JP4564742B2 - 露光装置及びデバイス製造方法 - Google Patents
露光装置及びデバイス製造方法 Download PDFInfo
- Publication number
- JP4564742B2 JP4564742B2 JP2003404023A JP2003404023A JP4564742B2 JP 4564742 B2 JP4564742 B2 JP 4564742B2 JP 2003404023 A JP2003404023 A JP 2003404023A JP 2003404023 A JP2003404023 A JP 2003404023A JP 4564742 B2 JP4564742 B2 JP 4564742B2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- particles
- chamber
- vacuum
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Description
100 処理チャンバ
110 チャンバ予備室
112 第3の搬送手段
200 真空室
210 第2の搬送手段
300 クリーンブース
310 キャリア載置部
320 第1の搬送手段
324 抑止手段
400 第1のロードロック室
410 第1のゲート弁
420 第2のゲート弁
500 第2のロードロック室
510 第3のゲート弁
520 第4のゲート弁
600 検出手段
610 光源部
620 ディテクタ
630 ステージ
700 除去手段
710 照射部
720 吸着部
800 露光装置
810 照明装置
820 マスク
830 投影光学系
840 被処理体
Claims (5)
- マスクを介して基板の露光を行う露光装置であって、
大気圧の雰囲気下で前記マスクを搬送する第1の搬送手段を含むブースと、
第1の真空度の雰囲気下で前記露光を行う処理チャンバと、
前記マスクに付着したパーティクルを除去する除去手段と、プラスの帯電とマイナスの帯電とを所定の周波数で交互に切り替えられるように構成されて前記除去手段により除去されたプラスに帯電しているパーティクルおよびマイナスに帯電しているパーティクルを捕集する金網とを含み、前記第1の真空度より低い0.1Paと100Paとの間の第2の真空度の雰囲気に保たれ、前記ブースと前記処理チャンバとの間に配置された真空室と、
前記ブースと前記真空室との間に配置され、前記大気圧の雰囲気と前記第2の真空度の雰囲気との置換が可能であり、それを介して前記マスクが搬送される第1のロードロック室と、
前記真空室と前記処理チャンバとの間に配置され、前記第2の真空度の雰囲気と前記第1の真空度の雰囲気との置換が可能であり、それを介して前記マスクが搬送される第2のロードロック室と、
を有することを特徴とする露光装置。 - 前記真空室は、前記第1のロードロック室と前記第2のロードロック室との間で前記マスクを搬送する第2の搬送手段を含む、ことを特徴とする請求項1に記載の露光装置。
- 前記除去手段は、パルスレーザー光、赤外線、マイクロ波、またはガスを固体化した粒子を用いて前記パーティクルを除去する、ことを特徴とする請求項1または請求項2に記載の露光装置。
- 前記第2の搬送手段は、熱泳動力を用いて前記マスクへのパーティクルの付着を抑止する抑止手段を含む、請求項2に記載の露光装置。
- 請求項1乃至4のいずれか一項に記載の露光装置を用いて、マスクを介し基板を露光するステップと、
前記ステップで露光された基板を現像するステップと、
を有することを特徴とするデバイス製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003404023A JP4564742B2 (ja) | 2003-12-03 | 2003-12-03 | 露光装置及びデバイス製造方法 |
US11/001,116 US7670754B2 (en) | 2003-12-03 | 2004-12-02 | Exposure apparatus having a processing chamber, a vacuum chamber and first and second load lock chambers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003404023A JP4564742B2 (ja) | 2003-12-03 | 2003-12-03 | 露光装置及びデバイス製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005166970A JP2005166970A (ja) | 2005-06-23 |
JP2005166970A5 JP2005166970A5 (ja) | 2007-01-25 |
JP4564742B2 true JP4564742B2 (ja) | 2010-10-20 |
Family
ID=34631669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003404023A Expired - Fee Related JP4564742B2 (ja) | 2003-12-03 | 2003-12-03 | 露光装置及びデバイス製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7670754B2 (ja) |
JP (1) | JP4564742B2 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001277793B9 (en) * | 2000-08-08 | 2006-04-13 | Lg Electronics Inc. | Method and device for display use of washing machine |
US20050225308A1 (en) * | 2004-03-31 | 2005-10-13 | Orvek Kevin J | Real-time monitoring of particles in semiconductor vacuum environment |
US20080302390A1 (en) * | 2004-05-28 | 2008-12-11 | Koninklijke Philips Electronics N.V. | Cleaning a Mask Substrate |
US7461663B2 (en) * | 2004-09-01 | 2008-12-09 | Sanyo Electric Co., Ltd. | Cleaning apparatus |
JP2006245257A (ja) * | 2005-03-03 | 2006-09-14 | Canon Inc | 処理装置、当該処理装置を有する露光装置、保護機構 |
JP2006351595A (ja) * | 2005-06-13 | 2006-12-28 | Hitachi High-Technologies Corp | 基板処理装置、基板処理方法、及び基板の製造方法 |
JP4817293B2 (ja) * | 2005-10-26 | 2011-11-16 | 旭サナック株式会社 | ワーク洗浄方法及びワーク洗浄システム |
KR101206775B1 (ko) * | 2006-06-02 | 2012-11-30 | 주식회사 케이씨텍 | 기판 척 세정 장치 및 세정 방법 |
US20080045030A1 (en) * | 2006-08-15 | 2008-02-21 | Shigeru Tahara | Substrate processing method, substrate processing system and storage medium |
JP4164541B2 (ja) * | 2006-10-10 | 2008-10-15 | 松下電器産業株式会社 | 非水電解質二次電池用負極 |
KR20090081029A (ko) * | 2006-12-08 | 2009-07-27 | 캐논 가부시끼가이샤 | 노광장치 |
JP5098019B2 (ja) * | 2007-04-27 | 2012-12-12 | ギガフォトン株式会社 | 極端紫外光源装置 |
EP2077467B9 (fr) * | 2008-01-04 | 2014-09-03 | Adixen Vacuum Products | Procédé de fabrication de photomasques et dispositif pour sa mise en oeuvre |
WO2009112655A1 (fr) * | 2008-03-05 | 2009-09-17 | Alcatel Lucent | Procede de fabrication de photomasques et dispositif pour sa mise en œuvre |
NL1036785A1 (nl) | 2008-04-18 | 2009-10-20 | Asml Netherlands Bv | Rapid exchange device for lithography reticles. |
JP2009294439A (ja) * | 2008-06-05 | 2009-12-17 | Toshiba Corp | レジストパターン形成方法 |
DE102009016319A1 (de) * | 2009-04-06 | 2010-10-14 | Carl Zeiss Smt Ag | Verfahren zur Kontaminationsvermeidung und EUV-Lithographieanlage |
EP2302670A1 (en) * | 2009-09-28 | 2011-03-30 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Place station for a pick-and-place machine |
NL2005463A (en) * | 2009-12-16 | 2011-06-20 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
CN102947916B (zh) | 2010-05-28 | 2016-05-04 | 艾克塞利斯科技公司 | 用于冷冻离子植入系统的加热转动密封件及轴承 |
US8481969B2 (en) | 2010-06-04 | 2013-07-09 | Axcelis Technologies, Inc. | Effective algorithm for warming a twist axis for cold ion implantations |
KR101199208B1 (ko) * | 2011-03-16 | 2012-11-07 | 삼성에스디아이 주식회사 | 용접기용 스패터 포집 장치 |
KR102017867B1 (ko) | 2011-06-23 | 2019-09-03 | 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 | 반도체 클리너 시스템들 및 방법들 |
JP2013041947A (ja) * | 2011-08-12 | 2013-02-28 | Canon Inc | リソグラフィ装置及び物品の製造方法 |
JP5867916B2 (ja) * | 2011-12-06 | 2016-02-24 | 国立研究開発法人産業技術総合研究所 | 露光装置および露光方法 |
US9711324B2 (en) * | 2012-05-31 | 2017-07-18 | Axcelis Technologies, Inc. | Inert atmospheric pressure pre-chill and post-heat |
JP6071325B2 (ja) | 2012-08-21 | 2017-02-01 | キヤノン株式会社 | 露光装置、露光方法及び物品の製造方法 |
JP2015088680A (ja) * | 2013-11-01 | 2015-05-07 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 |
JP2015099937A (ja) * | 2015-02-19 | 2015-05-28 | 東京エレクトロン株式会社 | 基板洗浄方法及び基板処理装置 |
JP2016180976A (ja) * | 2015-03-24 | 2016-10-13 | ネオ セミテック. カンパニー リミテッドNEO SEMITECH. Co., Ltd | フォトマスク検査装置および検査方法 |
US10459352B2 (en) * | 2015-08-31 | 2019-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mask cleaning |
KR102502727B1 (ko) * | 2015-11-09 | 2023-02-23 | 삼성전자주식회사 | 레티클 및 그를 포함하는 노광 장치 |
CN110313060B (zh) * | 2017-02-24 | 2023-10-24 | 东京毅力科创株式会社 | 基板处理系统 |
CN111742267A (zh) * | 2018-02-23 | 2020-10-02 | Asml荷兰有限公司 | 清洁设备和清洁方法 |
DE102019201762A1 (de) * | 2019-02-12 | 2020-08-13 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Charakterisierung der Oberflächenform eines Testobjekts |
KR20210010754A (ko) * | 2019-07-19 | 2021-01-28 | 삼성전자주식회사 | Euv 레티클 관리 방법 및 그를 포함하는 반도체 소자의 제조 방법 |
US11946141B2 (en) | 2019-09-12 | 2024-04-02 | Hewlett-Packard Development Company, L.P. | Automated conveyance of articles in chemical vapor processing |
CN110676199B (zh) * | 2019-10-16 | 2022-04-22 | 深圳市迈诺为智能科技有限公司 | 一种高速装片刻印机 |
KR102388390B1 (ko) * | 2020-01-06 | 2022-04-21 | 세메스 주식회사 | 로드 포트 유닛, 이를 포함하는 저장 장치 및 배기 방법 |
CN111736425B (zh) * | 2020-06-15 | 2021-08-31 | 上海集成电路研发中心有限公司 | 一种光掩模板保护装置 |
US11579539B2 (en) * | 2021-03-03 | 2023-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for improving critical dimension variation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000349005A (ja) * | 1999-06-03 | 2000-12-15 | Nikon Corp | 露光装置及び半導体デバイス製造方法 |
JP2000353649A (ja) * | 1999-06-09 | 2000-12-19 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
JP2002035709A (ja) * | 2000-07-25 | 2002-02-05 | Japan Steel Works Ltd:The | レーザクリーニング処理におけるパーティクルの捕集装置及び捕集方法 |
JP2002100573A (ja) * | 2000-09-25 | 2002-04-05 | Nec Corp | 半導体製造装置および半導体製造方法 |
JP2003234268A (ja) * | 2002-02-07 | 2003-08-22 | Nikon Corp | 露光装置 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4718975A (en) * | 1986-10-06 | 1988-01-12 | Texas Instruments Incorporated | Particle shield |
JPH06110197A (ja) | 1992-08-10 | 1994-04-22 | Hitachi Ltd | 微細パターン形成用マスク形成方法及びその装置 |
JPH06196390A (ja) | 1992-12-22 | 1994-07-15 | Canon Inc | バルブの制御方法及びこれを用いたシステム |
JPH06338446A (ja) | 1993-05-31 | 1994-12-06 | Hitachi Ltd | 荷電粒子線露光装置およびそれによる描画方法 |
TW276353B (ja) | 1993-07-15 | 1996-05-21 | Hitachi Seisakusyo Kk | |
JP3200282B2 (ja) | 1993-07-21 | 2001-08-20 | キヤノン株式会社 | 処理システム及びこれを用いたデバイス製造方法 |
JP3445257B2 (ja) | 1993-07-21 | 2003-09-08 | キヤノン株式会社 | 処理システム及びこれを用いた露光装置およびデバイス製造方法 |
JP3308967B2 (ja) | 1993-07-21 | 2002-07-29 | キヤノン株式会社 | 処理システム及びデバイス製造方法 |
WO1995006900A1 (fr) | 1993-09-03 | 1995-03-09 | Hitachi, Ltd. | Procede et appareil de realisation de motifs |
JPH07254556A (ja) | 1993-09-03 | 1995-10-03 | Hitachi Ltd | パターン形成方法および形成装置 |
JP3157972B2 (ja) | 1993-11-17 | 2001-04-23 | キヤノン株式会社 | X線露光方法 |
JPH0945756A (ja) | 1995-07-26 | 1997-02-14 | Hitachi Ltd | 半導体製造装置および製造方法 |
JPH1092724A (ja) | 1996-09-18 | 1998-04-10 | Nikon Corp | ロードロック室 |
JPH10223512A (ja) * | 1997-02-10 | 1998-08-21 | Nikon Corp | 電子ビーム投影露光装置 |
JPH1126370A (ja) | 1997-07-08 | 1999-01-29 | Nikon Corp | 露光前処理装置 |
US5914493A (en) | 1997-02-21 | 1999-06-22 | Nikon Corporation | Charged-particle-beam exposure apparatus and methods with substrate-temperature control |
JPH10233423A (ja) | 1997-02-21 | 1998-09-02 | Nikon Corp | ロードロック式真空処理装置 |
JP2000123111A (ja) | 1998-10-20 | 2000-04-28 | Dainippon Printing Co Ltd | 金属面の画像入力方法 |
JP2000228354A (ja) | 1999-02-09 | 2000-08-15 | Nikon Corp | 転写露光装置 |
WO2000055891A1 (fr) * | 1999-03-12 | 2000-09-21 | Nikon Corporation | Dispositif pour exposition, procede d'exposition et procede de fabrication d'un tel dispositif |
JP2001085290A (ja) | 1999-09-09 | 2001-03-30 | Nikon Corp | 半導体露光装置とデバイス製造方法 |
JP2001102281A (ja) | 1999-09-28 | 2001-04-13 | Canon Inc | ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法 |
JP2001118904A (ja) * | 1999-10-19 | 2001-04-27 | Canon Inc | ロードロック室を備えた基板処理装置および被処理基板の搬送方法 |
JP2001210576A (ja) | 2000-01-25 | 2001-08-03 | Nikon Corp | 荷重キャンセル機構、真空チャンバ結合体、露光装置及び半導体デバイスの製造方法 |
JP2001267200A (ja) | 2000-03-14 | 2001-09-28 | Nikon Corp | ガス置換方法及び装置、並びに露光方法及び装置 |
JP2001267237A (ja) | 2000-03-23 | 2001-09-28 | Canon Inc | 露光装置および露光方法 |
JP3676983B2 (ja) * | 2000-03-29 | 2005-07-27 | 株式会社日立国際電気 | 半導体製造方法、基板処理方法、及び半導体製造装置 |
JP2001284218A (ja) | 2000-03-30 | 2001-10-12 | Canon Inc | 保管庫、露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
JP4689064B2 (ja) | 2000-03-30 | 2011-05-25 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
JP3976981B2 (ja) | 2000-03-30 | 2007-09-19 | キヤノン株式会社 | 露光装置、ガス置換方法、デバイス製造方法 |
JP3869999B2 (ja) | 2000-03-30 | 2007-01-17 | キヤノン株式会社 | 露光装置および半導体デバイス製造方法 |
JP2002057100A (ja) | 2000-05-31 | 2002-02-22 | Canon Inc | 露光装置、コートデベロップ装置、デバイス製造システム、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
JP4560182B2 (ja) | 2000-07-06 | 2010-10-13 | キヤノン株式会社 | 減圧処理装置、半導体製造装置およびデバイス製造方法 |
US6455821B1 (en) | 2000-08-17 | 2002-09-24 | Nikon Corporation | System and method to control temperature of an article |
JP2002158155A (ja) | 2000-11-17 | 2002-05-31 | Canon Inc | 露光装置および露光方法 |
US6924492B2 (en) * | 2000-12-22 | 2005-08-02 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
JP2002303695A (ja) | 2001-04-03 | 2002-10-18 | Nikon Corp | 多層膜反射鏡、多層膜の剥離方法及び露光装置 |
JP2003031639A (ja) | 2001-07-17 | 2003-01-31 | Canon Inc | 基板処理装置、基板の搬送方法及び露光装置 |
JP2003045947A (ja) | 2001-07-27 | 2003-02-14 | Canon Inc | 基板処理装置及び露光装置 |
JP2003227898A (ja) | 2002-02-01 | 2003-08-15 | Nikon Corp | 多層膜反射鏡、軟x線光学機器、露光装置及びその清掃方法 |
EP1333323A3 (en) | 2002-02-01 | 2004-10-06 | Nikon Corporation | Self-cleaning reflective optical elements for use in x-ray optical systems, and optical systems and microlithography systems comprising same |
JP4040499B2 (ja) * | 2003-03-06 | 2008-01-30 | キヤノン株式会社 | ロードロック室、処理システム及び処理方法 |
-
2003
- 2003-12-03 JP JP2003404023A patent/JP4564742B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-02 US US11/001,116 patent/US7670754B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000349005A (ja) * | 1999-06-03 | 2000-12-15 | Nikon Corp | 露光装置及び半導体デバイス製造方法 |
JP2000353649A (ja) * | 1999-06-09 | 2000-12-19 | Tokyo Electron Ltd | 基板処理装置および基板処理方法 |
JP2002035709A (ja) * | 2000-07-25 | 2002-02-05 | Japan Steel Works Ltd:The | レーザクリーニング処理におけるパーティクルの捕集装置及び捕集方法 |
JP2002100573A (ja) * | 2000-09-25 | 2002-04-05 | Nec Corp | 半導体製造装置および半導体製造方法 |
JP2003234268A (ja) * | 2002-02-07 | 2003-08-22 | Nikon Corp | 露光装置 |
Also Published As
Publication number | Publication date |
---|---|
US20050121144A1 (en) | 2005-06-09 |
US7670754B2 (en) | 2010-03-02 |
JP2005166970A (ja) | 2005-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4564742B2 (ja) | 露光装置及びデバイス製造方法 | |
JP5010755B2 (ja) | マイクロリソグラフィー用光学素子の粒子洗浄 | |
US8885141B2 (en) | EUV lithography device and method for processing an optical element | |
JP4466811B2 (ja) | 露光装置及びデバイス製造方法 | |
JP2007180549A (ja) | リソグラフィ装置および方法 | |
JP2003224067A (ja) | リソグラフィ装置、装置の洗浄法、デバイスの製造方法、およびその方法により製造されるデバイス | |
US11048175B2 (en) | Apparatus for and method cleaning a support inside a lithography apparatus | |
JP2003234287A (ja) | リソグラフィ投影装置、デバイス製造方法およびそれにより製造された装置 | |
JP2005057154A (ja) | 露光装置 | |
JP2007165699A (ja) | 静電チャックのパーティクル除去方法、静電チャックのパーティクル除去装置および露光装置 | |
US7656507B2 (en) | Processing unit, exposure apparatus having the processing unit, and protection unit | |
JP2009146959A (ja) | 露光装置及び洗浄装置 | |
US20100151394A1 (en) | System for Contactless Cleaning, Lithographic Apparatus and Device Manufacturing Method | |
JP2006222198A (ja) | 露光装置 | |
JPWO2002041375A1 (ja) | 搬送方法及びその装置、露光方法及びその装置、並びにデバイスの製造方法 | |
JP2008147280A (ja) | 露光装置 | |
TW200908193A (en) | Processing apparatus and atmosphere exchange method | |
JP2006114650A (ja) | 露光装置、走査露光装置、デバイス製造方法、原版のクリーニング方法、および原版 | |
JP4513533B2 (ja) | 基板脱落防止装置および露光装置 | |
CN115524930A (zh) | 微影系统的清洁方法与微影系统的清洁系统 | |
JP2007335665A (ja) | パーティクル除去装置および露光装置 | |
JP2008041391A (ja) | 光源装置、露光装置及びデバイス製造方法 | |
JP2007329288A (ja) | 露光装置及びデバイス製造方法 | |
CN114503034A (zh) | 清洁装置、光刻设备、去除水或其它污染物的方法、和器件制造方法 | |
JP2008300683A (ja) | 洗浄装置及び方法、洗浄装置を有する露光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061204 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061204 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090630 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091104 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100316 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100514 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100727 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100802 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130806 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |