JP5630935B2 - 工作物の熱誘起運動を抑制する機器及び装置 - Google Patents

工作物の熱誘起運動を抑制する機器及び装置 Download PDF

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Publication number
JP5630935B2
JP5630935B2 JP2006544191A JP2006544191A JP5630935B2 JP 5630935 B2 JP5630935 B2 JP 5630935B2 JP 2006544191 A JP2006544191 A JP 2006544191A JP 2006544191 A JP2006544191 A JP 2006544191A JP 5630935 B2 JP5630935 B2 JP 5630935B2
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Prior art keywords
workpiece
damping member
damping
distance
wafer
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Expired - Lifetime
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JP2006544191A
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Japanese (ja)
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JP2007519232A5 (enExample
JP2007519232A (ja
Inventor
カム、デーヴィッド、マルコム
バンブロヴィク、ムラデン
シベレ、ジョセフ
エリオット、キーファー、ジェイ．
マッコイ、スティーブ
ステュアート、グレッグ
Original Assignee
マトソン テクノロジー、インコーポレイテッド
マトソン テクノロジー、インコーポレイテッド
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Priority claimed from US10/742,575 external-priority patent/US9627244B2/en
Application filed by マトソン テクノロジー、インコーポレイテッド, マトソン テクノロジー、インコーポレイテッド filed Critical マトソン テクノロジー、インコーポレイテッド
Publication of JP2007519232A publication Critical patent/JP2007519232A/ja
Publication of JP2007519232A5 publication Critical patent/JP2007519232A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006544191A 2003-12-19 2004-12-17 工作物の熱誘起運動を抑制する機器及び装置 Expired - Lifetime JP5630935B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/742,575 US9627244B2 (en) 2002-12-20 2003-12-19 Methods and systems for supporting a workpiece and for heat-treating the workpiece
US10/742,575 2003-12-19
US56868504P 2004-05-07 2004-05-07
US60/568,685 2004-05-07
PCT/CA2004/002155 WO2005059991A1 (en) 2003-12-19 2004-12-17 Apparatuses and methods for suppressing thermally induced motion of a workpiece

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012158761A Division JP5926142B2 (ja) 2003-12-19 2012-07-17 工作物の熱誘起運動を抑制する機器及び装置

Publications (3)

Publication Number Publication Date
JP2007519232A JP2007519232A (ja) 2007-07-12
JP2007519232A5 JP2007519232A5 (enExample) 2008-02-14
JP5630935B2 true JP5630935B2 (ja) 2014-11-26

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JP2006544191A Expired - Lifetime JP5630935B2 (ja) 2003-12-19 2004-12-17 工作物の熱誘起運動を抑制する機器及び装置

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Country Link
US (1) US7501607B2 (enExample)
JP (1) JP5630935B2 (enExample)
WO (1) WO2005059991A1 (enExample)

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CN103843129B (zh) * 2011-09-30 2017-03-01 应用材料公司 具有温度控制的静电夹具
JP5964626B2 (ja) * 2012-03-22 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
KR20140091203A (ko) * 2013-01-10 2014-07-21 삼성전자주식회사 반도체의 잔류 응력 제거장치 및 잔류 응력 제거방법
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WO2022104028A1 (en) * 2020-11-13 2022-05-19 Massachusetts Institute Of Technology Reticle exchange device with reticle levitation
CN114608475A (zh) * 2022-02-28 2022-06-10 南京中安半导体设备有限责任公司 卡盘、相移式干涉仪及晶圆形貌干涉测量方法
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