AU2001284668A1 - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- AU2001284668A1 AU2001284668A1 AU2001284668A AU8466801A AU2001284668A1 AU 2001284668 A1 AU2001284668 A1 AU 2001284668A1 AU 2001284668 A AU2001284668 A AU 2001284668A AU 8466801 A AU8466801 A AU 8466801A AU 2001284668 A1 AU2001284668 A1 AU 2001284668A1
- Authority
- AU
- Australia
- Prior art keywords
- carrier tape
- tape
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1303—Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
- Y10T428/1307—Bag or tubular film [e.g., pouch, flexible food casing, envelope, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22091500P | 2000-07-26 | 2000-07-26 | |
US60220915 | 2000-07-26 | ||
US22381000P | 2000-08-08 | 2000-08-08 | |
US60223810 | 2000-08-08 | ||
US22746300P | 2000-08-24 | 2000-08-24 | |
US60227463 | 2000-08-24 | ||
US22819600P | 2000-08-25 | 2000-08-25 | |
US60228196 | 2000-08-26 | ||
US23470900P | 2000-09-22 | 2000-09-22 | |
US60234709 | 2000-09-22 | ||
USNOTGIVEN | 2000-11-08 | ||
US09/915,122 US6938783B2 (en) | 2000-07-26 | 2001-07-25 | Carrier tape |
PCT/US2001/023554 WO2002007962A1 (en) | 2000-07-26 | 2001-07-26 | Carrier tape |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001284668A1 true AU2001284668A1 (en) | 2002-02-05 |
Family
ID=27539817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001284668A Abandoned AU2001284668A1 (en) | 2000-07-26 | 2001-07-26 | Carrier tape |
Country Status (3)
Country | Link |
---|---|
US (2) | US6938783B2 (en) |
AU (1) | AU2001284668A1 (en) |
WO (1) | WO2002007962A1 (en) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6938783B2 (en) * | 2000-07-26 | 2005-09-06 | Amerasia International Technology, Inc. | Carrier tape |
US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
US7108899B2 (en) | 2002-09-11 | 2006-09-19 | Entegris, Inc. | Chip tray with tacky surface |
US6926937B2 (en) * | 2002-09-11 | 2005-08-09 | Entegris, Inc. | Matrix tray with tacky surfaces |
JP4107417B2 (en) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | Tip workpiece fixing method |
JP4283596B2 (en) | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | Tip workpiece fixing method |
US20090039038A1 (en) * | 2003-07-08 | 2009-02-12 | Armstrong Mark E | Office tool |
US20050098890A1 (en) * | 2003-10-08 | 2005-05-12 | Stephan Blaszczak | Method for producing an adhesive bond and adhesive bond between a chip and a planar surface |
JP4275522B2 (en) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | Dicing die bond film |
JP4443962B2 (en) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | Dicing die bond film |
US8154131B2 (en) | 2005-06-14 | 2012-04-10 | Cufer Asset Ltd. L.L.C. | Profiled contact |
US7687400B2 (en) | 2005-06-14 | 2010-03-30 | John Trezza | Side stacking apparatus and method |
US7215032B2 (en) | 2005-06-14 | 2007-05-08 | Cubic Wafer, Inc. | Triaxial through-chip connection |
US7838997B2 (en) | 2005-06-14 | 2010-11-23 | John Trezza | Remote chip attachment |
US7786592B2 (en) | 2005-06-14 | 2010-08-31 | John Trezza | Chip capacitive coupling |
US7781886B2 (en) | 2005-06-14 | 2010-08-24 | John Trezza | Electronic chip contact structure |
US8456015B2 (en) | 2005-06-14 | 2013-06-04 | Cufer Asset Ltd. L.L.C. | Triaxial through-chip connection |
US7521806B2 (en) * | 2005-06-14 | 2009-04-21 | John Trezza | Chip spanning connection |
US7851348B2 (en) | 2005-06-14 | 2010-12-14 | Abhay Misra | Routingless chip architecture |
US7534722B2 (en) | 2005-06-14 | 2009-05-19 | John Trezza | Back-to-front via process |
US7560813B2 (en) | 2005-06-14 | 2009-07-14 | John Trezza | Chip-based thermo-stack |
US20070000595A1 (en) * | 2005-06-29 | 2007-01-04 | Intel Corporation | Adhesive substrate and method for using |
US7348216B2 (en) * | 2005-10-04 | 2008-03-25 | International Business Machines Corporation | Rework process for removing residual UV adhesive from C4 wafer surfaces |
US20070281460A1 (en) * | 2006-06-06 | 2007-12-06 | Cubic Wafer, Inc. | Front-end processed wafer having through-chip connections |
US7687397B2 (en) * | 2006-06-06 | 2010-03-30 | John Trezza | Front-end processed wafer having through-chip connections |
EP2063460A4 (en) * | 2006-09-12 | 2011-08-03 | Nitto Denko Corp | Dicing/die bonding film |
KR100825798B1 (en) * | 2006-12-29 | 2008-04-28 | 삼성전자주식회사 | Method of dicing |
US7670874B2 (en) | 2007-02-16 | 2010-03-02 | John Trezza | Plated pillar package formation |
SG147330A1 (en) * | 2007-04-19 | 2008-11-28 | Micron Technology Inc | Semiconductor workpiece carriers and methods for processing semiconductor workpieces |
US7646605B2 (en) * | 2007-08-31 | 2010-01-12 | International Business Machines Corporation | Electronic module packaging |
CN101598313B (en) * | 2008-06-06 | 2012-07-04 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp |
US9409383B2 (en) * | 2008-12-22 | 2016-08-09 | Apple Inc. | Layer-specific energy distribution delamination |
US8072764B2 (en) * | 2009-03-09 | 2011-12-06 | Apple Inc. | Multi-part substrate assemblies for low profile portable electronic devices |
US8205766B2 (en) | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
US8430264B2 (en) | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
US8240549B2 (en) * | 2009-07-29 | 2012-08-14 | Macronix International Co., Ltd. | IC package tray embedded RFID |
US9847243B2 (en) * | 2009-08-27 | 2017-12-19 | Corning Incorporated | Debonding a glass substrate from carrier using ultrasonic wave |
JP5368290B2 (en) * | 2009-12-18 | 2013-12-18 | 株式会社アドバンテスト | Carrier assembly device |
JP5616119B2 (en) * | 2010-05-10 | 2014-10-29 | 株式会社アドバンテスト | Test carrier |
KR101759347B1 (en) * | 2010-12-14 | 2017-08-01 | 삼성디스플레이 주식회사 | Mask frame assembly for thin film deposition and the manufacturing method thereof |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9230888B2 (en) * | 2013-02-11 | 2016-01-05 | Henkel IP & Holding GmbH | Wafer back side coating as dicing tape adhesive |
US9824906B2 (en) * | 2013-09-03 | 2017-11-21 | Altera Corporation | Methods and structures for handling integrated circuits |
EP2987849A1 (en) | 2014-08-19 | 2016-02-24 | The Procter and Gamble Company | Method of Laundering a Fabric |
KR20160067517A (en) * | 2014-12-04 | 2016-06-14 | 삼성전자주식회사 | method of manufacturing semiconductor devices |
US9549599B2 (en) * | 2014-12-22 | 2017-01-24 | Margo O'Tyson BEDMAN | Stackable gemstone carrying case |
US9989585B2 (en) | 2015-08-27 | 2018-06-05 | Silicon Laboratories Inc. | Horizontal infrastructure handling for integrated circuit devices |
US10050010B1 (en) * | 2017-03-22 | 2018-08-14 | International Business Machines Corporation | Selectively cross-linked thermal interface materials |
WO2019046471A1 (en) | 2017-08-29 | 2019-03-07 | Daewon Semiconductor Packaging Industrial Company | Tape carrier assemblies having an integrated adhesive film |
US11452249B2 (en) | 2017-12-11 | 2022-09-20 | Delphon Industries, Llc | Carrier for reversibly immobilizing one or more objects |
US11222864B2 (en) | 2019-01-28 | 2022-01-11 | Amerasia International Technology | Semiconductor wafer processing arrangement employing an adhesive sheet and method for processing a semiconductor wafer |
JP7461158B2 (en) * | 2020-02-20 | 2024-04-03 | 株式会社ディスコ | Transport tray |
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US3637377A (en) * | 1966-11-03 | 1972-01-25 | Teeg Research Inc | Method for making a pattern on a support member by means of actinic radiation sensitive element |
US3554125A (en) * | 1967-04-26 | 1971-01-12 | Xerox Corp | Method of making a lithographic master and method of printing therewith |
US3660088A (en) * | 1970-09-16 | 1972-05-02 | Grace W R & Co | Photo-resist process |
GB1411943A (en) * | 1971-10-12 | 1975-10-29 | Raychem Ltd | Covering methods |
US4286047A (en) | 1979-07-25 | 1981-08-25 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification |
SE461838B (en) * | 1983-05-19 | 1990-04-02 | Akerlund & Rausing Licens Ab | PACKAGING TUB WITH RIB OPENING |
US4778326A (en) | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
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DE3425332A1 (en) * | 1984-07-10 | 1986-01-16 | SMS Hasenclever Maschinenfabrik GmbH, 4000 Düsseldorf | SPINDLE PRESS |
US4667944A (en) | 1985-08-29 | 1987-05-26 | Vichem Corporation | Means for handling semiconductor die and the like |
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US7165687B1 (en) * | 2000-04-27 | 2007-01-23 | Stevens Gene M | Storage organizer |
US6938783B2 (en) * | 2000-07-26 | 2005-09-06 | Amerasia International Technology, Inc. | Carrier tape |
US7226290B2 (en) * | 2004-04-26 | 2007-06-05 | Mary Nickol | Portable aesthetic component comparison system, decorator design tool, retaining stud, and method |
-
2001
- 2001-07-25 US US09/915,122 patent/US6938783B2/en not_active Expired - Fee Related
- 2001-07-26 AU AU2001284668A patent/AU2001284668A1/en not_active Abandoned
- 2001-07-26 WO PCT/US2001/023554 patent/WO2002007962A1/en active Application Filing
-
2005
- 2005-09-01 US US11/217,832 patent/US7458472B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6938783B2 (en) | 2005-09-06 |
US20060029762A1 (en) | 2006-02-09 |
US20020014465A1 (en) | 2002-02-07 |
US7458472B2 (en) | 2008-12-02 |
WO2002007962A1 (en) | 2002-01-31 |
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