JP5926730B2 - 改良されたウェハキャリア - Google Patents
改良されたウェハキャリア Download PDFInfo
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- JP5926730B2 JP5926730B2 JP2013524866A JP2013524866A JP5926730B2 JP 5926730 B2 JP5926730 B2 JP 5926730B2 JP 2013524866 A JP2013524866 A JP 2013524866A JP 2013524866 A JP2013524866 A JP 2013524866A JP 5926730 B2 JP5926730 B2 JP 5926730B2
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- wafer
- main portion
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- wafer carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Packaging Frangible Articles (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
本出願は、2010年8月13日に出願された米国特許出願第12/855,739号の継続出願であり、その開示内容は、引用することにより本明細書の一部をなすものとする。
ΔH=K*d2/8
ここで、Kはウェハ曲率であり、
dはウェハの直径である。
ΔH’=K*d2/2
Claims (15)
- 水平方向に延在する対向する上面及び底面と、該上面の中に延在し、該上面に対して開口している複数のポケットとを有する本体を含むウェハキャリアであって、そのような各ポケットはウェハを保持するように構成され、前記ウェハの上面が前記本体の前記上面において露出しており、前記本体は第1の熱伝導率を有する第1の材料から形成される主要部分を含み、前記主要部分は前記ポケットと位置合わせされた垂直に延在する穴を有し、前記本体は、前記第1の熱伝導率よりも高い第2の熱伝導率を有する第2の材料から形成される小部分を更に含み、該小部分は前記主要部分の前記穴内に配置され、前記ポケットの床面を画定し、前記本体は、前記主要部分と各小部分との間に垂直に延在する熱障壁を有し、前記熱障壁は前記主要部分と前記小部分との間で水平方向に熱が伝導するのを阻止し、前記キャリアの前記本体の前記底面に熱を伝達することによって前記キャリアが加熱されるときに、前記主要部分及び前記小部分は、前記キャリアの前記本体の前記上面及び前記ウェハの前記上面にわたって相対的に均一な温度分布を与えるように構成されており、前記小部分は前記本体の前記底面の一部も画定しており、前記ポケットのそれぞれは、前記ポケットに配置されたウェハを前記ポケットの前記床面から離間して配置するように、前記ポケットの周辺を囲むように分散配置された支持体を含んでおり、前記本体はスピンドルに接続するように適合された取付具を含んでいる、ウェハキャリア。
- 前記熱障壁は、前記小部分及び前記主要部分の当接する表面間の界面を含む、請求項1に記載のウェハキャリア。
- 前記小部分は、前記主要部分にある前記穴の内部で前記主要部分と摩擦係合している、請求項1に記載のウェハキャリア。
- 前記熱障害は、前記主要部分の前記垂直に延在する穴の壁に隣接している、請求項2に記載のウェハキャリア。
- 水平方向に延在する対向する上面及び底面と、該上面の中に延在し、該上面に対して開口している複数のポケットとを有する本体を含むウェハキャリアであって、そのような各ポケットはウェハを保持するように構成され、前記ウェハの上面が前記本体の前記上面において露出し、前記本体は、前記ポケットと位置合わせされた垂直に延在する穴を有する主要部分を含み、前記本体は、前記主要部分の前記穴内に配置された小部分を更に含み、前記本体は、前記主要部分と各小部分との間に垂直に延在する境界部分を有し、該境界部分は前記主要部分の熱伝導率とは異なる、垂直方向の熱伝導率を有し、前記キャリアの前記本体の前記底面に熱を伝達することによって前記キャリアが加熱されるときに、前記主要部分及び前記小部分は、前記キャリアの前記本体の前記上面及び前記ウェハの前記上面にわたって相対的に均一な温度分布を与えるように構成されており、前記小部分は前記本体の前記底面の一部も画定しており、前記ポケットのそれぞれは、前記ポケットに配置されたウェハを前記ポケットの前記床面から離間して配置するように、前記ポケットの周辺を囲むように分散配置された支持体を含んでおり、前記本体はスピンドルに接続するように適合された取付具を含んでいる、ウェハキャリア。
- 前記小部分は、前記主要部分とは異なり、前記境界部分とは異なる熱伝導率を有する、請求項5に記載のウェハキャリア。
- 前記ポケットは円形である、請求項5に記載のウェハキャリア。
- 前記境界部分は、前記主要部分の前記垂直に延在する穴の壁に隣接している、請求項5に記載のウェハキャリア。
- 前記小部分は、前記主要部分にある前記穴の内部で前記主要部分と摩擦係合している、請求項5に記載のウェハキャリア。
- 水平方向に延在する対向する上面及び底面と、該上面の中に延在し、該上面に対して開口している複数のポケットとを有する本体を含むウェハキャリアであって、そのような各ポケットはウェハを保持するように構成され、前記ウェハの上面が前記本体の前記上面において露出し、前記本体は、前記ポケットと位置合わせされた垂直に延在する穴を有する主要部分を含み、前記本体は、前記主要部分の前記穴内に配置された小部分を更に含み、前記本体は、前記主要部分と各小部分との間に垂直に延在する境界部分を有し、該境界部分は前記主要部分の熱伝導率とは異なる、垂直方向の熱伝導率を有し、前記小部分は前記主要部分及び前記境界部分の熱伝導率とは異なる熱伝導率を有し、前記境界部分は、前記主要部分の熱伝導率とは異なる、垂直方向の熱伝導率を有する少なくとも1つの挿入物を含んでおり、前記小部分は前記本体の前記底面の一部も画定しており、前記ポケットのそれぞれは、前記ポケットに配置されたウェハを前記ポケットの前記床面から離間して配置するように、前記ポケットの周辺を囲むように分散配置された支持体を含んでいる、ウェハキャリア。
- 前記小部分は、前記上面よりも下方に後退した、前記ポケットの床面を画定している、請求項10に記載のウェハキャリア。
- 前記ポケットは円形である、請求項10に記載のウェハキャリア。
- 前記本体は、スピンドルに接続するように適合された取付具を含んでいる、請求項10に記載のウェハキャリア。
- 前記小部分は、前記主要部分にある前記穴の内部で前記主要部分と摩擦係合している、請求項10に記載のウェハキャリア。
- 前記境界部分は、前記主要部分と各小部分との間に界面を形成しており、該界面は、前記主要部分の前記垂直に延在する穴の壁に隣接している、請求項10に記載のウェハキャリア。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/855,739 | 2010-08-13 | ||
US12/855,739 US8535445B2 (en) | 2010-08-13 | 2010-08-13 | Enhanced wafer carrier |
PCT/US2011/046567 WO2012021370A1 (en) | 2010-08-13 | 2011-08-04 | Enhanced wafer carrier |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013541183A JP2013541183A (ja) | 2013-11-07 |
JP2013541183A5 JP2013541183A5 (ja) | 2014-09-18 |
JP5926730B2 true JP5926730B2 (ja) | 2016-05-25 |
Family
ID=44630557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013524866A Expired - Fee Related JP5926730B2 (ja) | 2010-08-13 | 2011-08-04 | 改良されたウェハキャリア |
Country Status (8)
Country | Link |
---|---|
US (1) | US8535445B2 (ja) |
EP (1) | EP2603927A1 (ja) |
JP (1) | JP5926730B2 (ja) |
KR (1) | KR101885747B1 (ja) |
CN (1) | CN103168353B (ja) |
SG (2) | SG187838A1 (ja) |
TW (1) | TWI488258B (ja) |
WO (1) | WO2012021370A1 (ja) |
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US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US10316412B2 (en) | 2012-04-18 | 2019-06-11 | Veeco Instruments Inc. | Wafter carrier for chemical vapor deposition systems |
US20130298831A1 (en) * | 2012-05-14 | 2013-11-14 | Bassam Shamoun | Automated process chamber cleaning in material deposition systems |
US20140084529A1 (en) * | 2012-09-26 | 2014-03-27 | Chae Hon KIM | Wafer carrier with pocket |
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GB201301124D0 (en) * | 2013-01-22 | 2013-03-06 | Oxford Instr Nanotechnology Tools Ltd | Substrate carrier |
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-
2010
- 2010-08-13 US US12/855,739 patent/US8535445B2/en not_active Expired - Fee Related
-
2011
- 2011-08-04 JP JP2013524866A patent/JP5926730B2/ja not_active Expired - Fee Related
- 2011-08-04 EP EP11746088.1A patent/EP2603927A1/en not_active Withdrawn
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- 2011-08-04 KR KR1020137006320A patent/KR101885747B1/ko active IP Right Grant
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- 2011-08-04 WO PCT/US2011/046567 patent/WO2012021370A1/en active Application Filing
- 2011-08-04 CN CN201180049258.5A patent/CN103168353B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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JP2013541183A (ja) | 2013-11-07 |
US8535445B2 (en) | 2013-09-17 |
CN103168353A (zh) | 2013-06-19 |
US20120040097A1 (en) | 2012-02-16 |
SG187838A1 (en) | 2013-03-28 |
WO2012021370A4 (en) | 2012-04-05 |
SG10201406101PA (en) | 2014-10-30 |
TW201214619A (en) | 2012-04-01 |
KR101885747B1 (ko) | 2018-08-06 |
WO2012021370A1 (en) | 2012-02-16 |
CN103168353B (zh) | 2016-08-03 |
EP2603927A1 (en) | 2013-06-19 |
TWI488258B (zh) | 2015-06-11 |
KR20130097184A (ko) | 2013-09-02 |
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