SG11201810376PA - Production method for fabry-perot interference filter - Google Patents
Production method for fabry-perot interference filterInfo
- Publication number
- SG11201810376PA SG11201810376PA SG11201810376PA SG11201810376PA SG11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA
- Authority
- SG
- Singapore
- Prior art keywords
- fabry
- production method
- expected
- interference filter
- mirror
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/12—Generating the spectrum; Monochromators
- G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Filters (AREA)
- Micromachines (AREA)
Abstract
method manufacturing Fabry-Perot filter includes a forming step of forming a first mirror layer having a plurality of first mirror portions, a sacrificial layer having a plurality of portions expected to be removed, and a second mirror layer having a plurality of 5 second mirror portions on a first main surface of a wafer which includes parts to plurality two-dimensionally substrates and is expected to be cut into the plurality of substrates along each of a plurality of lines; a removing step of simultaneously removing the of arranged expected be 10 removed the layer etching the step; a step cutting wafer the of substrates along each of the plurality of lines after the removing step. 15 FIGURE 7
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016106269 | 2016-05-27 | ||
JP2016163942 | 2016-08-24 | ||
JP2016163916 | 2016-08-24 | ||
PCT/JP2017/019680 WO2017204326A1 (en) | 2016-05-27 | 2017-05-26 | Production method for fabry-perot interference filter |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201810376PA true SG11201810376PA (en) | 2018-12-28 |
Family
ID=60412818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201810376PA SG11201810376PA (en) | 2016-05-27 | 2017-05-26 | Production method for fabry-perot interference filter |
Country Status (11)
Country | Link |
---|---|
US (1) | US11041755B2 (en) |
EP (1) | EP3467567B1 (en) |
JP (1) | JP7018873B2 (en) |
KR (1) | KR102432363B1 (en) |
CN (1) | CN109196405B (en) |
ES (1) | ES2972587T3 (en) |
FI (1) | FI3467567T3 (en) |
PH (1) | PH12018502444A1 (en) |
SG (1) | SG11201810376PA (en) |
TW (1) | TWI717519B (en) |
WO (1) | WO2017204326A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6341959B2 (en) * | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | Manufacturing method of Fabry-Perot interference filter |
WO2017204326A1 (en) | 2016-05-27 | 2017-11-30 | 浜松ホトニクス株式会社 | Production method for fabry-perot interference filter |
FI3505987T3 (en) | 2016-08-24 | 2023-12-19 | Hamamatsu Photonics Kk | Fabry-perot interference filter |
JP6517309B1 (en) | 2017-11-24 | 2019-05-22 | 浜松ホトニクス株式会社 | Foreign matter removing method and manufacturing method of light detection device |
CN112789541A (en) * | 2018-10-03 | 2021-05-11 | 浜松光子学株式会社 | Fabry-Perot interference filter |
US20220037145A1 (en) * | 2020-07-31 | 2022-02-03 | Psiquantum, Corp. | Silicon nitride films having reduced interfacial strain |
Family Cites Families (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1059968A (en) | 1990-09-20 | 1992-04-01 | 托木斯克国立库伊比谢瓦大学 | Interferometric optical filter system selectively |
US6981804B2 (en) * | 1998-06-08 | 2006-01-03 | Arrayed Fiberoptics Corporation | Vertically integrated optical devices coupled to optical fibers |
CN1085343C (en) | 1998-07-22 | 2002-05-22 | 李韫言 | Infrared FABRY-PEROT filter used for fine processing procedure |
WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
US6590710B2 (en) * | 2000-02-18 | 2003-07-08 | Yokogawa Electric Corporation | Fabry-Perot filter, wavelength-selective infrared detector and infrared gas analyzer using the filter and detector |
JP2002174721A (en) | 2000-12-06 | 2002-06-21 | Yokogawa Electric Corp | Fabry-perot filter |
US6436794B1 (en) | 2001-05-21 | 2002-08-20 | Hewlett-Packard Company | Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer |
ATE362653T1 (en) * | 2002-03-12 | 2007-06-15 | Hamamatsu Photonics Kk | METHOD FOR SEPARATING SUBSTRATES |
US7063466B2 (en) | 2002-12-20 | 2006-06-20 | Micron Optics, Inc. | Selectable and tunable ferrule holder for a fiber Fabry-Perot filter |
AU2003220842A1 (en) * | 2003-03-12 | 2004-09-30 | Hamamatsu Photonics K.K. | Laser beam machining method |
JP4563097B2 (en) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
US7429334B2 (en) | 2004-09-27 | 2008-09-30 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
US7405108B2 (en) | 2004-11-20 | 2008-07-29 | International Business Machines Corporation | Methods for forming co-planar wafer-scale chip packages |
JP4587320B2 (en) | 2005-06-30 | 2010-11-24 | 株式会社半導体エネルギー研究所 | Microstructure, micromachine, and manufacturing method thereof |
EP2495212A3 (en) | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
US7502401B2 (en) | 2005-07-22 | 2009-03-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | VCSEL system with transverse P/N junction |
JP2007077864A (en) | 2005-09-14 | 2007-03-29 | Ricoh Co Ltd | Electrostatic actuator, droplet delivery head, liquid cartridge, image forming device, micro pump and optical device |
DE102006008584A1 (en) | 2006-02-24 | 2007-09-06 | Atmel Germany Gmbh | Manufacturing process for integrated piezo components |
WO2007107176A1 (en) | 2006-03-17 | 2007-09-27 | Freescale Semiconductor, Inc. | Method of reducing risk of delamination of a layer of a semiconductor device |
US20150138642A1 (en) | 2007-08-12 | 2015-05-21 | Toyota Motor Engineering & Manufacturing North America, Inc. | Durable hybrid omnidirectional structural color pigments for exterior applications |
US8198639B2 (en) | 2007-09-03 | 2012-06-12 | Rohm Co., Ltd. | Method of manufacturing light emitting device with a pair of ridge protection electrodes |
US7626707B2 (en) | 2007-10-29 | 2009-12-01 | Symphony Acoustics, Inc. | Dual cavity displacement sensor |
JP5151444B2 (en) | 2007-12-14 | 2013-02-27 | 株式会社デンソー | Semiconductor chip and manufacturing method thereof |
JP2008103776A (en) * | 2008-01-18 | 2008-05-01 | Seiko Epson Corp | Method of dicing and micromachining device |
US20100015782A1 (en) | 2008-07-18 | 2010-01-21 | Chen-Hua Yu | Wafer Dicing Methods |
US9391423B2 (en) | 2008-12-16 | 2016-07-12 | Massachusetts Institute Of Technology | Method and applications of thin-film membrane transfer |
US8739390B2 (en) | 2008-12-16 | 2014-06-03 | Massachusetts Institute Of Technology | Method for microcontact printing of MEMS |
FI125817B (en) | 2009-01-27 | 2016-02-29 | Teknologian Tutkimuskeskus Vtt Oy | Improved electronically controlled Fabry-Perot interferometer, an intermediate product, an electrode system and a method for producing an electronically controlled Fabry-Perot interferometer |
JP5276035B2 (en) | 2009-04-13 | 2013-08-28 | 日本電波工業株式会社 | Piezoelectric device manufacturing method and piezoelectric device |
FI124072B (en) | 2009-05-29 | 2014-03-14 | Valtion Teknillinen | Micromechanical Fabry-Perot Adjustable Interferometer, Intermediate, and Method of Manufacture |
JP5096425B2 (en) | 2009-07-23 | 2012-12-12 | 日本電波工業株式会社 | Manufacturing method of optical filter |
FI20095976A0 (en) | 2009-09-24 | 2009-09-24 | Valtion Teknillinen | Micromechanically adjustable Fabry-Perot interferometer and method for its production |
JP2011181909A (en) | 2010-02-02 | 2011-09-15 | Mitsubishi Chemicals Corp | Method of manufacturing semiconductor chip |
JP5653110B2 (en) * | 2010-07-26 | 2015-01-14 | 浜松ホトニクス株式会社 | Chip manufacturing method |
JP5640549B2 (en) | 2010-08-19 | 2014-12-17 | セイコーエプソン株式会社 | Optical filter, optical filter manufacturing method, and optical device |
WO2012145677A2 (en) | 2011-04-20 | 2012-10-26 | The Regents Of The University Of Michigan | Spectrum filtering for visual displays and imaging having minimal angle dependence |
FI125897B (en) | 2011-06-06 | 2016-03-31 | Teknologian Tutkimuskeskus Vtt Oy | Micromechanically adjustable Fabry-Perot interferometer and method for its manufacture |
JP5939752B2 (en) | 2011-09-01 | 2016-06-22 | 株式会社ディスコ | Wafer dividing method |
JP5966405B2 (en) | 2012-02-14 | 2016-08-10 | セイコーエプソン株式会社 | Optical filter device and method of manufacturing optical filter device |
US8884725B2 (en) | 2012-04-19 | 2014-11-11 | Qualcomm Mems Technologies, Inc. | In-plane resonator structures for evanescent-mode electromagnetic-wave cavity resonators |
FI125368B (en) | 2012-06-08 | 2015-09-15 | Teknologian Tutkimuskeskus Vtt Oy | Micromechanically adjustable Fabry-Perot interferometer system and method for achieving this |
US9040389B2 (en) * | 2012-10-09 | 2015-05-26 | Infineon Technologies Ag | Singulation processes |
JP6211315B2 (en) * | 2013-07-02 | 2017-10-11 | 浜松ホトニクス株式会社 | Fabry-Perot interference filter |
JP6211833B2 (en) | 2013-07-02 | 2017-10-11 | 浜松ホトニクス株式会社 | Fabry-Perot interference filter |
JP6356427B2 (en) * | 2014-02-13 | 2018-07-11 | 浜松ホトニクス株式会社 | Fabry-Perot interference filter |
JP6353683B2 (en) | 2014-04-04 | 2018-07-04 | 浜松ホトニクス株式会社 | Laser processing apparatus and laser processing method |
CN106461833B (en) | 2014-06-18 | 2019-09-17 | 唯亚威通讯技术有限公司 | Metal-dielectric optical filter, sensor device and manufacturing method |
JP2016099583A (en) | 2014-11-26 | 2016-05-30 | セイコーエプソン株式会社 | Interference filter, optical module, electronic apparatus and manufacturing method of structured item |
JP6341959B2 (en) | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | Manufacturing method of Fabry-Perot interference filter |
WO2017204326A1 (en) | 2016-05-27 | 2017-11-30 | 浜松ホトニクス株式会社 | Production method for fabry-perot interference filter |
EP3505988B1 (en) | 2016-08-24 | 2021-05-19 | Hamamatsu Photonics K.K. | Fabry-perot interference filter |
FI3505987T3 (en) | 2016-08-24 | 2023-12-19 | Hamamatsu Photonics Kk | Fabry-perot interference filter |
-
2017
- 2017-05-26 WO PCT/JP2017/019680 patent/WO2017204326A1/en active Application Filing
- 2017-05-26 JP JP2018519628A patent/JP7018873B2/en active Active
- 2017-05-26 US US16/303,688 patent/US11041755B2/en active Active
- 2017-05-26 ES ES17802912T patent/ES2972587T3/en active Active
- 2017-05-26 CN CN201780032621.XA patent/CN109196405B/en active Active
- 2017-05-26 KR KR1020187037424A patent/KR102432363B1/en active IP Right Grant
- 2017-05-26 SG SG11201810376PA patent/SG11201810376PA/en unknown
- 2017-05-26 FI FIEP17802912.0T patent/FI3467567T3/en active
- 2017-05-26 EP EP17802912.0A patent/EP3467567B1/en active Active
- 2017-05-26 TW TW106117580A patent/TWI717519B/en active
-
2018
- 2018-11-20 PH PH12018502444A patent/PH12018502444A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3467567A4 (en) | 2020-03-11 |
PH12018502444A1 (en) | 2019-09-09 |
CN109196405A (en) | 2019-01-11 |
FI3467567T3 (en) | 2024-04-22 |
JPWO2017204326A1 (en) | 2019-03-22 |
TWI717519B (en) | 2021-02-01 |
KR102432363B1 (en) | 2022-08-16 |
US11041755B2 (en) | 2021-06-22 |
JP7018873B2 (en) | 2022-02-14 |
CN109196405B (en) | 2021-09-10 |
TW201805229A (en) | 2018-02-16 |
US20200141801A1 (en) | 2020-05-07 |
KR20190011768A (en) | 2019-02-07 |
ES2972587T3 (en) | 2024-06-13 |
EP3467567B1 (en) | 2024-02-07 |
WO2017204326A1 (en) | 2017-11-30 |
EP3467567A1 (en) | 2019-04-10 |
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