GB2014500B - Apparatus for use with vacuum chambers - Google Patents

Apparatus for use with vacuum chambers

Info

Publication number
GB2014500B
GB2014500B GB7906960A GB7906960A GB2014500B GB 2014500 B GB2014500 B GB 2014500B GB 7906960 A GB7906960 A GB 7906960A GB 7906960 A GB7906960 A GB 7906960A GB 2014500 B GB2014500 B GB 2014500B
Authority
GB
United Kingdom
Prior art keywords
vacuum chambers
chambers
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7906960A
Other versions
GB2014500A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB7906960A priority Critical patent/GB2014500B/en
Publication of GB2014500A publication Critical patent/GB2014500A/en
Application granted granted Critical
Publication of GB2014500B publication Critical patent/GB2014500B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
GB7906960A 1977-12-01 1979-02-27 Apparatus for use with vacuum chambers Expired GB2014500B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7906960A GB2014500B (en) 1977-12-01 1979-02-27 Apparatus for use with vacuum chambers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB5002177 1977-12-01
GB7906960A GB2014500B (en) 1977-12-01 1979-02-27 Apparatus for use with vacuum chambers

Publications (2)

Publication Number Publication Date
GB2014500A GB2014500A (en) 1979-08-30
GB2014500B true GB2014500B (en) 1982-02-10

Family

ID=26266595

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7906960A Expired GB2014500B (en) 1977-12-01 1979-02-27 Apparatus for use with vacuum chambers

Country Status (1)

Country Link
GB (1) GB2014500B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101750557B (en) * 2008-12-04 2013-02-20 三星显示有限公司 An aging test apparatus of display module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550044B1 (en) * 1983-07-05 1986-11-21 Parrens Pierre APPARATUS FOR PLASMA TREATMENT OF WAFER-LIKE SUBSTRATES
JPH07169746A (en) * 1993-12-14 1995-07-04 Ebara Corp Micromachining device using low-energy neutral particle beam
US20080188011A1 (en) * 2007-01-26 2008-08-07 Silicon Genesis Corporation Apparatus and method of temperature conrol during cleaving processes of thick film materials
US8535445B2 (en) * 2010-08-13 2013-09-17 Veeco Instruments Inc. Enhanced wafer carrier
US10777442B2 (en) * 2016-11-18 2020-09-15 Applied Materials, Inc. Hybrid substrate carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101750557B (en) * 2008-12-04 2013-02-20 三星显示有限公司 An aging test apparatus of display module

Also Published As

Publication number Publication date
GB2014500A (en) 1979-08-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee