AU2001249533A1 - Wafer carrier head assembly - Google Patents

Wafer carrier head assembly

Info

Publication number
AU2001249533A1
AU2001249533A1 AU2001249533A AU4953301A AU2001249533A1 AU 2001249533 A1 AU2001249533 A1 AU 2001249533A1 AU 2001249533 A AU2001249533 A AU 2001249533A AU 4953301 A AU4953301 A AU 4953301A AU 2001249533 A1 AU2001249533 A1 AU 2001249533A1
Authority
AU
Australia
Prior art keywords
head assembly
wafer carrier
carrier head
wafer
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249533A
Inventor
Glenn W. Travis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001249533A1 publication Critical patent/AU2001249533A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001249533A 2000-03-31 2001-03-28 Wafer carrier head assembly Abandoned AU2001249533A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09540603 2000-03-31
US09/540,603 US6666756B1 (en) 2000-03-31 2000-03-31 Wafer carrier head assembly
PCT/US2001/009878 WO2001074536A2 (en) 2000-03-31 2001-03-28 Carrier head providing uniform upward and downward force on a wafer

Publications (1)

Publication Number Publication Date
AU2001249533A1 true AU2001249533A1 (en) 2001-10-15

Family

ID=24156160

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249533A Abandoned AU2001249533A1 (en) 2000-03-31 2001-03-28 Wafer carrier head assembly

Country Status (7)

Country Link
US (1) US6666756B1 (en)
EP (1) EP1268131A2 (en)
JP (1) JP5072161B2 (en)
KR (1) KR100841723B1 (en)
AU (1) AU2001249533A1 (en)
TW (1) TW480206B (en)
WO (1) WO2001074536A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US7255637B2 (en) 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
WO2002096601A1 (en) * 2001-05-29 2002-12-05 Ebara Corporation Polishing apparatus and polishing method
KR100416808B1 (en) * 2002-02-04 2004-01-31 삼성전자주식회사 Polishing head of chemical mechanical polishing apparatus for manufacturing semiconductor device and chemical mechanical polishing apparatus having it
US7355641B2 (en) * 2003-01-10 2008-04-08 Matsushita Electric Industrial Co., Ltd. Solid state imaging device reading non-adjacent pixels of the same color
CN101023429B (en) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 Method and system for use in processing wafers
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
US9272387B2 (en) 2011-04-13 2016-03-01 Applied Materials, Inc. Carrier head with shims
WO2014078151A1 (en) * 2012-11-16 2014-05-22 Applied Materials, Inc. Recording measurements by sensors for a carrier head
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
TWI609991B (en) * 2013-06-05 2018-01-01 維克儀器公司 Improved wafer carrier having thermal uniformity-enhancing features
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
TWI650832B (en) 2013-12-26 2019-02-11 維克儀器公司 Wafer carrier having thermal cover for chemical vapor deposition systems
KR102173323B1 (en) * 2014-06-23 2020-11-04 삼성전자주식회사 Carrier head, chemical mechanical polishing apparatus and wafer polishing method
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
RU2695956C2 (en) * 2018-01-25 2019-07-29 Общество с ограниченной ответственностью "Спецлак" (ООО "Спецлак") Vegetable oil oxidation control method in drying oil production
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
CN109794846A (en) * 2019-01-23 2019-05-24 常德翔宇设备制造有限公司 A kind of polisher lapper

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2606405A (en) 1946-08-17 1952-08-12 Bell Telephone Labor Inc Polishing means and method
US3579916A (en) 1968-11-15 1971-05-25 Speedfam Corp Polishing machine
US3631634A (en) 1970-01-26 1972-01-04 John L Weber Polishing machine
US3708921A (en) 1970-08-17 1973-01-09 Monsanto Co Apparatus and process for polishing semiconductor or similar materials
US3691694A (en) 1970-11-02 1972-09-19 Ibm Wafer polishing machine
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3747282A (en) 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers
HU167643B (en) 1973-04-24 1975-11-28
US3924361A (en) 1973-05-29 1975-12-09 Rca Corp Method of shaping semiconductor workpieces
US3888053A (en) 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece
US3833230A (en) 1973-09-13 1974-09-03 Corning Glass Works Vacuum chuck
US3986433A (en) 1974-10-29 1976-10-19 R. Howard Strasbaugh, Inc. Lap milling machine
US4009539A (en) 1975-06-16 1977-03-01 Spitfire Tool & Machine Co., Inc. Lapping machine with vacuum workholder
US4020600A (en) 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4098031A (en) 1977-01-26 1978-07-04 Bell Telephone Laboratories, Incorporated Method for lapping semiconductor material
US4132037A (en) 1977-02-28 1979-01-02 Siltec Corporation Apparatus for polishing semiconductor wafers
DE2712521A1 (en) 1977-03-22 1978-09-28 Wacker Chemitronic PROCEDURE FOR FITTING DISCS
US4193226A (en) 1977-09-21 1980-03-18 Kayex Corporation Polishing apparatus
US4141180A (en) 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4194324A (en) 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor
DE2809274A1 (en) 1978-03-03 1979-09-13 Wacker Chemitronic PROCESS FOR COMPARISON OF POLISHING REMOVAL FROM DISCS DURING POLISHING
JPS55157473A (en) 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
US4519168A (en) 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
US4256535A (en) 1979-12-05 1981-03-17 Western Electric Company, Inc. Method of polishing a semiconductor wafer
US4316757A (en) 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
US4313284A (en) 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
US4450652A (en) 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US4373991A (en) 1982-01-28 1983-02-15 Western Electric Company, Inc. Methods and apparatus for polishing a semiconductor wafer
JPS58171255A (en) 1982-03-29 1983-10-07 Toshiba Corp Double side mirror polishing apparatus
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4459785A (en) 1982-11-08 1984-07-17 Buehler Ltd. Chuck for vertically hung specimen holder
JPS59187456A (en) 1983-04-08 1984-10-24 Fujitsu Ltd Method of polishing semiconductor base board
JPS60109859U (en) 1983-12-28 1985-07-25 株式会社　デイスコ Semiconductor wafer surface grinding equipment
JPS60155358A (en) 1984-01-23 1985-08-15 Disco Abrasive Sys Ltd Method and device for grinding surface of semiconductor wafer
US4680893A (en) 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4711610A (en) 1986-04-04 1987-12-08 Machine Technology, Inc. Balancing chuck
US4918870A (en) 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
KR910009320B1 (en) 1986-08-19 1991-11-09 미쓰비시 마테리알 가부시기가이샤 Polishing apparatus
US5035087A (en) 1986-12-08 1991-07-30 Sumitomo Electric Industries, Ltd. Surface grinding machine
JPS63200965A (en) 1987-02-12 1988-08-19 Fujitsu Ltd Wafer polishing device
US4811522A (en) 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
JPS63251166A (en) 1987-04-07 1988-10-18 Hitachi Ltd Wafer chuck
US4918869A (en) 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5095661A (en) 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US4944119A (en) 1988-06-20 1990-07-31 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
JPH079896B2 (en) 1988-10-06 1995-02-01 信越半導体株式会社 Polishing equipment
US5238354A (en) 1989-05-23 1993-08-24 Cybeq Systems, Inc. Semiconductor object pre-aligning apparatus
US5234867A (en) 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5036630A (en) 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5121572A (en) 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
FR2677276B1 (en) 1991-06-06 1995-12-01 Commissariat Energie Atomique POLISHING MACHINE WITH IMPROVED SAMPLE HOLDER TABLE.
EP0517594B1 (en) 1991-06-06 1995-12-13 Commissariat A L'energie Atomique Polishing machine with a tensioned finishing belt and an improved work supporting head
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
JP2598661Y2 (en) 1992-07-16 1999-08-16 信越半導体株式会社 Rotary indexing wafer chamfering unit polishing machine
JPH0663862A (en) 1992-08-22 1994-03-08 Fujikoshi Mach Corp Polishing device
JPH0691522A (en) 1992-09-09 1994-04-05 Hitachi Ltd Polishing device
DE69333322T2 (en) 1992-09-24 2004-09-30 Ebara Corp. polisher
JP3370112B2 (en) 1992-10-12 2003-01-27 不二越機械工業株式会社 Wafer polishing equipment
EP0599299B1 (en) 1992-11-27 1998-02-04 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5635083A (en) 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5486129A (en) 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5443416A (en) 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
DE4335980C2 (en) 1993-10-21 1998-09-10 Wacker Siltronic Halbleitermat Method for positioning a workpiece holder
US5582534A (en) 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5624299A (en) 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5449316A (en) 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423716A (en) 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US5423558A (en) 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
US5562524A (en) 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
ATE186001T1 (en) 1994-08-09 1999-11-15 Ontrak Systems Inc LINEAR POLISHER AND WAFER PLANARISATION PROCESS
US5571044A (en) 1994-10-11 1996-11-05 Ontrak Systems, Inc. Wafer holder for semiconductor wafer polishing machine
US5575707A (en) 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
US5593344A (en) 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JP3158934B2 (en) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 Wafer polishing equipment
US5507614A (en) 1995-03-02 1996-04-16 Cybeq Systems Holder mechanism for simultaneously tilting and rotating a wafer cassette
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3724869B2 (en) 1995-10-09 2005-12-07 株式会社荏原製作所 Polishing apparatus and method
US5951373A (en) 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5575706A (en) 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
EP0786310B1 (en) * 1996-01-24 2002-12-04 Lam Research Corporation Wafer polishing head
US5876273A (en) 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
US5857899A (en) 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
JPH11333711A (en) * 1998-05-21 1999-12-07 Nikon Corp Polishing head and polishing device using it
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6089961A (en) * 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US6206768B1 (en) * 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly

Also Published As

Publication number Publication date
JP2003529457A (en) 2003-10-07
EP1268131A2 (en) 2003-01-02
KR20030005242A (en) 2003-01-17
WO2001074536A3 (en) 2002-02-07
KR100841723B1 (en) 2008-06-27
TW480206B (en) 2002-03-21
JP5072161B2 (en) 2012-11-14
US6666756B1 (en) 2003-12-23
WO2001074536A2 (en) 2001-10-11

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