AU6784800A - Wafer holder assembly - Google Patents

Wafer holder assembly

Info

Publication number
AU6784800A
AU6784800A AU67848/00A AU6784800A AU6784800A AU 6784800 A AU6784800 A AU 6784800A AU 67848/00 A AU67848/00 A AU 67848/00A AU 6784800 A AU6784800 A AU 6784800A AU 6784800 A AU6784800 A AU 6784800A
Authority
AU
Australia
Prior art keywords
holder assembly
wafer holder
wafer
assembly
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67848/00A
Inventor
Robert S. Andrews
Julian G. Blake
Bernhard F. Cordts Iii
Geoffrey Ryding
Theodore H. Smick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibis Technology Corp
Original Assignee
Ibis Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/376,505 external-priority patent/US6423975B1/en
Priority claimed from US09/376,799 external-priority patent/US6155436A/en
Priority claimed from US09/377,028 external-priority patent/US6433342B1/en
Priority claimed from US09/376,506 external-priority patent/US6452195B1/en
Application filed by Ibis Technology Corp filed Critical Ibis Technology Corp
Publication of AU6784800A publication Critical patent/AU6784800A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
AU67848/00A 1999-08-18 2000-08-17 Wafer holder assembly Abandoned AU6784800A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US09/376,505 US6423975B1 (en) 1999-08-18 1999-08-18 Wafer holder for simox processing
US09376506 1999-08-18
US09376799 1999-08-18
US09376505 1999-08-18
US09377028 1999-08-18
US09/376,799 US6155436A (en) 1999-08-18 1999-08-18 Arc inhibiting wafer holder assembly
US09/377,028 US6433342B1 (en) 1999-08-18 1999-08-18 Coated wafer holding pin
US09/376,506 US6452195B1 (en) 1999-08-18 1999-08-18 Wafer holding pin
PCT/US2000/022677 WO2001013410A1 (en) 1999-08-18 2000-08-17 Wafer holder assembly

Publications (1)

Publication Number Publication Date
AU6784800A true AU6784800A (en) 2001-03-13

Family

ID=27503145

Family Applications (1)

Application Number Title Priority Date Filing Date
AU67848/00A Abandoned AU6784800A (en) 1999-08-18 2000-08-17 Wafer holder assembly

Country Status (5)

Country Link
EP (1) EP1208587A1 (en)
JP (1) JP2003531471A (en)
KR (1) KR20020041412A (en)
AU (1) AU6784800A (en)
WO (1) WO2001013410A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2390476B (en) * 2002-07-03 2005-08-03 Applied Materials Inc Improved method and apparatus for reducing cross contamination of species during ion implantation
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
JP6037734B2 (en) * 2012-09-07 2016-12-07 三菱重工工作機械株式会社 Room temperature bonding apparatus and room temperature bonding method
AT14861U1 (en) * 2015-03-02 2016-07-15 Plansee Se ion implanter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410209A (en) * 1982-03-11 1983-10-18 Trapani Silvio P Wafer-handling tool
JPH02236940A (en) * 1989-03-08 1990-09-19 Mitsubishi Electric Corp Ion implantation apparatus
US5095300A (en) * 1990-03-28 1992-03-10 Nec Electronics Inc. Device for sensing side positioning of wafers
JPH0963531A (en) * 1995-08-23 1997-03-07 Nippon Steel Corp Device for fixing member to be ion-implantated in ion implanter

Also Published As

Publication number Publication date
WO2001013410A9 (en) 2001-08-16
EP1208587A1 (en) 2002-05-29
WO2001013410A1 (en) 2001-02-22
KR20020041412A (en) 2002-06-01
JP2003531471A (en) 2003-10-21

Similar Documents

Publication Publication Date Title
AU6754600A (en) Dual wafer attachment process
AU1173201A (en) Skin-gripper
AU3092999A (en) Digital-timeshare-exchange
AU2186300A (en) Cup holder
AU2001249533A1 (en) Wafer carrier head assembly
AU5547900A (en) Sample holder
AUPQ441499A0 (en) Novel compound
AU4115400A (en) Short-circuiter
AU6070500A (en) Wafer container
AU2023701A (en) Sketcher
AU2804600A (en) Arylaminoalkylamides
AU2699800A (en) Organoceramics
AU5084600A (en) Cup holder
AU7273000A (en) Novel processes
AU2359301A (en) Novel ss-defensins
AU4026400A (en) Clamp assembly
AU6784800A (en) Wafer holder assembly
AU1038501A (en) Novel processes
AU3834199A (en) Holder
AU5787901A (en) Compound
AU1901801A (en) Glucofuranoses
AU4435300A (en) Hula-hoop
AU2582200A (en) Windturbine
AU1915601A (en) Periotome
AU2290401A (en) Novel processes

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase