JP4405767B2 - 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置 - Google Patents

銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置 Download PDF

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Publication number
JP4405767B2
JP4405767B2 JP2003305299A JP2003305299A JP4405767B2 JP 4405767 B2 JP4405767 B2 JP 4405767B2 JP 2003305299 A JP2003305299 A JP 2003305299A JP 2003305299 A JP2003305299 A JP 2003305299A JP 4405767 B2 JP4405767 B2 JP 4405767B2
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Japan
Prior art keywords
silver
formula
photoresist
solvents
silver alloy
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2003305299A
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English (en)
Japanese (ja)
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JP2005077526A5 (ko
JP2005077526A (ja
Inventor
拓央 大和田
典夫 石川
誠一 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Sony Corp
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Kanto Chemical Co Inc
Sony Corp
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Publication date
Priority to JP2003305299A priority Critical patent/JP4405767B2/ja
Application filed by Kanto Chemical Co Inc, Sony Corp filed Critical Kanto Chemical Co Inc
Priority to KR1020067004077A priority patent/KR20060123714A/ko
Priority to CN2004800248891A priority patent/CN1846173B/zh
Priority to TW93125879A priority patent/TWI364632B/zh
Priority to PCT/JP2004/012346 priority patent/WO2005022268A1/ja
Priority to KR1020127009860A priority patent/KR101318694B1/ko
Publication of JP2005077526A publication Critical patent/JP2005077526A/ja
Publication of JP2005077526A5 publication Critical patent/JP2005077526A5/ja
Application granted granted Critical
Publication of JP4405767B2 publication Critical patent/JP4405767B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)
JP2003305299A 2003-08-28 2003-08-28 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置 Expired - Lifetime JP4405767B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003305299A JP4405767B2 (ja) 2003-08-28 2003-08-28 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置
CN2004800248891A CN1846173B (zh) 2003-08-28 2004-08-27 光致抗蚀剂剥离液组合物、图案的制造方法和显示装置
TW93125879A TWI364632B (en) 2003-08-28 2004-08-27 Photoresist removing liquid compositions for the substrate containing ag and/ or ag alloy, process for making aptterns made from these, and process for making display units containing them
PCT/JP2004/012346 WO2005022268A1 (ja) 2003-08-28 2004-08-27 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置
KR1020067004077A KR20060123714A (ko) 2003-08-28 2004-08-27 은 및/또는 은 합금을 포함하는 기판의 포토레지스트박리액 조성물, 그것을 이용한 패턴의 제조방법 및 그것을포함하는 표시장치
KR1020127009860A KR101318694B1 (ko) 2003-08-28 2004-08-27 은 및/또는 은 합금을 포함하는 기판의 포토레지스트 박리액 조성물, 그것을 이용한 패턴 형성방법 및 그것을 포함하는 표시장치의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003305299A JP4405767B2 (ja) 2003-08-28 2003-08-28 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009105900A Division JP4921514B2 (ja) 2009-04-24 2009-04-24 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置

Publications (3)

Publication Number Publication Date
JP2005077526A JP2005077526A (ja) 2005-03-24
JP2005077526A5 JP2005077526A5 (ko) 2006-09-14
JP4405767B2 true JP4405767B2 (ja) 2010-01-27

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JP2003305299A Expired - Lifetime JP4405767B2 (ja) 2003-08-28 2003-08-28 銀及び／又は銀合金を含む基板のフォトレジスト剥離液組成物、それを用いたパターンの製造方法ならびにそれを含む表示装置

Country Status (5)

Country Link
JP (1) JP4405767B2 (ko)
KR (2) KR101318694B1 (ko)
CN (1) CN1846173B (ko)
TW (1) TWI364632B (ko)
WO (1) WO2005022268A1 (ko)

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JP2007536566A (ja) * 2004-05-07 2007-12-13 ドウジン セミケム カンパニー リミテッド （フォト）レジスト除去用組成物
KR101082018B1 (ko) * 2004-05-07 2011-11-10 주식회사 동진쎄미켐 레지스트 제거용 조성물
WO2007029767A1 (ja) * 2005-09-09 2007-03-15 Tokyo Ohka Kogyo Co., Ltd. ホトリソグラフィ用洗浄剤およびこれを用いたホトレジストパターン形成方法
KR20090023398A (ko) * 2006-06-21 2009-03-04 이데미쓰 고산 가부시키가이샤 스트리핑 조성물, ｔｆｔ 기판의 제조 방법 및 스트리핑 조성물의 리사이클 방법
KR101403515B1 (ko) * 2006-06-22 2014-06-09 주식회사 동진쎄미켐 포토레지스트 제거용 조성물
KR101292497B1 (ko) * 2007-01-12 2013-08-01 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의박리방법
JP2008262960A (ja) * 2007-04-10 2008-10-30 Daisho Denshi:Kk 発光素子搭載用有機配線基板及びその製造方法
CN102301282B (zh) * 2008-11-28 2014-03-05 出光兴产株式会社 防腐蚀性光致抗蚀剂剥离剂组合物
KR20110053557A (ko) * 2009-11-16 2011-05-24 동우 화인켐 주식회사 레지스트 박리액 조성물
KR102414295B1 (ko) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 포토레지스트 제거용 박리액 조성물
JP6905421B2 (ja) 2017-08-28 2021-07-21 株式会社ジャパンディスプレイ 表示装置
KR102528302B1 (ko) * 2018-02-05 2023-05-04 삼성디스플레이 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트 박리 방법
CN108321163B (zh) * 2018-02-07 2020-10-16 业成科技（成都）有限公司 影像撷取装置及其制造方法

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JPS5880638A (ja) * 1981-11-10 1983-05-14 Kanto Kagaku Kk ポジ型フオトレジスト用剥離液
JPS6350838A (ja) * 1986-08-21 1988-03-03 Japan Synthetic Rubber Co Ltd 剥離液
JPS63208043A (ja) * 1987-02-25 1988-08-29 Kanto Kagaku Kk ポジ型フオトレジスト用水溶性剥離液
US6326130B1 (en) * 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
US5545353A (en) * 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
JP2911792B2 (ja) * 1995-09-29 1999-06-23 東京応化工業株式会社 レジスト用剥離液組成物
TW426816B (en) * 1996-04-17 2001-03-21 Ekc Technology Inc Hydroxylamine-gallic compound composition and process
JP3993272B2 (ja) * 1997-05-02 2007-10-17 大日本印刷株式会社 厚膜パターン形成方法
JP2000008184A (ja) * 1998-06-24 2000-01-11 Toppan Printing Co Ltd 多層導電膜のエッチング方法
JP2000100558A (ja) * 1998-09-18 2000-04-07 Matsushita Electric Ind Co Ltd 発光装置
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JP2003156859A (ja) * 2001-11-22 2003-05-30 Mitsubishi Gas Chem Co Inc フォトレジスト剥離剤組成物および剥離方法

Also Published As

Publication number Publication date
KR20060123714A (ko) 2006-12-04
WO2005022268A1 (ja) 2005-03-10
CN1846173B (zh) 2011-01-19
TW200508820A (en) 2005-03-01
KR20120068921A (ko) 2012-06-27
TWI364632B (en) 2012-05-21
JP2005077526A (ja) 2005-03-24
KR101318694B1 (ko) 2013-10-16
CN1846173A (zh) 2006-10-11

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