JP5591129B2 - 超短パルスレーザによる透明材料処理 - Google Patents
超短パルスレーザによる透明材料処理 Download PDFInfo
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- JP5591129B2 JP5591129B2 JP2010549872A JP2010549872A JP5591129B2 JP 5591129 B2 JP5591129 B2 JP 5591129B2 JP 2010549872 A JP2010549872 A JP 2010549872A JP 2010549872 A JP2010549872 A JP 2010549872A JP 5591129 B2 JP5591129 B2 JP 5591129B2
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
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- B29C66/7336—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light
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- B29C66/73366—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light at least one of the parts to be joined being transparent or translucent to visible light both parts to be joined being transparent or translucent to visible light
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
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- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
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- C—CHEMISTRY; METALLURGY
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- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- B23K2103/00—Materials to be soldered, welded or cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
- B29C65/1658—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning once, e.g. contour laser welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/38—Impulse heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7316—Surface properties
- B29C66/73161—Roughness or rugosity
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/952—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the wavelength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/267—Marking of plastic artifacts, e.g. with laser
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Surface Treatment Of Glass (AREA)
- Lasers (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
光学的に透明な材料の切断は機械的な方法によって行われることが多い。おそらく、薄く平坦な材料を切断する最も一般的な方法は機械式ダイシングソーを使用することである。これは、シリコンウェハをダイシングするための、マイクロエレクトロニクス業界における標準的な方法である。しかし、この方法は、部品汚染を回避するために、管理されなければならないかなりの廃物を生じ、プロセスの総合コストの増加をもたらす。さらに、マイクロプロセッサ設計に使用される薄いウェハはダイシングソーによって切断されると飛散する傾向がある。
ガラス及びプラスチックスなどの2つ以上の光学的に透明な材料の接合は種々の産業の用途にとって有益である。光学的な透明性が機能を可能にするか又は補助する、或いはその他の方法でさらなる(例えば、美的な)価値をもたらす任意のタイプのデバイスの構築は、そのような接合プロセスから利益を得ることができる。一例は、目視検査が必要である(例えば、通信及び生体医療産業)コンポーネントの密閉封止である。
からなる。
サブ表面マークのガラスへのパターニングは、2−Dポートレート及び3−D彫刻作品を作るために芸術家によって適合されてきた。これらのマークは、外部照明を必要とすることなく、広範囲の条件下でよく見えるように設計される。
[図2]本発明の一実施形態による、収束されたガウス型ビームによって生成される表面及びバルクのスクライブフィーチャの図である。
[図3]本発明の一実施形態による、複数のサブ表面スクライブ線を生成するためにアクシコンレンズを使用するシステムの図である。
[図4]本発明の一実施形態で使用される収束されたガウス型非点収差ビームの強度等高線プロットである。
[図5]ターゲット材料に対して深さ方向に離間したビームウェストを有する複数の収束ビームを形成するように構成されるシステムを概略的に示す図である。
[図5a]複数の収束スポットを同時に生成するように構成された回折光学要素(diffractive optical element)(DOE)の図である。
[図5b]共線的な複数の収束ビームを迅速に形成するための種々の構成のうちの1つの構成を概略的に示す図である。
[図5c]共線的な複数の収束ビームを迅速に形成するための種々の構成のうちの1つの構成を概略的に示す図である。
[図5d]異なる深さで形成され、且つ、種々の形状及びコントラストを有するフィーチャの実施例を概略的に示す図である。
[図6]本発明の一実施形態による、透明材料を溶接する方法で使用されるシステムの図であり、aはシステムの略図を示し、bは隣接する材料内で収束するビームの詳細を示す拡大図である。
[図7]隆起したリッジが2つの片の間の隙間を充填するために使用される溶接プロセスの図であり、aは隙間を示し、bは下側片の表面のわずかに下にレーザビームを収束することによって形成される隆起を示し、cは隆起したリッジと接合される上側片との間の界面までレーザ焦点が移動するときに形成される溶接を示す。
[図8]矢印マークが、本発明に従って可能なマーキングの実施例として使用されたサブ表面マーキングの図を示す。
[図9]矢印マークが、本発明に従って可能なマーキングの実施例として使用されたサブ表面マーキングの図を示す。
[図10]矢印マークが、本発明に従って可能なマーキングの実施例として使用されたサブ表面マーキングの図を示す。
[図11]例示的なマークアスペクト比についてのエッジ照明及びマーク幾何学的形容を示す図である。
[図12a及び12b]基板のエッジから観察した、エッジ照明の2つの図であり、マークパターンを書き込むときのレーザビームの方向、及び、ビュアシステムがマークされたパターンを検出することになる方向を示す。
[図12a]基板表面が観察方向に直交せず、書き込みレーザビームが基板表面に直交し、マークが底部エッジから照明される図である。
[図12b]書き込みレーザビームが観察方向に平行であり、マークが底部エッジから照明される図である。
[図13a]反射マークの照明及び観察のための例示的な配置構成を概略的に示す図である。
[図13b]最適位置で観察されるマークの写真である。
[図13c]最適でない位置で観察されるマークの写真である。
[図13d]アクティブな照明がない状態で観察されるマークの写真である。
[図14]a、b及びcは、線収束光源によってエッジ照明された、単一基板内の異なる深さに書き込まれる2つのアイコンの写真である。
[図15]アレイ内の特定の要素の選択的な照明が、所望の離散的パターンを生成する多層デジタルカウンタアイコンを示す例示的な図である。
[図15a]微小マークが、2つの異なる基板間の界面で又は界面の近くで書き込まれ、一方の基板内の全反射が、パターンをエッジ照明するために使用される配置構成を示す図である。
[図16]薄いシート内へエッジ照明を結合するオフセットエッジ照明を示す図である。
[図17〜18]基板のエッジから観察された、非エッジ照明及び投影スクリーンの2つの図であり、マークパターンを書き込むときのレーザビームの方向及びマークされたパターンをビュアが見る方向を示す。
[図17]基板が観察方向に直交しないが、書き込みレーザの方向が基板に直交する図である。
[図18]基板が照明に直交せず、観察方向及び書き込みレーザビームの方向が観察方向に平行である図である。
[図19]レーザスクライビングの発明の一実施形態の実験結果を示す光学顕微鏡写真である。
[図20]本発明の一実施形態に従って溶接された溶融シリカを示す画像シーケンスにおいて、aは溶接部を破断する前の溶融シリカを示し、bは溶接部を破断した後の溶融シリカの底部表面を示し、cは溶接部を破断した後の溶融シリカの上部表面を示す。
[図21]本発明に従って作られたガラスマーキングされたサンプルの写真である。
[図22]本発明に従って作られたガラスマーキングされたサンプルの写真である。
[図23]本発明に従って作られたガラスマーキングされたサンプルの写真である。
[図24]a及びbは、長パルスレーザを使用したレーザマーキングによって作られた従来技術の装飾製品の写真、及びその個々のマークの写真である。
[図25]a及びbは、図11に示す略図と同様に配向した、ガラスから得られた断面の顕微鏡画像、及びポリカーボネートサンプルから得られた断面の顕微鏡画像である。
[図26a]強化ガラス及びサファイア材料サンプルに関して得られた種々の実験結果を示し、顕微鏡画像は、複数の深さ方向ロケーション及び種々の横方向(X−Y)ロケーションに収束されたビームを提供するIR/緑色の共線的多焦点ビーム発生器によって得られた結果を示す。
[図26b]強化ガラス及びサファイア材料サンプルに関して得られた種々の実験結果を示し、顕微鏡画像は、複数の深さ方向ロケーション及び種々の横方向(X−Y)ロケーションに収束されたビームを提供するIR/緑色の共線的多焦点ビーム発生器によって得られた結果を示す。
[図26c]強化ガラス及びサファイア材料サンプルに関して得られた種々の実験結果を示し、顕微鏡画像は、複数の深さ方向ロケーション及び種々の横方向(X−Y)ロケーションに収束されたビームを提供するIR/緑色の共線的多焦点ビーム発生器によって得られた結果を示す。
[図26d]強化ガラス及びサファイア材料サンプルに関して得られた種々の実験結果を示し、顕微鏡画像は、複数の深さ方向ロケーション及び種々の横方向(X−Y)ロケーションに収束されたビームを提供するIR/緑色の共線的多焦点ビーム発生器によって得られた結果を示す。
図1は、その後の割断のために透明材料をスクライブする方法である本発明の一実施形態を示す。この実施形態は、超短レーザパルスのビーム(2)を生成するレーザシステム(1)、所望のレーザビーム強度分布を生成する光学システム(6)、及びレーザパルスの波長に対して透明なスクライブされるターゲット材料(7)を使用する。さらに、Z軸ステージ(8)はビーム焦点位置(深さ)制御のために使用され、自動化されたX−Y軸ステージアセンブリ(9)は加工品(7)を収束したレーザビームに対して横方向に移動させるために必要とされる。或いは、走査ミラー(3)、(4)、及び(5)を使用して固定ターゲット材料に対してレーザビーム(2)が移動し得る。
本発明の別の実施形態は、透明材料のレーザ溶接のためのプロセスに関する。図6に示すように、本実施形態は、高繰返しレートの超短レーザパルスビーム(51)を生成するレーザシステム(50)、十分な収束パワーの収束要素(55)(例えば、レンズ、顕微鏡対物レンズ)、及び、その少なくとも一方がレーザの波長に対して透明である、一緒に接合される少なくとも2つの材料(56)及び(57)の使用を必要とする。さらに、ビーム焦点ポジショニングステージ(58)はレーザビーム(51)の焦点位置を調整するために使用され、自動化された動きステージアセンブリ(59)は加工品(56)及び(57)を収束されたレーザビームに対して移動するために一般に必要とされる。
図1aに示す同じシステムが、透明材料内にサブ表面マークを作るために使用され、印加されるレーザビームは透明材料基板の表面の下に収束される。
フィーチャ、例えば、マークの可視性トレードオフは、一般に、
照明されるとはっきり見える(オン可視性)
照明されないと見るのが難しい(ほとんど見えない)(オフ可視性)
として規定されてもよい。
図8〜12及び14は透明材料内のサブ表面マークの実施例を示す。サブ表面マークは、マークを形成する局在化したミクロクラックから散乱する光のために見えた。マークは、観察方向に垂直なマークの断面積と比較して、エッジ照明に垂直な方向に実質的に大きな断面積を有する。そのため、マークはエッジ照明によってより明瞭に見え、エッジ照明がない場合、ほとんど見えない。
図14は、2つのアイコンが単一基板に書き込まれる多層アイコンディスプレイの実例を示す。図14aの緑色矢印は基板の右にある緑色光源によってエッジ照明されている。図14bの赤色ハザードサインは基板の上部にある赤色光源によってエッジ照明されている。図14cは両方の光源がオフであるときの基板を示す。両方のアイコンはガラス基板の同じ領域内にあるように見える。個々のアイコンは各光源を切換えることによって選択的に照明され得る。その理由は、レーザ書き込みマークがガラス内の異なる深さにあり、2つの光源が、線焦点の軸がガラス基板の平面に平行である円柱レンズを使用して線収束されるからである。
一部の実施形態では、アイコンは非エッジロケーションから照明される。図17は、基板が、照明及び観察方向に対して直交しないアイコンの非エッジ照明を示す図である。しかし、書き込み方向は基板に対して直交した。
先の実施例では、グラフィカルパターンはターゲット材料に書き込まれる。これは、後でパターンが変更されるか又は再プログラムされることができないため、ディスプレイの柔軟性を制限する。微小マークの大きく均一なフィールドもまた、スクリーンとして使用されることができ、グラフィクスは、迅速走査ミラー又はLEDのアレイなどの異なる方法を使用して投影される。
種々の実施形態では、アイコンの処理条件は可視性トレードオフについて最適化されてもよい。より速い併進速度又はより低いパルスエネルギーなどの異なる処理条件を使用して、少なく散乱するマークを作ることが可能である。これらのパラメータを制御することによって、「より白い(whiter)」領域が少ない光を散乱し、「より黒い(blacker)」領域がより多くの光を散乱する、又は、その逆である「グレースケール(grayscale)」アイコンを生成することが可能である。
一部の実施形態では、ガラス以外の材料の表面及び/又はバルクが修正されてもよい。1つ以上のレーザビームが、照明及び検出のための適した配置構成によって検出可能なフィーチャを形成する可能性がある。
スクライビングに加えて、図5に示す多焦点機械加工が、切断、溶接、接合、マーキング、又は他の機械加工動作に利用されてもよい。
1.超短パルスレーザスクライビング
図19に示すように、レーザビームの1回のパスによって、20X非球面収束対物レンズ(焦点長8mm)を使用して、一対のスクライブ線(表面溝(70)及びサブ表面スクライブフィーチャ(71))が100μm厚サファイアウェハ内に同時に機械加工された。割段小面は良好な品質を示している。走査速度は40mm/秒であった(最適化されていない)。
多数のレーザパルスが、溶接される材料の特定の領域内に吸収された後、加熱、溶融、及び材料の混合が起こり、冷却すると別個の材料が一緒に融着される。材料を一緒に溶接するのに必要なパルス数は、他のプロセス変数(レーザエネルギー、パルス繰返しレート、集光幾何学形状など)並びに材料の物理特性に依存する。例えば、高熱伝導率と高融点の組合せを有する材料は、溶接が起きるための照射容積内で十分な熱の蓄積を達成するために、より高いパルス繰返しレート及びより低い併進速度を必要とする。
200kHzのパルス繰返しレートで動作し、且つ、1045nmの波長を有する高繰返しレートのフェムト秒パルスレーザ源による実験は2つの光学的に透明な材料のレーザ接合をもたらした。特に、約2μJレーザパルスは、100mm焦点長レンズによって、1/4インチ厚さの透明ポリカーボネート片の上部表面を通り、同じサイズの透明ポリカーボネート片の上部表面と底部表面の界面に収束された。ポリカーボネート片は材料の界面近くへのビーム焦点領域の位置決めを維持しながら、直線的に且つレーザ伝搬方向に垂直な平面内で併進した。2つの片はレーザ照射界面で一緒に融着され、両者を破断させて、互いに自由にするためにかなりの力が必要とされた。
図21は、側面から緑色光源によって照明された矢印マークを有するガラスサンプルを示す。ここでは、矢印パターンが明瞭に見える。図8〜10の図は矢印パターンの詳細を示し、照明光源に垂直な、異なる深さの線(この場合、緑色)はレーザ光を厳密収束させることによって生成された。こうしたマークを形成するために使用されるレーザパラメータ及び走査速度は以下の表に見出され得る。
実験は、図5cに示した波長結合プロセスを使用して実施され、また、種々の深さにおけるフィーチャ形成を試験し、飛散を回避するようにパラメータを調整する予備的な単一ビーム実験を含んだ。ソーダライムガラス、強化ガラス、及びサファイアサンプルが処理された。1mm厚を有するソーダライムガラス(例えば、顕微鏡スライド)は、その低いレーザ修正閾値及び低コストのために最初に試験された。強化ガラス及びサファイアは広範な工業的使用及びレーザ機械加工に関する潜在的な挑戦のために、かなり重要である。
強化ガラスをスクライブし、破断する能力が、2波長、複数ビーム処理を含む超短レーザパルスによって試験された。カバーガラス板700μmがこれらの実験で利用された。市販のある強化ガラスは、携帯型電子機器のために、例えば、化学強化表面を有するタッチスクリーンとして使用するために特に設計され、700μm〜2mmの厚さを有する。
考えられる飛散を回避するために、レーザ曝露線は、サンプルの前部表面の下、約240μmで最初に試験され、次に、表面の上、約120μmまで徐々に上げられた。FCPA μJewel D−1000レーザシステムは、以下のパラメータで、強化ガラスをスクライブするために使用された。
レーザ:IMRA FCPA μJewel D−1000
波長:523nmのSHG
パルス繰返しレート:100kHz
収束レンズ:SHG用にコーティングされた16X非球面
レーザパワー:400mW SHG
スキャン速度:20mm/秒
焦点深さ:−240μm(内部)から+120μm(表面の上)
ガラスは、その後、スクライブ及び破断プロセスについて試験された。最初に、20mm/秒のスキャン速度、400mWのSHGパワー、及び−30μmのレーザ焦点によって形成された単一表面アブレーション線が使用された。図26b−1はクラックのトレース(左)及び表面粗さのトレース(右)に関してガラスの破断小面を示す。
共線的2色スクライブもまた、強化ガラスについて試験された。広い範囲のパワーの組合せ(SHG及びIR)が利用された。ガラスは、以下のパラメータによって、明瞭に破断した。
レーザ:IMRA FCPA μJewel D−1000
パルス繰返しレート:100kHz
波長:SHG及びIR
パワー:150mW SHG及び460mW IR
焦点:IRは表面、SHGは、表面の下、約200μm
スキャン速度:20mm/秒
実験はまた、サファイアに関して実施された。2つの別個の基板フィーチャが生成された。しかし、スクライブ線に沿う有効な破断は得られなかった。この試験ウェハの処理は、基板フィーチャのサイズに対して約0.5mmのウェハ厚によって制限される可能性がある。こうした大きな厚さは、生成されるスクライブ修正のサイズについて過剰である可能性がある。図26dの各深さにおける2つの線は25μmだけ分離されている。異なる深さにおけるさらなる共線的スクライブパスは許容可能な割断結果を提供することが予想される。
こうして、本発明者等は、超短レーザパルスによる透明材料処理のための方法及びシステム並びにそれらから作られる製品を開示した。プロセスは、切断、スクライビング、溶接、マーキング、及び/又は接合を含むが、それに限定されない。空間的及び時間的処理の種々の組合せ、例えば、順次処理又は並列処理が利用されてもよい。
Claims (12)
- 透明材料の修正のためのレーザベースシステムであって、
パルスレーザ出力を生成するパルスレーザ装置、
前記出力を受け取る多焦点ビーム発生器であって、前記出力を使用して複数の収束ビームを形成するように構成され、各収束ビームがビームウェストを有し、前記ビームウェストが前記材料に対して深さ方向に離間し、前記複数の収束ビームの少なくとも1つのビームウェストが、前記材料内にあり、且つ、前記材料の修正をもたらす、多焦点ビーム発生器、
前記材料と前記収束ビームとの間に相対的な動きを生成する動きシステム、及び、
前記パルスレーザ装置及び前記動きシステムに結合され、前記複数の収束ビームが前記相対的な動きの間に形成されるように前記システムを制御するコントローラ
を備え、
前記多焦点ビーム発生器が波長変換器を備え、前記収束ビームが複数の波長からなり、
第1の波長がIR波長であり、第2の波長が前記材料の吸収端より長い可視波長又は近UV波長であり、
前記多焦点ビーム発生器が、複数の光学経路に沿ってビームを伝搬させるように構成されたビームスプリッタ及びビームコンバイナ、並びに、前記ビームの焦点を制御し、前記深さ方向に離間したビームウェストを形成するように構成された収束要素を備える、レーザベースシステム。 - 透明材料の修正のためのレーザベースシステムであって、
パルスレーザ出力を生成するパルスレーザ装置、
前記出力を受け取る多焦点ビーム発生器であって、前記出力を使用して複数の収束ビームを形成するように構成され、各収束ビームがビームウェストを有し、前記ビームウェストが前記材料に対して深さ方向に離間し、前記複数の収束ビームの少なくとも1つのビームウェストが、前記材料内にあり、且つ、前記材料の修正をもたらす、多焦点ビーム発生器、
前記材料と前記収束ビームとの間に相対的な動きを生成する動きシステム、及び、
前記パルスレーザ装置及び前記動きシステムに結合され、前記複数の収束ビームが前記相対的な動きの間に形成されるように前記システムを制御するコントローラ
を備え、
前記多焦点ビーム発生器が波長変換器を備え、前記収束ビームが複数の波長からなり、
第1の波長がIR波長であり、第2の波長が前記材料の吸収端より長い可視波長又は近UV波長であり、
前記コントローラが前記多焦点ビーム発生器に結合され、前記コントローラ及び前記多焦点ビーム発生器が偏光、波長、フルエンス、及びビームウェスト位置の少なくとも1つを制御するように構成されている、レーザベースシステム。 - 請求項1又は2に記載のレーザベースシステムであって、前記深さ方向に離間したビームウェストが、前記収束ビームの伝搬方向に沿った共線的な位置に形成される、レーザベースシステム。
- 請求項1乃至3のいずれか1項に記載のレーザシステムであって、前記複数の収束ビームが、ある照射時間間隔中に形成され、前記時間間隔中の前記相対的な動きが、収束ビームのほぼビームウェスト径未満の相対的変位を生成し、前記深さ方向に離間したビームウェストが、前記表面に対してほぼ垂直方向に沿って形成される、レーザベースシステム。
- 請求項1乃至4のいずれか1項に記載のレーザベースシステムであって、前記収束ビームが約10ns未満の照射時間間隔中に形成され、前記相対的な動きが約1mm/秒〜約10m/秒の範囲の速度からなる、レーザベースシステム。
- 請求項1乃至5のいずれか1項に記載のレーザベースシステムであって、少なくとも1つの生成されたパルス出力が約10fs〜100psの範囲のパルス幅を有するレーザパルスからなるレーザベースシステム。
- 請求項1乃至6のいずれか1項に記載のレーザベースシステムであって、ビーム偏向器を備えるとともに、前記材料と前記ビーム偏向器との間に配設されたスキャンレンズを備えるレーザベースシステム。
- 請求項1乃至7のいずれか1項に記載のレーザベースシステムであって、前記パルスレーザ装置が約10Khz〜100Mhzの範囲の繰返しレートのレーザ出力パルスを生成し、前記多焦点ビーム発生器が前記繰返しレートで前記複数の収束ビームを形成するように構成されている、レーザベースシステム。
- 請求項1乃至8のいずれか1項に記載のレーザベースシステムであって、前記複数のビームが同時に形成される、レーザベースシステム。
- 請求項1乃至9のいずれか1項に記載のレーザベースシステムであって、前記複数の収束ビームは、前記透明材料上又は前記透明材料内に複数のフィーチャを形成し、前記フィーチャの各々は、厳密焦点に係るドット形状フィーチャから、幅方向に対する深さ方向の大きなアスペクト比を有する細長いフィーチャまでの範囲の制御された長手方向スパンを有することを特徴とする、レーザベースシステム。
- 透明材料の修正のためのレーザベースシステムであって、
パルスレーザ出力を生成するパルスレーザ装置、
前記出力を受け取る多焦点ビーム発生器であって、前記出力を使用して複数の収束ビームを形成するように構成され、各収束ビームがビームウェストを有し、前記ビームウェストが前記材料に対して深さ方向に離間し、前記複数の収束ビームの少なくとも1つのビームウェストが、前記材料内にあり、且つ、前記材料の修正をもたらす、多焦点ビーム発生器、
前記材料と前記収束ビームとの間に相対的な動きを生成する動きシステム、及び、
前記パルスレーザ装置及び前記動きシステムに結合され、前記複数の収束ビームが前記相対的な動きの間に形成されるように前記システムを制御するコントローラ
を備え、
前記収束ビームが複数の偏光を含み、
前記多焦点ビーム発生器が、複数の光学経路に沿ってビームを伝搬させるように構成された偏光ビームスプリッタ、及び、前記ビームの焦点を制御し、前記深さ方向に離間したビームウェストを形成するように構成された収束要素を備える、レーザベースシステム。 - 請求項11に記載のレーザベースシステムであって、前記コントローラは前記多焦点ビーム発生器に結合され、前記コントローラ及び前記多焦点ビーム発生器が偏光、フルエンス、及びビームウェスト位置の少なくとも1つを制御するように構成されている、レーザベースシステム
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WO2009114375A2 (en) | 2009-09-17 |
CN101965242A (zh) | 2011-02-02 |
JP2017024083A (ja) | 2017-02-02 |
JP2014037006A (ja) | 2014-02-27 |
WO2009114375A3 (en) | 2010-01-07 |
KR20100120297A (ko) | 2010-11-15 |
US20100025387A1 (en) | 2010-02-04 |
JP2011517299A (ja) | 2011-06-02 |
KR101690335B1 (ko) | 2016-12-27 |
CN104290319A (zh) | 2015-01-21 |
US9138913B2 (en) | 2015-09-22 |
US20160067822A1 (en) | 2016-03-10 |
CN101965242B (zh) | 2015-01-28 |
JP6034269B2 (ja) | 2016-11-30 |
CN104290319B (zh) | 2017-03-01 |
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