AU2001284668A1 - Carrier tape - Google Patents

Carrier tape

Info

Publication number
AU2001284668A1
AU2001284668A1 AU2001284668A AU8466801A AU2001284668A1 AU 2001284668 A1 AU2001284668 A1 AU 2001284668A1 AU 2001284668 A AU2001284668 A AU 2001284668A AU 8466801 A AU8466801 A AU 8466801A AU 2001284668 A1 AU2001284668 A1 AU 2001284668A1
Authority
AU
Australia
Prior art keywords
carrier tape
tape
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284668A
Inventor
Kevin Kwong-Tai Chung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amerasia International Technology Inc
Original Assignee
CHUNG KEVIN KWONG TAI
Amerasia International Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHUNG KEVIN KWONG TAI, Amerasia International Technology Inc filed Critical CHUNG KEVIN KWONG TAI
Publication of AU2001284668A1 publication Critical patent/AU2001284668A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1303—Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
    • Y10T428/1307—Bag or tubular film [e.g., pouch, flexible food casing, envelope, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
AU2001284668A 2000-07-26 2001-07-26 Carrier tape Abandoned AU2001284668A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US22091500P 2000-07-26 2000-07-26
US60220915 2000-07-26
US22381000P 2000-08-08 2000-08-08
US60223810 2000-08-08
US22746300P 2000-08-24 2000-08-24
US60227463 2000-08-24
US22819600P 2000-08-25 2000-08-25
US60228196 2000-08-26
US23470900P 2000-09-22 2000-09-22
US60234709 2000-09-22
USNOTGIVEN 2000-11-08
US09/915,122 US6938783B2 (en) 2000-07-26 2001-07-25 Carrier tape
PCT/US2001/023554 WO2002007962A1 (en) 2000-07-26 2001-07-26 Carrier tape

Publications (1)

Publication Number Publication Date
AU2001284668A1 true AU2001284668A1 (en) 2002-02-05

Family

ID=27539817

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284668A Abandoned AU2001284668A1 (en) 2000-07-26 2001-07-26 Carrier tape

Country Status (3)

Country Link
US (2) US6938783B2 (en)
AU (1) AU2001284668A1 (en)
WO (1) WO2002007962A1 (en)

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US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
US7521806B2 (en) * 2005-06-14 2009-04-21 John Trezza Chip spanning connection
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US7534722B2 (en) 2005-06-14 2009-05-19 John Trezza Back-to-front via process
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JP5616119B2 (en) * 2010-05-10 2014-10-29 株式会社アドバンテスト Test carrier
KR101759347B1 (en) * 2010-12-14 2017-08-01 삼성디스플레이 주식회사 Mask frame assembly for thin film deposition and the manufacturing method thereof
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9230888B2 (en) * 2013-02-11 2016-01-05 Henkel IP & Holding GmbH Wafer back side coating as dicing tape adhesive
US9824906B2 (en) * 2013-09-03 2017-11-21 Altera Corporation Methods and structures for handling integrated circuits
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US9549599B2 (en) * 2014-12-22 2017-01-24 Margo O'Tyson BEDMAN Stackable gemstone carrying case
US9989585B2 (en) 2015-08-27 2018-06-05 Silicon Laboratories Inc. Horizontal infrastructure handling for integrated circuit devices
US10050010B1 (en) * 2017-03-22 2018-08-14 International Business Machines Corporation Selectively cross-linked thermal interface materials
WO2019046471A1 (en) 2017-08-29 2019-03-07 Daewon Semiconductor Packaging Industrial Company Tape carrier assemblies having an integrated adhesive film
US11452249B2 (en) 2017-12-11 2022-09-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
US11222864B2 (en) 2019-01-28 2022-01-11 Amerasia International Technology Semiconductor wafer processing arrangement employing an adhesive sheet and method for processing a semiconductor wafer
JP7461158B2 (en) * 2020-02-20 2024-04-03 株式会社ディスコ Transport tray

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Also Published As

Publication number Publication date
US6938783B2 (en) 2005-09-06
US20060029762A1 (en) 2006-02-09
US20020014465A1 (en) 2002-02-07
US7458472B2 (en) 2008-12-02
WO2002007962A1 (en) 2002-01-31

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