JP5209197B2 - 熱およびプラズマ増強蒸着のための装置および操作方法 - Google Patents

熱およびプラズマ増強蒸着のための装置および操作方法 Download PDF

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JP5209197B2
JP5209197B2 JP2006311396A JP2006311396A JP5209197B2 JP 5209197 B2 JP5209197 B2 JP 5209197B2 JP 2006311396 A JP2006311396 A JP 2006311396A JP 2006311396 A JP2006311396 A JP 2006311396A JP 5209197 B2 JP5209197 B2 JP 5209197B2
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substrate
deposition
assembly
processing space
space
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JP2007162131A (ja
JP2007162131A5 (enExample
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一成 李
忠大 石坂
薫 山本
淳 五味
正道 原
敏章 藤里
ジャック・ファーゲ
寧 水澤
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Tokyo Electron Ltd
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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    • C23C16/5096—Flat-bed apparatus
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    • H01—ELECTRIC ELEMENTS
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    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

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JP2006311396A 2005-11-18 2006-11-17 熱およびプラズマ増強蒸着のための装置および操作方法 Active JP5209197B2 (ja)

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