TW200508820A - Photoresist removing liquid compositions for the substrate containing ag and/ or ag alloy, process for making patterns made from these, and display units containing them - Google Patents

Photoresist removing liquid compositions for the substrate containing ag and/ or ag alloy, process for making patterns made from these, and display units containing them

Info

Publication number
TW200508820A
TW200508820A TW093125879A TW93125879A TW200508820A TW 200508820 A TW200508820 A TW 200508820A TW 093125879 A TW093125879 A TW 093125879A TW 93125879 A TW93125879 A TW 93125879A TW 200508820 A TW200508820 A TW 200508820A
Authority
TW
Taiwan
Prior art keywords
liquid compositions
carbon atoms
removing liquid
alloy
photoresist removing
Prior art date
Application number
TW093125879A
Other languages
Chinese (zh)
Other versions
TWI364632B (en
Inventor
Takuo Ohwada
Norio Ishikawa
Seiichi Yokoyama
Original Assignee
Kanto Kagaku
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku, Sony Corp filed Critical Kanto Kagaku
Publication of TW200508820A publication Critical patent/TW200508820A/en
Application granted granted Critical
Publication of TWI364632B publication Critical patent/TWI364632B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The present invention provides photoresist removing liquid compositions, which can be used for the substrate containing Ag and/or Ag alloy. This object is achieved by the photoresist removing liquid compositions comprising one or more compounds selected from the group consisting of - the compound of the formula (I) NH2-A-Y-B-Z Where A and B are each, individually of one another, a straight-chain or branched alkylene group having 1 to 5 carbon atoms, Y is NH or O, Z is NH2, OH, NH-D-NH2 (where, D is a straight-chain or branched alkylene group having 1 to 5 carbon atoms), the compound of the formula (II) NH2-A-N(-B-OH)2 Where A and B are as defined in the formula (I), the compound of the formula (III), where R is H, an alkyl group having 1 to 5 carbon atoms, a hydroxylalkyl group having 1 to 5 carbon atoms or an aminoalkyl group having 1 to 5 carbon atoms, pyrocatechol, hydroquinone, progallol, gallic acid, and gallic acid ester, and one or more polar organic solvents.
TW93125879A 2003-08-28 2004-08-27 Photoresist removing liquid compositions for the substrate containing ag and/ or ag alloy, process for making aptterns made from these, and process for making display units containing them TWI364632B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003305299A JP4405767B2 (en) 2003-08-28 2003-08-28 Composition for removing photoresist on substrate containing silver and / or silver alloy, method for producing pattern using the same, and display device including the same

Publications (2)

Publication Number Publication Date
TW200508820A true TW200508820A (en) 2005-03-01
TWI364632B TWI364632B (en) 2012-05-21

Family

ID=34269294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93125879A TWI364632B (en) 2003-08-28 2004-08-27 Photoresist removing liquid compositions for the substrate containing ag and/ or ag alloy, process for making aptterns made from these, and process for making display units containing them

Country Status (5)

Country Link
JP (1) JP4405767B2 (en)
KR (2) KR101318694B1 (en)
CN (1) CN1846173B (en)
TW (1) TWI364632B (en)
WO (1) WO2005022268A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427439B (en) * 2006-06-21 2014-02-21 Idemitsu Kosan Co A method for producing a TFT substrate, and a method for recovering the film-stripping composition

Families Citing this family (12)

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KR101082018B1 (en) * 2004-05-07 2011-11-10 주식회사 동진쎄미켐 Composition for removing a (photo)resist
JP2007536566A (en) * 2004-05-07 2007-12-13 ドウジン セミケム カンパニー リミテッド (Photo) Composition for resist removal
WO2007029767A1 (en) * 2005-09-09 2007-03-15 Tokyo Ohka Kogyo Co., Ltd. Washing agent for photolithography and method of forming photoresist pattern using the same
KR101403515B1 (en) * 2006-06-22 2014-06-09 주식회사 동진쎄미켐 Composition for removing photoresist
KR101292497B1 (en) * 2007-01-12 2013-08-01 동우 화인켐 주식회사 Resist stripper composition and stripping method of resist using the same
JP2008262960A (en) * 2007-04-10 2008-10-30 Daisho Denshi:Kk Organic wiring substrate for mounting light emitting device and its manufacturing method
KR20110096126A (en) * 2008-11-28 2011-08-29 이데미쓰 고산 가부시키가이샤 Anti-corrosive photoresist-removing agent composition
KR20110053557A (en) * 2009-11-16 2011-05-24 동우 화인켐 주식회사 A resist stripper composition
KR102414295B1 (en) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 Photoresist stripper composition
JP6905421B2 (en) * 2017-08-28 2021-07-21 株式会社ジャパンディスプレイ Display device
KR102528302B1 (en) * 2018-02-05 2023-05-04 삼성디스플레이 주식회사 Resist stripper composition and stripping method of resist using the same
CN108321163B (en) * 2018-02-07 2020-10-16 业成科技（成都）有限公司 Image capturing device and manufacturing method thereof

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JPS6350838A (en) * 1986-08-21 1988-03-03 Japan Synthetic Rubber Co Ltd Removing solution
JPS63208043A (en) * 1987-02-25 1988-08-29 Kanto Kagaku Kk Water soluble stripping liquid for positive type photoresist
US6326130B1 (en) * 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
US5545353A (en) * 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
JP2911792B2 (en) * 1995-09-29 1999-06-23 東京応化工業株式会社 Stripper composition for resist
TW426816B (en) * 1996-04-17 2001-03-21 Ekc Technology Inc Hydroxylamine-gallic compound composition and process
JP3993272B2 (en) * 1997-05-02 2007-10-17 大日本印刷株式会社 Thick film pattern forming method
JP2000008184A (en) * 1998-06-24 2000-01-11 Toppan Printing Co Ltd Etching of multilayer electrically conductive film
JP2000100558A (en) * 1998-09-18 2000-04-07 Matsushita Electric Ind Co Ltd Luminescent device
JP3161705B2 (en) * 1999-01-20 2001-04-25 東京応化工業株式会社 Stripper for positive resist
JP2001356496A (en) * 2000-06-15 2001-12-26 Nagase Kasei Kogyo Kk Photoresist remover composition and method for using the same
JP2002196510A (en) * 2000-12-26 2002-07-12 Nippon Zeon Co Ltd Resist removing solution
JP2002202617A (en) * 2000-12-27 2002-07-19 Tosoh Corp Resist removing composition
JP4474776B2 (en) * 2001-01-22 2010-06-09 東ソー株式会社 Resist stripper
JP4470328B2 (en) * 2001-02-09 2010-06-02 東ソー株式会社 Resist stripper
JP4483114B2 (en) * 2001-03-30 2010-06-16 東ソー株式会社 Resist stripper
JP2002357908A (en) * 2001-05-31 2002-12-13 Tokyo Ohka Kogyo Co Ltd Photoresist removing solution
JP4867092B2 (en) * 2001-07-04 2012-02-01 三菱瓦斯化学株式会社 Resist stripper composition
JP4620298B2 (en) * 2001-07-23 2011-01-26 パイオニア株式会社 Silver or silver alloy wiring, method for forming the same, and display panel substrate
JP2003140364A (en) * 2001-11-02 2003-05-14 Mitsubishi Gas Chem Co Inc Resist removing solution for copper wiring board
JP2003156859A (en) * 2001-11-22 2003-05-30 Mitsubishi Gas Chem Co Inc Photoresist remover composition and removing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427439B (en) * 2006-06-21 2014-02-21 Idemitsu Kosan Co A method for producing a TFT substrate, and a method for recovering the film-stripping composition

Also Published As

Publication number Publication date
TWI364632B (en) 2012-05-21
JP4405767B2 (en) 2010-01-27
KR101318694B1 (en) 2013-10-16
WO2005022268A1 (en) 2005-03-10
KR20120068921A (en) 2012-06-27
KR20060123714A (en) 2006-12-04
JP2005077526A (en) 2005-03-24
CN1846173B (en) 2011-01-19
CN1846173A (en) 2006-10-11

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