KR102162395B1 - 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법 - Google Patents

수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법 Download PDF

Info

Publication number
KR102162395B1
KR102162395B1 KR1020157024568A KR20157024568A KR102162395B1 KR 102162395 B1 KR102162395 B1 KR 102162395B1 KR 1020157024568 A KR1020157024568 A KR 1020157024568A KR 20157024568 A KR20157024568 A KR 20157024568A KR 102162395 B1 KR102162395 B1 KR 102162395B1
Authority
KR
South Korea
Prior art keywords
mold
resin
cavity
block
molding
Prior art date
Application number
KR1020157024568A
Other languages
English (en)
Korean (ko)
Other versions
KR20150126360A (ko
Inventor
마코토 가와구치
마사아키 와쿠이
Original Assignee
아피쿠 야마다 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아피쿠 야마다 가부시키가이샤 filed Critical 아피쿠 야마다 가부시키가이샤
Publication of KR20150126360A publication Critical patent/KR20150126360A/ko
Application granted granted Critical
Publication of KR102162395B1 publication Critical patent/KR102162395B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B29C2045/2671—Resin exit gates or bleeder passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020157024568A 2013-03-08 2014-01-31 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법 KR102162395B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013046759A JP6058431B2 (ja) 2013-03-08 2013-03-08 樹脂モールド装置、および樹脂モールド方法
JPJP-P-2013-046759 2013-03-08
PCT/JP2014/052227 WO2014136509A1 (ja) 2013-03-08 2014-01-31 樹脂モールド金型、樹脂モールド装置、樹脂モールド方法、および樹脂モールド金型の評価方法

Publications (2)

Publication Number Publication Date
KR20150126360A KR20150126360A (ko) 2015-11-11
KR102162395B1 true KR102162395B1 (ko) 2020-10-06

Family

ID=51491035

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024568A KR102162395B1 (ko) 2013-03-08 2014-01-31 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법

Country Status (4)

Country Link
JP (1) JP6058431B2 (zh)
KR (1) KR102162395B1 (zh)
TW (2) TWI604576B (zh)
WO (1) WO2014136509A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6320172B2 (ja) * 2014-05-29 2018-05-09 Ｔｏｗａ株式会社 電子部品の樹脂封止方法及び樹脂封止装置
JP6423677B2 (ja) * 2014-10-02 2018-11-14 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
KR102376487B1 (ko) * 2015-02-12 2022-03-21 삼성전자주식회사 반도체 패키지의 제조 장치 및 그 제조 방법
JP6020667B1 (ja) * 2015-06-19 2016-11-02 第一精工株式会社 トランスファー成形機および電子部品を製造する方法
JP2017034238A (ja) * 2015-07-30 2017-02-09 第一精工株式会社 電子部品封止装置およびこれを用いた電子部品の封止方法
JP6499105B2 (ja) * 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6576862B2 (ja) 2016-03-16 2019-09-18 東芝メモリ株式会社 トランスファ成型装置
WO2017203888A1 (ja) * 2016-05-26 2017-11-30 アピックヤマダ株式会社 樹脂供給方法、樹脂供給装置、樹脂成形装置、樹脂セット方法および樹脂成形方法
JP6730206B2 (ja) * 2017-02-23 2020-07-29 アピックヤマダ株式会社 樹脂供給装置、樹脂供給方法および樹脂成形装置
JP6546879B2 (ja) * 2016-05-26 2019-07-17 アピックヤマダ株式会社 樹脂成形金型および樹脂成形方法
JP6431871B2 (ja) * 2016-05-26 2018-11-28 アピックヤマダ株式会社 樹脂供給方法および樹脂供給装置
JP6721525B2 (ja) 2017-03-03 2020-07-15 キオクシア株式会社 金型
JP6721526B2 (ja) * 2017-03-03 2020-07-15 アピックヤマダ株式会社 モールド金型、モールドプレス、およびモールド装置
JP2019171629A (ja) * 2018-03-27 2019-10-10 住友重機械工業株式会社 金型システム
TWI769288B (zh) * 2018-08-08 2022-07-01 揚明光學股份有限公司 射出成型模具及製造高分子材料元件的方法
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
KR102019005B1 (ko) * 2019-01-24 2019-09-05 심완보 반도체 패키지용 이중 몰드 금형
US12044962B2 (en) * 2019-04-19 2024-07-23 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method
JP7084348B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2020185754A (ja) * 2019-05-17 2020-11-19 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP7327224B2 (ja) * 2020-03-13 2023-08-16 オムロン株式会社 金型交換装置、成形装置および成形方法
KR102322411B1 (ko) * 2020-11-02 2021-11-05 재단법인 한국탄소산업진흥원 항공기 날개 끝단 복합재 구조물 제조장치
RU2767931C1 (ru) * 2021-04-12 2022-03-22 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ экстракционной очистки экстракта урана от технеция
JP7447050B2 (ja) * 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP2023092241A (ja) * 2021-12-21 2023-07-03 Ｉ－Ｐｅｘ株式会社 樹脂封止装置
CN117790397B (zh) * 2024-02-26 2024-05-10 湖南酷牛存储科技有限公司 一种多层存储芯片封装设备及其工作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109252A (ja) * 2008-10-31 2010-05-13 Apic Yamada Corp トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法と半導体装置
JP2012192532A (ja) * 2011-03-15 2012-10-11 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2936669B2 (ja) * 1990-08-07 1999-08-23 株式会社デンソー 樹脂封止型半導体装置
JPH05230175A (ja) * 1992-02-24 1993-09-07 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP3435271B2 (ja) * 1995-11-30 2003-08-11 三菱電機株式会社 半導体装置
JP2001079901A (ja) * 1999-09-14 2001-03-27 Mitsubishi Electric Corp 半導体封止装置及び半導体装置の製造方法
JP2004207290A (ja) * 2002-12-24 2004-07-22 Seiko Epson Corp 半導体装置の製造方法及び製造装置
JP2008235489A (ja) * 2007-03-19 2008-10-02 Fujitsu Ltd 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置
JP5138470B2 (ja) * 2008-06-06 2013-02-06 アピックヤマダ株式会社 トランスファモールド装置とこれを用いたトランスファモールド方法
JP5499986B2 (ja) * 2010-08-11 2014-05-21 富士通セミコンダクター株式会社 半導体装置の製造方法及び半導体製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109252A (ja) * 2008-10-31 2010-05-13 Apic Yamada Corp トランスファモールド金型およびトランスファモールド装置とこれを用いた樹脂成形方法と半導体装置
JP2012192532A (ja) * 2011-03-15 2012-10-11 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置

Also Published As

Publication number Publication date
TW201436127A (zh) 2014-09-16
TW201742201A (zh) 2017-12-01
JP6058431B2 (ja) 2017-01-11
TWI634627B (zh) 2018-09-01
WO2014136509A1 (ja) 2014-09-12
KR20150126360A (ko) 2015-11-11
JP2014172287A (ja) 2014-09-22
TWI604576B (zh) 2017-11-01

Similar Documents

Publication Publication Date Title
KR102162395B1 (ko) 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법
KR102208459B1 (ko) 수지 몰드 금형 및 수지 몰드 장치
JP6444381B2 (ja) 樹脂モールド金型および樹脂モールド方法
US8117742B2 (en) Fabrication method of semiconductor integrated circuit device
JP5824765B2 (ja) 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP6137679B2 (ja) 樹脂モールド装置および樹脂モールド方法
CN113597365B (zh) 树脂成形品的制造方法
WO2017081882A1 (ja) 樹脂封止装置及び樹脂封止方法
JP4454608B2 (ja) 半導体集積回路装置の製造方法
WO2016125571A1 (ja) 樹脂成形金型、樹脂成形方法、および成形品の製造方法
JP6397808B2 (ja) 樹脂成形金型および樹脂成形方法
KR102527948B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
JP6353890B2 (ja) 樹脂モールド装置および樹脂モールド方法
JP2007288110A (ja) 樹脂封止型及び樹脂封止方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant