ガラスセラミック材料中で前記支持体にガラス付けして、前記ハウジングの前記ハウジング部分のための前記貫通部を生じさせるステップと、
前記貫通部を前記ハウジングと、レーザービーム溶接、電子ビーム溶接、超音波溶接、または抵抗溶接によって、および別法でははんだ付け、収縮、押し込み、またはフランジ付けによって、1×108mbar l/秒未満のヘリウム漏出速度となるように気密に接合させるステップとを含む方法。 - 前記ガラス材料または前記ガラスセラミック材料が以下の成分を以下のmol%で含むことを特徴とする、請求項21に記載の方法:
P2O5 35〜50mol%、
Al2O3 0〜14mol%、
B2O3 2〜10mol%、
Na2O 0〜30mol%、
M2O 0〜20mol%(ここで、M=K、Cs、Rbであってよい)、
PbO 0〜10mol%、
Li2O 0〜45mol%、
BaO 0〜20mol%、
Bi2O3 0〜10mol%。
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