JP6058431B2 - 樹脂モールド装置、および樹脂モールド方法 - Google Patents

樹脂モールド装置、および樹脂モールド方法 Download PDF

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Publication number
JP6058431B2
JP6058431B2 JP2013046759A JP2013046759A JP6058431B2 JP 6058431 B2 JP6058431 B2 JP 6058431B2 JP 2013046759 A JP2013046759 A JP 2013046759A JP 2013046759 A JP2013046759 A JP 2013046759A JP 6058431 B2 JP6058431 B2 JP 6058431B2
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Japan
Prior art keywords
mold
resin
cavity
workpiece
block
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JP2013046759A
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English (en)
Japanese (ja)
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JP2014172287A (ja
Inventor
川口　誠
誠 川口
正明 涌井
正明 涌井
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Apic Yamada Corp
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Apic Yamada Corp
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Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2013046759A priority Critical patent/JP6058431B2/ja
Priority to KR1020157024568A priority patent/KR102162395B1/ko
Priority to PCT/JP2014/052227 priority patent/WO2014136509A1/ja
Priority to TW106127191A priority patent/TWI634627B/zh
Priority to TW103104058A priority patent/TWI604576B/zh
Publication of JP2014172287A publication Critical patent/JP2014172287A/ja
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Publication of JP6058431B2 publication Critical patent/JP6058431B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B29C2045/2671—Resin exit gates or bleeder passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2013046759A 2013-03-08 2013-03-08 樹脂モールド装置、および樹脂モールド方法 Active JP6058431B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013046759A JP6058431B2 (ja) 2013-03-08 2013-03-08 樹脂モールド装置、および樹脂モールド方法
KR1020157024568A KR102162395B1 (ko) 2013-03-08 2014-01-31 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법
PCT/JP2014/052227 WO2014136509A1 (ja) 2013-03-08 2014-01-31 樹脂モールド金型、樹脂モールド装置、樹脂モールド方法、および樹脂モールド金型の評価方法
TW106127191A TWI634627B (zh) 2013-03-08 2014-02-07 樹脂成型裝置、樹脂成型方法以及樹脂成型模具
TW103104058A TWI604576B (zh) 2013-03-08 2014-02-07 樹脂成型裝置與樹脂成型方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013046759A JP6058431B2 (ja) 2013-03-08 2013-03-08 樹脂モールド装置、および樹脂モールド方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016236322A Division JP6353890B2 (ja) 2016-12-06 2016-12-06 樹脂モールド装置および樹脂モールド方法

Publications (2)

Publication Number Publication Date
JP2014172287A JP2014172287A (ja) 2014-09-22
JP6058431B2 true JP6058431B2 (ja) 2017-01-11

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JP2013046759A Active JP6058431B2 (ja) 2013-03-08 2013-03-08 樹脂モールド装置、および樹脂モールド方法

Country Status (4)

Country Link
JP (1) JP6058431B2 (zh)
KR (1) KR102162395B1 (zh)
TW (2) TWI604576B (zh)
WO (1) WO2014136509A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2767931C1 (ru) * 2021-04-12 2022-03-22 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ экстракционной очистки экстракта урана от технеция

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JP6320172B2 (ja) * 2014-05-29 2018-05-09 Ｔｏｗａ株式会社 電子部品の樹脂封止方法及び樹脂封止装置
JP6423677B2 (ja) * 2014-10-02 2018-11-14 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
KR102376487B1 (ko) * 2015-02-12 2022-03-21 삼성전자주식회사 반도체 패키지의 제조 장치 및 그 제조 방법
JP6020667B1 (ja) * 2015-06-19 2016-11-02 第一精工株式会社 トランスファー成形機および電子部品を製造する方法
JP2017034238A (ja) * 2015-07-30 2017-02-09 第一精工株式会社 電子部品封止装置およびこれを用いた電子部品の封止方法
JP6499105B2 (ja) * 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6576862B2 (ja) 2016-03-16 2019-09-18 東芝メモリ株式会社 トランスファ成型装置
WO2017203888A1 (ja) * 2016-05-26 2017-11-30 アピックヤマダ株式会社 樹脂供給方法、樹脂供給装置、樹脂成形装置、樹脂セット方法および樹脂成形方法
JP6730206B2 (ja) * 2017-02-23 2020-07-29 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
JP6546879B2 (ja) * 2016-05-26 2019-07-17 アピックヤマダ株式会社 樹脂成形金型および樹脂成形方法
JP6431871B2 (ja) * 2016-05-26 2018-11-28 アピックヤマダ株式会社 樹脂供給方法および樹脂供給装置
JP6721525B2 (ja) 2017-03-03 2020-07-15 キオクシア株式会社 金型
JP6721526B2 (ja) * 2017-03-03 2020-07-15 アピックヤマダ株式会社 モールド金型、モールドプレス、およびモールド装置
JP2019171629A (ja) * 2018-03-27 2019-10-10 住友重機械工業株式会社 金型システム
TWI769288B (zh) * 2018-08-08 2022-07-01 揚明光學股份有限公司 射出成型模具及製造高分子材料元件的方法
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
KR102019005B1 (ko) * 2019-01-24 2019-09-05 심완보 반도체 패키지용 이중 몰드 금형
US12044962B2 (en) * 2019-04-19 2024-07-23 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method
JP7084348B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2020185754A (ja) * 2019-05-17 2020-11-19 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7327224B2 (ja) * 2020-03-13 2023-08-16 オムロン株式会社 金型交換装置、成形装置および成形方法
KR102322411B1 (ko) * 2020-11-02 2021-11-05 재단법인 한국탄소산업진흥원 항공기 날개 끝단 복합재 구조물 제조장치
JP7447050B2 (ja) * 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2023092241A (ja) * 2021-12-21 2023-07-03 Ｉ－Ｐｅｘ株式会社 樹脂封止装置
CN117790397B (zh) * 2024-02-26 2024-05-10 湖南酷牛存储科技有限公司 一种多层存储芯片封装设备及其工作方法

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JP3435271B2 (ja) * 1995-11-30 2003-08-11 三菱電機株式会社 半導体装置
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JP2008235489A (ja) * 2007-03-19 2008-10-02 Fujitsu Ltd 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5185069B2 (ja) * 2008-10-31 2013-04-17 アピックヤマダ株式会社 トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法
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JP5776094B2 (ja) * 2011-03-15 2015-09-09 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2767931C1 (ru) * 2021-04-12 2022-03-22 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ экстракционной очистки экстракта урана от технеция

Also Published As

Publication number Publication date
TW201436127A (zh) 2014-09-16
TW201742201A (zh) 2017-12-01
KR102162395B1 (ko) 2020-10-06
TWI634627B (zh) 2018-09-01
WO2014136509A1 (ja) 2014-09-12
KR20150126360A (ko) 2015-11-11
JP2014172287A (ja) 2014-09-22
TWI604576B (zh) 2017-11-01

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