JP5129136B2 - テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 - Google Patents
テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 Download PDFInfo
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- JP5129136B2 JP5129136B2 JP2008527198A JP2008527198A JP5129136B2 JP 5129136 B2 JP5129136 B2 JP 5129136B2 JP 2008527198 A JP2008527198 A JP 2008527198A JP 2008527198 A JP2008527198 A JP 2008527198A JP 5129136 B2 JP5129136 B2 JP 5129136B2
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- Prior art keywords
- layer
- forming
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- etching
- electrode
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0163—Spring holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/019—Suspended structures, i.e. structures allowing a movement characterized by their profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0307—Anchors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S359/00—Optical: systems and elements
- Y10S359/90—Methods
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71001905P | 2005-08-19 | 2005-08-19 | |
| US60/710,019 | 2005-08-19 | ||
| PCT/US2006/032516 WO2007022479A1 (en) | 2005-08-19 | 2006-08-17 | Methods for forming layers within a mems device to achieve a tapered edge |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012031420A Division JP2012161913A (ja) | 2005-08-19 | 2012-02-16 | テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009505163A JP2009505163A (ja) | 2009-02-05 |
| JP2009505163A5 JP2009505163A5 (enExample) | 2009-10-01 |
| JP5129136B2 true JP5129136B2 (ja) | 2013-01-23 |
Family
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Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008527197A Expired - Fee Related JP5180076B2 (ja) | 2005-08-19 | 2006-08-17 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
| JP2008527198A Expired - Fee Related JP5129136B2 (ja) | 2005-08-19 | 2006-08-17 | テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 |
| JP2012031420A Pending JP2012161913A (ja) | 2005-08-19 | 2012-02-16 | テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 |
| JP2012251991A Withdrawn JP2013068959A (ja) | 2005-08-19 | 2012-11-16 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
| JP2015002426A Pending JP2015064614A (ja) | 2005-08-19 | 2015-01-08 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
| JP2015122422A Pending JP2015195717A (ja) | 2005-08-19 | 2015-06-01 | 発電装置用等の回転装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008527197A Expired - Fee Related JP5180076B2 (ja) | 2005-08-19 | 2006-08-17 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012031420A Pending JP2012161913A (ja) | 2005-08-19 | 2012-02-16 | テーパ縁を実現するために、ｍｅｍｓデバイス内に層を形成するための方法 |
| JP2012251991A Withdrawn JP2013068959A (ja) | 2005-08-19 | 2012-11-16 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
| JP2015002426A Pending JP2015064614A (ja) | 2005-08-19 | 2015-01-08 | 応力に起因する変形を最小限に抑えるように構成された支持構造を有するｍｅｍｓデバイス、およびその製造方法 |
| JP2015122422A Pending JP2015195717A (ja) | 2005-08-19 | 2015-06-01 | 発電装置用等の回転装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (9) | US7486867B2 (enExample) |
| EP (3) | EP2495212A3 (enExample) |
| JP (6) | JP5180076B2 (enExample) |
| KR (2) | KR20080055849A (enExample) |
| CN (3) | CN102320562A (enExample) |
| TW (3) | TW200713414A (enExample) |
| WO (3) | WO2007022528A1 (enExample) |
Families Citing this family (123)
| Publication number | Priority date | Publication date | Assignee | Title |
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2010
- 2010-02-08 US US12/702,132 patent/US7835093B2/en not_active Expired - Fee Related
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2012
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2015
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