AU7881400A - Assembly process for delicate silicon structures - Google Patents
Assembly process for delicate silicon structuresInfo
- Publication number
- AU7881400A AU7881400A AU78814/00A AU7881400A AU7881400A AU 7881400 A AU7881400 A AU 7881400A AU 78814/00 A AU78814/00 A AU 78814/00A AU 7881400 A AU7881400 A AU 7881400A AU 7881400 A AU7881400 A AU 7881400A
- Authority
- AU
- Australia
- Prior art keywords
- assembly process
- silicon structures
- delicate silicon
- delicate
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00896—Temporary protection during separation into individual elements
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37941499A | 1999-08-24 | 1999-08-24 | |
US09379414 | 1999-08-24 | ||
PCT/US2000/040661 WO2001014248A2 (en) | 1999-08-24 | 2000-08-16 | Assembly process for delicate silicon structures |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7881400A true AU7881400A (en) | 2001-03-19 |
Family
ID=23497168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU78814/00A Abandoned AU7881400A (en) | 1999-08-24 | 2000-08-16 | Assembly process for delicate silicon structures |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU7881400A (en) |
WO (1) | WO2001014248A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US7012726B1 (en) * | 2003-11-03 | 2006-03-14 | Idc, Llc | MEMS devices with unreleased thin film components |
EP2495212A3 (en) | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
DE102006002106B4 (en) * | 2006-01-17 | 2016-03-03 | Robert Bosch Gmbh | Micromechanical sensor with perforation-optimized membrane as well as a suitable production process |
US7547568B2 (en) | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
GB2443756B (en) | 2006-02-24 | 2010-03-17 | Wolfson Microelectronics Plc | MEMS device |
US7706042B2 (en) | 2006-12-20 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | MEMS device and interconnects for same |
WO2010103410A1 (en) | 2009-03-09 | 2010-09-16 | Nxp B.V. | Microphone and accelerometer |
FI124072B (en) | 2009-05-29 | 2014-03-14 | Valtion Teknillinen | Micromechanical Fabry-Perot Adjustable Interferometer, Intermediate, and Method of Manufacture |
US8659816B2 (en) | 2011-04-25 | 2014-02-25 | Qualcomm Mems Technologies, Inc. | Mechanical layer and methods of making the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2115947A1 (en) * | 1993-03-03 | 1994-09-04 | Gregory C. Smith | Wafer-like processing after sawing dmds |
US5389182A (en) * | 1993-08-02 | 1995-02-14 | Texas Instruments Incorporated | Use of a saw frame with tape as a substrate carrier for wafer level backend processing |
US5534466A (en) * | 1995-06-01 | 1996-07-09 | International Business Machines Corporation | Method of making area direct transfer multilayer thin film structure |
US5573679A (en) * | 1995-06-19 | 1996-11-12 | Alberta Microelectronic Centre | Fabrication of a surface micromachined capacitive microphone using a dry-etch process |
-
2000
- 2000-08-16 AU AU78814/00A patent/AU7881400A/en not_active Abandoned
- 2000-08-16 WO PCT/US2000/040661 patent/WO2001014248A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2001014248A2 (en) | 2001-03-01 |
WO2001014248A3 (en) | 2001-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |