AU7881400A - Assembly process for delicate silicon structures - Google Patents

Assembly process for delicate silicon structures

Info

Publication number
AU7881400A
AU7881400A AU78814/00A AU7881400A AU7881400A AU 7881400 A AU7881400 A AU 7881400A AU 78814/00 A AU78814/00 A AU 78814/00A AU 7881400 A AU7881400 A AU 7881400A AU 7881400 A AU7881400 A AU 7881400A
Authority
AU
Australia
Prior art keywords
assembly process
silicon structures
delicate silicon
delicate
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU78814/00A
Inventor
Peter V. Loeppert
Michael Pedersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US37941499A priority Critical
Priority to US09379414 priority
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Priority to PCT/US2000/040661 priority patent/WO2001014248A2/en
Publication of AU7881400A publication Critical patent/AU7881400A/en
Application status is Abandoned legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865Multistep processes for the separation of wafers into individual elements
    • B81C1/00896Temporary protection during separation into individual elements
AU78814/00A 1999-08-24 2000-08-16 Assembly process for delicate silicon structures Abandoned AU7881400A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US37941499A true 1999-08-24 1999-08-24
US09379414 1999-08-24
PCT/US2000/040661 WO2001014248A2 (en) 1999-08-24 2000-08-16 Assembly process for delicate silicon structures

Publications (1)

Publication Number Publication Date
AU7881400A true AU7881400A (en) 2001-03-19

Family

ID=23497168

Family Applications (1)

Application Number Title Priority Date Filing Date
AU78814/00A Abandoned AU7881400A (en) 1999-08-24 2000-08-16 Assembly process for delicate silicon structures

Country Status (2)

Country Link
AU (1) AU7881400A (en)
WO (1) WO2001014248A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7012726B1 (en) * 2003-11-03 2006-03-14 Idc, Llc MEMS devices with unreleased thin film components
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
DE102006002106B4 (en) * 2006-01-17 2016-03-03 Robert Bosch Gmbh Micromechanical sensor with perforation-optimized membrane as well as a suitable production process
US7547568B2 (en) 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
GB2454603B (en) 2006-02-24 2010-05-05 Wolfson Microelectronics Plc Mems device
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
EP2406964B1 (en) 2009-03-09 2013-04-17 Nxp B.V. Microphone and accelerometer
FI124072B (en) 2009-05-29 2014-03-14 Valtion Teknillinen Micromechanical Fabry-Perot Adjustable Interferometer, Intermediate, and Method of Manufacture
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2115947A1 (en) * 1993-03-03 1994-09-04 Gregory C. Smith Wafer-like processing after sawing dmds
US5389182A (en) * 1993-08-02 1995-02-14 Texas Instruments Incorporated Use of a saw frame with tape as a substrate carrier for wafer level backend processing
US5534466A (en) * 1995-06-01 1996-07-09 International Business Machines Corporation Method of making area direct transfer multilayer thin film structure
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process

Also Published As

Publication number Publication date
WO2001014248A2 (en) 2001-03-01
WO2001014248A3 (en) 2001-10-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase