JP6242035B2 - 発光素子パッケージ - Google Patents

発光素子パッケージ Download PDF

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Publication number
JP6242035B2
JP6242035B2 JP2011123165A JP2011123165A JP6242035B2 JP 6242035 B2 JP6242035 B2 JP 6242035B2 JP 2011123165 A JP2011123165 A JP 2011123165A JP 2011123165 A JP2011123165 A JP 2011123165A JP 6242035 B2 JP6242035 B2 JP 6242035B2
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JP
Japan
Prior art keywords
light emitting
reflective cup
emitting diode
emitting device
cup
Prior art date
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Active
Application number
JP2011123165A
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English (en)
Japanese (ja)
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JP2011254080A (ja
JP2011254080A5 (https=
Inventor
ミン，ボンクル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of JP2011254080A publication Critical patent/JP2011254080A/ja
Publication of JP2011254080A5 publication Critical patent/JP2011254080A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/20—Breakdown diodes, e.g. avalanche diodes
    • H10D8/25—Zener diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
JP2011123165A 2010-06-01 2011-06-01 発光素子パッケージ Active JP6242035B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100051840A KR101103674B1 (ko) 2010-06-01 2010-06-01 발광 소자
KR10-2010-0051840 2010-06-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016172760A Division JP6033982B1 (ja) 2010-06-01 2016-09-05 発光素子パッケージ

Publications (3)

Publication Number Publication Date
JP2011254080A JP2011254080A (ja) 2011-12-15
JP2011254080A5 JP2011254080A5 (https=) 2014-07-17
JP6242035B2 true JP6242035B2 (ja) 2017-12-06

Family

ID=44487094

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2011123165A Active JP6242035B2 (ja) 2010-06-01 2011-06-01 発光素子パッケージ
JP2016172760A Active JP6033982B1 (ja) 2010-06-01 2016-09-05 発光素子パッケージ
JP2016209128A Expired - Fee Related JP6325051B2 (ja) 2010-06-01 2016-10-26 発光素子パッケージ
JP2018076303A Active JP6505286B2 (ja) 2010-06-01 2018-04-11 発光素子パッケージ
JP2019058675A Pending JP2019106551A (ja) 2010-06-01 2019-03-26 発光素子パッケージ

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2016172760A Active JP6033982B1 (ja) 2010-06-01 2016-09-05 発光素子パッケージ
JP2016209128A Expired - Fee Related JP6325051B2 (ja) 2010-06-01 2016-10-26 発光素子パッケージ
JP2018076303A Active JP6505286B2 (ja) 2010-06-01 2018-04-11 発光素子パッケージ
JP2019058675A Pending JP2019106551A (ja) 2010-06-01 2019-03-26 発光素子パッケージ

Country Status (4)

Country Link
US (8) US8269246B2 (https=)
EP (2) EP3043394B1 (https=)
JP (5) JP6242035B2 (https=)
KR (1) KR101103674B1 (https=)

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KR101103674B1 (ko) 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
KR101859149B1 (ko) 2011-04-14 2018-05-17 엘지이노텍 주식회사 발광 소자 패키지
KR101871501B1 (ko) * 2011-07-29 2018-06-27 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 시스템
WO2013040453A2 (en) * 2011-09-16 2013-03-21 Air Motion Systems, Inc. Assembly and interconnection method for high-power led devices
KR101905535B1 (ko) * 2011-11-16 2018-10-10 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 조명 장치
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KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
JP5721668B2 (ja) * 2012-06-29 2015-05-20 シャープ株式会社 発光装置、照明装置および表示装置用バックライト
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
JP6019977B2 (ja) * 2012-09-14 2016-11-02 日亜化学工業株式会社 発光装置
KR101966110B1 (ko) * 2012-10-11 2019-08-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 시스템
JP6102187B2 (ja) 2012-10-31 2017-03-29 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
KR101997249B1 (ko) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 발광 소자
KR101946922B1 (ko) * 2012-11-16 2019-02-12 엘지이노텍 주식회사 발광 소자 및 조명 장치
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JP6107136B2 (ja) 2012-12-29 2017-04-05 日亜化学工業株式会社 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置
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JP6610703B2 (ja) * 2013-06-28 2019-11-27 日亜化学工業株式会社 発光装置用パッケージ
JP6484396B2 (ja) * 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
KR102237155B1 (ko) * 2015-03-11 2021-04-07 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
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KR102537440B1 (ko) * 2016-03-18 2023-05-30 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP6952945B2 (ja) * 2016-03-25 2021-10-27 スージョウ レキン セミコンダクター カンパニー リミテッド 発光素子パッケージ及び照明装置
CN109155349B (zh) * 2016-05-18 2021-09-07 亮锐控股有限公司 照明组件及用于制造照明组件的方法
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