AU2001246878A1 - Semiconductor photodetector - Google Patents

Semiconductor photodetector

Info

Publication number
AU2001246878A1
AU2001246878A1 AU2001246878A AU4687801A AU2001246878A1 AU 2001246878 A1 AU2001246878 A1 AU 2001246878A1 AU 2001246878 A AU2001246878 A AU 2001246878A AU 4687801 A AU4687801 A AU 4687801A AU 2001246878 A1 AU2001246878 A1 AU 2001246878A1
Authority
AU
Australia
Prior art keywords
semiconductor photodetector
photodetector
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001246878A
Inventor
Tomohisa Itoh
Masaharu Muramatsu
Katsumi Shibayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of AU2001246878A1 publication Critical patent/AU2001246878A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
AU2001246878A 2000-04-11 2001-04-10 Semiconductor photodetector Abandoned AU2001246878A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-109763 2000-04-11
JP2000109763A JP4588837B2 (en) 2000-04-11 2000-04-11 Semiconductor photo detector
PCT/JP2001/003076 WO2001078137A1 (en) 2000-04-11 2001-04-10 Semiconductor photodetector

Publications (1)

Publication Number Publication Date
AU2001246878A1 true AU2001246878A1 (en) 2001-10-23

Family

ID=18622401

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001246878A Abandoned AU2001246878A1 (en) 2000-04-11 2001-04-10 Semiconductor photodetector

Country Status (6)

Country Link
US (1) US6703598B2 (en)
JP (1) JP4588837B2 (en)
CN (1) CN100495688C (en)
AU (1) AU2001246878A1 (en)
DE (1) DE10196064B3 (en)
WO (1) WO2001078137A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274094B2 (en) * 2002-08-28 2007-09-25 Micron Technology, Inc. Leadless packaging for image sensor devices
JP2004134578A (en) 2002-10-10 2004-04-30 Hamamatsu Photonics Kk Photodetector and its manufacturing process
JP4373695B2 (en) * 2003-04-16 2009-11-25 浜松ホトニクス株式会社 Manufacturing method of backside illuminated photodetector
AU2003232716A1 (en) * 2003-05-20 2004-12-13 Infineon Technologies Ag An integrated circuit package
US7973380B2 (en) * 2005-11-23 2011-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method for providing metal extension in backside illuminated sensor for wafer level testing
JP4421589B2 (en) * 2006-10-10 2010-02-24 浜松ホトニクス株式会社 Photodetector
JP4908150B2 (en) * 2006-10-18 2012-04-04 浜松ホトニクス株式会社 Imaging device holding structure and imaging device
TWI463868B (en) * 2008-10-09 2014-12-01 Asia Optical Co Inc Scalable image sensing module
TW201210005A (en) * 2010-08-23 2012-03-01 Shu-Zi Chen Thinning of the image capturing module and manufacturing method thereof
CN103633034B (en) * 2012-08-23 2017-10-20 三赢科技（深圳）有限公司 CIS module and taken module
DE102013104964A1 (en) 2013-05-14 2014-11-20 Micro-Hybrid Electronic Gmbh Hermetically gas-tight optoelectronic or electro-optical component and method for its production
JP2015029145A (en) * 2014-10-14 2015-02-12 オリンパス株式会社 Mounting structure and manufacturing method of imaging unit
WO2020202789A1 (en) * 2019-03-29 2020-10-08 ソニーセミコンダクタソリューションズ株式会社 Sensor device
US11967061B2 (en) * 2019-07-10 2024-04-23 Hamamatsu Photonics K.K. Semiconductor apparatus examination method and semiconductor apparatus examination apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331538U (en) * 1986-08-18 1988-03-01
JPS63102344A (en) * 1986-10-20 1988-05-07 Fujitsu Ltd Semiconductor device
JPH01179437A (en) * 1988-01-07 1989-07-17 Sony Corp Semiconductor device
JPH03257951A (en) * 1990-03-08 1991-11-18 Fujitsu Ltd Bare chip sealing structure
KR920005287A (en) * 1990-08-08 1992-03-28 엔. 라이스 머레트 Plastic joint package lid sealing process and its method
JP3200983B2 (en) * 1992-07-21 2001-08-20 株式会社ニコン CCD sealed container
JP2651323B2 (en) * 1992-07-22 1997-09-10 浜松ホトニクス株式会社 Semiconductor energy detector
US5600130A (en) * 1994-06-17 1997-02-04 The Regents Of The University Of Colorado Two-dimensional optoelectronic array module
JP2809160B2 (en) * 1995-10-25 1998-10-08 日本電気株式会社 Method for manufacturing semiconductor device

Also Published As

Publication number Publication date
US20030034436A1 (en) 2003-02-20
JP4588837B2 (en) 2010-12-01
DE10196064B3 (en) 2011-09-29
DE10196064T1 (en) 2003-03-13
CN100495688C (en) 2009-06-03
CN1441964A (en) 2003-09-10
US6703598B2 (en) 2004-03-09
JP2001298104A (en) 2001-10-26
WO2001078137A1 (en) 2001-10-18

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