KR101403515B1 - Composition for removing photoresist - Google Patents

Abstract

The present invention relates to a resist-removing composition capable of inhibiting the corrosion of a wiring metal in a composition for removing an electric circuit or a resist for patterning a display element, more preferably a composition for removing a resist, which comprises a) a diamine compound ) 1 to 20% by weight, and b) the remainder of the glycol ether compound. The composition may further comprise a polar solvent.

The composition for resist stripping of the present invention does not corrode the wiring metal during the process time for removing the photoresist, and has a very excellent removing power.

A composition for removing a resist, a water-soluble solvent

Description

[Composition for removing photoresist]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for removing a resist used in a photo-lithography process, and more particularly, to a composition for removing a resist, And is excellent in removing ability of a resist.

Resists (photoresists) are materials that are essential for photolithography processes, and these photolithography processes can be applied to integrated circuits (ICs), large scale integration (LSI) large scale integration (VLSI), and image forming devices such as a liquid crystal display (LCD) and a plasma display device (PDP).

However, after photo-lithography processing, the resist is removed at a high temperature by the remover solution, and as the resist is removed at such a high temperature, the underlying metal film may quickly corrode by the remover solution.

That is, there is a problem that the degree of corrosion of the metal wiring is accelerated by the resist removing solution. Resist removing solutions for preventing these metal wiring corrosion problems have been disclosed in U.S. Patent No. 5,417,877, U.S. Patent No. 5,556,482, and Japanese Patent Laid-Open No. 2001-188363 (Japanese Patent Application Laid-Open No. 11-375267).

In this method, there is disclosed a method for preventing corrosion of a wiring metal used as a metal wiring by using a resist removing solution in which a corrosion inhibitor is added to a mixture of an amide material and an organic amine. Has designated monoethanolamine as the preferred amine. Further, it discloses an appropriate amount of the corrosion inhibitor, and it is suggested that the removal power of the photoresist film is lowered when the proper amount is exceeded.

In addition, in general, amines among the constituents of the resist remover solution have been mainly used as monoethanolamine, methylethanolamine, and other primary or secondary amines.

However, such a primary or secondary amine has a disadvantage in that the composition changes greatly due to a low boiling point, and there is an inconvenience to replace the entire removal solution during the process due to the change in weight and composition due to volatilization after a certain time. In addition, such a primary or secondary amine has a disadvantage in that if the corrosion inhibitor is not included, the metal wiring can be severely corroded even if a small amount of water is mixed.

It is an object of the present invention to provide a method of fabricating a metal wiring, especially aluminum, molybdenum, or the like, during removal of a resist film for a metal wiring pattern for implementing an electronic circuit or a display device, Which is excellent in removing ability of a resist film without corroding copper, titanium or the like.

In order to achieve the above object,

a) 1 to 20% by weight of a diamine compound which is at least one compound selected from compounds represented by the following general formula (1), and

b) the remainder of the glycol ether compound

Component resist-removing composition.

[Chemical Formula 1]

Wherein R and R 'are each independently hydrogen or an alkyl group having 1 to 10 carbon atoms and R "is hydrogen, an alkanol group having 1 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms Lt; / RTI > alkyl group)

The composition of the present invention may be a three-component composition further comprising at least one polar solvent, wherein the composition comprises: a) from 1 to 20% by weight of a diamine compound, b) from 10 to 10% by weight of a glycol ether compound, 90 wt%, and c) at least one polar solvent residue.

Hereinafter, the present invention will be described in more detail.

In the case of the ring-type amine used in the present invention, there is little influence on the corrosion of the metal wiring. Instead, the resist removal performance, which is severely modified by the dry etching process, amine. Therefore, in the present invention, in order to improve the resist removal performance in the case of employing the cyclic amine which has little influence on the corrosion of the metal wiring but has a poor ability to remove the resist which has been seriously denatured, the diamine is used as the amine compound, An amine or a chain amine is added together. The diamines have the same resist removal performance as the chain amines, but have less influence on the metal wiring than the chain amines and have a high boiling point. When used together with the cyclic amines, There is no need to worry.

In addition, the present invention can prevent the lower film from being corroded by the galvanic phenomenon with the upper metal film and remove the resist by using the amine and the solvent itself, which have little influence on the metal wiring corrosion, . However, even in the case of amines which have no influence on corrosion of metal wiring, when 0.1 to 3% of water is mixed with water, the corrosion of the single film proceeds seriously, and the corrosion of the upper film and the lower film due to the galvanic phenomenon, . Or water is not incorporated into the composition for removing resist, galvanic corrosion proceeds unless the intermediate cleaning step of an alcohol series such as isopropyl alcohol is performed after the peeling step. In this case, a small amount of corrosion inhibitor is added to prevent corrosion.

Therefore, the composition for removing resist according to the present invention is advantageous in that the metal wiring is not corroded in the step of removing the resist patterning the metal wiring, and the resist removing ability is excellent.

The resist-removing composition of the present invention is a two-component system composition using at least one amine compound selected from the group consisting of diamine compounds and a glycol ether compound as a solvent. And may be a three-component system using one or more polar solvents. In addition, the composition of the present invention may further include at least one anticorrosive agent to prevent corrosion by water contained in a small amount. In addition, the resist composition of the present invention may further include a ring-type amine or a chain-type amine as the amine compound.

Hereinafter, each component used in the resist stripping composition of the present invention will be described in detail.

Generally, corrosion of metal wiring is highly corrosive only to unsubstituted amines, both of the remaining hydrogens attached to the nitrogen of the cyclic amine or the chain amine, irrespective of the base level. However, when the resist removal process is carried out under high temperature conditions, since the volatile phenomenon does not occur well when the diamine compound is used as in the present invention, the composition ratio at the initial stage of use of the resist remover is kept constant, The change can be minimized. Further, in the present invention, this effect can be increased by using at least one compound selected from the group consisting of chain amines or cyclic amines having a boiling point of 200 DEG C or higher.

The amine compound is a strong alkaline substance which is modified as a strong alkaline substance under various process conditions such as dry etching or wet etching, ashing or ion implantation process, and is applied to a polymer matrix of a crosslinked resist. It penetrates strongly and breaks the attraction that exists in the molecule or between the molecules. The action of such an amine compound forms an empty space in a structurally weak part in the resist remaining on the substrate, thereby deforming the resist into an amorphous polymer gel state to easily remove the resist attached on the substrate .

The diamine compound may be at least one selected from compounds represented by the following formula (1).

[Chemical Formula 1]

Wherein R and R 'are each independently hydrogen or an alkyl group having 1 to 10 carbon atoms and R "is hydrogen, an alkanol group having 1 to 10 carbon atoms, Alkyl < / RTI > group.

Representative examples of the diamine compound include 2 - [(2-aminoethyl) amino] ethanol, 2 - [(2-aminomethyl) Aminoethyl] amino] -2-propanol), 2 - {[2- (methylamino) (2-amino-2- (2-amino-2-methylpropyl) amino] ethanol methylpropyl) amino] ethanol and 2 - {[2- (dimethylamino) ethyl] methylamino} ethanol (2 - {[2- . Aminoethyl] -2-propanol (1 - [(2-aminoethyl) amino] 2-aminoethyl) amino] -2-propanol).

The content of the diamine compound is preferably 1 to 20% by weight with respect to the total composition in consideration of deterioration of resist removal performance and corrosion.

In addition, the cyclic amines which can be further used in the present invention have a high boiling point, so that the changes in weight and composition due to volatility are not so significant, so that a longer time can be applied to the process than a chain type amine. The cyclic amine compound may be 1- (2-hydroxyethyl) piperazine, N- (3-aminopropyl) morpholine, 1 - (2-aminoethyl) piperazine, and 1- (2-hydroxylethyl) -4-ethylpiperazine, 4-amino-1-methylpiperazine, 1-methylpiperazine, 2-methylpiperazine, 1-benzylpiperazine, ), And 2-phenylpiperazine. The term " anionic surfactant " Examples of the chain amine compound include monoethanolamine, monoisopropanolamine, diethanolamine, triethanolamine, n-methylethanolamine, n-ethyl And at least one selected from the group consisting of n-ethylethanolamine, dimethylethanolamine, diethylethanolamine, aminoethoxyethanol, and aminomethoxyethanol may be used. . When the cyclic amine or the chain amine compound is used, the cyclic amine or the chain amine compound may be further added in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the total composition.

The glycol ether compound may be selected from the group consisting of ethyleneglycol methylether, ethyleneglycol ethylether, ethyleneglycol buthylether, diethyleneglycol methylether, diethylyeneglycol ethylether Diethyleneglycol butyl ether, diethyleneglycol propylether, triethyleneglycol butylether, triethyleneglycol ethylether, and triethyleneglycol methylether), diethyleneglycol propylether, triethyleneglycol butylether, triethyleneglycol ethylether, (triethyleneglycol methylether) may be used.

However, glycol ether compounds having low boiling points may be toxic, and they are difficult to apply because of a serious compositional change due to volatilization.

Therefore, it is preferable to use a compound having a boiling point of 180 ° C or higher and a water-insoluble solubility in the glycol ether solvent so as not to cause the above problems. That is, when using a glycol ether solvent having a boiling point higher than 180 ° C. in the resist removal step under high temperature conditions, the volatilization phenomenon does not occur well and the composition ratio at the initial stage of use of the resist remover can be kept constant.

If a glycol ether solvent having a boiling point of 180 ° C or higher is used, the removal performance of the resist remover can be continuously manifested throughout the entire resist removal cycle, and since the surface force in the resist and the lower metal film layer is low, Not only the removal efficiency can be improved, but also the freezing point is low and the flash point is high.

Examples of the glycol ether compound having a boiling point of 180 ° C or higher include diethyleneglycol methylether, diethyleneglycol butylether, diethylyleneglycol ethylether, triethylene glycol butyl ether ( triethyleneglycol butylether, triethyleneglycol ethylether, and triethyleneglycol methylether. The most preferable effect can be obtained by using at least one selected from the group consisting of triethyleneglycol butylether, triethyleneglycol ethylether, and triethyleneglycol methylether.

If the content of the glycol ether compound is too small, corrosion of the metal wiring is increased by the polar solvent and the amine compound which are relatively increased, and the solubility of the gel polymerized by the amine compound and the polar solvent becomes insufficient, The removal ability is deteriorated, and if too much, the content of the polar solvent may be reduced and the resist removing ability may be lowered. Therefore, in consideration of the above-mentioned point, the content of the glycol ether compound may be included in the remainder excluding the diamine in the case of two-component system, and 10 to 90% by weight in the case of the three- desirable.

In particular, the composition for removing resist of the present invention further comprises at least one polar solvent to dissolve the polymer gel lump separated by the amine compound into a unit molecule. Therefore, the polar solvent according to the present invention is characterized by being able to prevent defective resist reattachability, which occurs mainly in the cleaning process. A polar solvent such as N-methyl-2-pyrrolidone containing an amine as an intramolecular functional group acts to assist the function of penetrating and removing the amine compound into the resist.

In the polar solvent is N- methyl-2-pyrrolidone (N -Methyl-2-pyrrolidone, NMP), N- methyl-acetamide (N-methylacetamide), N, N- dimethylacetamide (N, N-dimethylacetamide ), Acetamide, N-ethylacetamide, N, N-diethylacetamide, formamide, N-methylformamide N- methylformamide, N, N-dimethylformamide, N-ethylformamide, N, N-diethylformamide and N, N- dimethyl-imidazole (N, N-dimethylimidazole) may be at least one selected consisting of, more preferably N- methyl-2-pyrrolidone (N -Methyl-2-pyrrolidone, NMP), N- methyl formamide At least one selected from the group consisting of N-methylformamide, N-methylacetamide and N, N-dimethylacetamide.

The content of the polar solvent may be included in the total composition of the three-component system in consideration of the resist removing power, the degree of corrosion of the metal wiring, and the cleaning power, and more preferably 9 to 70% by weight.

In addition, the composition of the present invention further comprises one or more corrosion inhibitors to prevent corrosion by water contained in a small amount.

The above-mentioned corrosion inhibitor is effective for a corrosion inhibitor including a compound having -N-, -S-, -O-, or the like having a non-covalent electron pair. Particularly, in the case of -OH group -SH group, physical and chemical adsorption Is excellent in anti-corrosion performance.

The corrosion inhibitor may be selected from the group consisting of mercaptobenzimidazole, mercaptomethylbenzimidazole, mercaptomethylimidazole, hydroxypyridine, dihydroxy pyridine, methyl (1) from the group consisting of methyl trihydroxybenzoate, pyrocatechol, catechol, L-ascorbic acid and D-isoascorbic acid. More than one species can be selected and used. More preferably, the corrosion inhibitor is selected from the group consisting of mercaptomethylimidazole, methyl trihydroxybenzoate, pyrocatechol, L-ascorbic acid, and D- (D-isoascorbic acid), and the like.

If the content of the corrosion inhibitor is too small, corrosion can not be controlled and metal wiring can be corroded. If it is too much, it affects the resist removal force, which lowers the resist removal force, and is strongly adsorbed on the substrate, Can be prevented. Accordingly, in view of the above points, the corrosion inhibitor may be contained in an amount of 0.01 to 10 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the total composition.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. However, the present invention is not limited to these examples. In the following examples, the percentages and mixing ratios are based on weight unless otherwise specified.

[Example]

Amines and corrosion inhibitors were performed. The specimens to be tested were as follows.

Experimental Example  The specimens used in Examples 1 and 2 (first, 2 The Psalms )

First, to evaluate the corrosion resistance of metals, specimens were prepared by film formation of aluminum, molybdenum, and copper on the surface of glass to a thickness of 2000 Å, coating of resist, and development. )

Secondly, in order to evaluate the removal power of the resist, chromium (Cr) is deposited on the glass, and resist is coated thereon. After wet etching, n + a-Si : H active film specimen was used. (Specimen 2) Further, a dry etching process was performed one more time to form a resist denatured by dry etching (specimen 3) . The adhesion of the resist to the chromium is maximized. When the dry etching gas is applied, the resist is deformed and is not easily removed by the remover, so it can be used as a test sample for testing the resist removal force.

<Experimental Example 1>

Resist Removal Ability for Single Raw Materials (Specimen 2, Specimen 3) Specimens prepared for evaluating corrosion resistance (specimen 1) of aluminum, molybdenum, and copper were used, respectively, and the results are shown in Table 1 below.

Evaluation of metal film corrosion Resist removal
aluminum molybdenum Copper 70 ° C, 20 minutes of immersion 70 캜, 30 sec immersion (specimen 3) 70 캜, 30 sec immersion (specimen 2) Monoethanolamine X X X ◎ ◎ 1- (2-hydroxyethyl) piperazine ○ ○ ○ △ ○ 1- (2-aminoethyl) piperazine ○ ○ X ○ ◎ 1- (2-hydroxyethyl) -4-methylpiperazine ◎ ◎ ◎ △ ○ N- (3-aminopropyl) morpholine △ △ X ○ ◎ 2-methylpiperazine ○ ○ △ △ △ 1-methylpiperazine ○ ○ ○ △ △ 1-Amino-1-methylpiperazine ○ ○ ○ ○ ◎ 2 - [(2-aminoethyl) amino] ethanol △ ○ X ◎ ◎ 1 - [(2-aminoethyl) amino] 2-propanol △ ○ X ◎ ◎ N-methyl-2-pyrrolidone ◎ ◎ ◎ △ ○ N, N-dimethylacetamide ◎ ◎ ◎ △ ○ Diethylene glycol butyl ether ◎ ○ ◎ X △ Diethylene glycol ethyl ether ◎ ○ ◎ X △

Note) In Table 1,

1) Corrosivity: ◎ (no corrosion at all), ○ (with some corrosion), Δ (severe corrosion), X (completely corroded)

2) Evaluation of resist removal ability:? (Complete resist removal),? (With a little resist residue),? (With a large amount of resist residue), X (no resist removal)

As shown in Table 1, the chain amines such as monoethanolamine were severely corroded, while the cyclic amines were excellent in removing the resist, but did not show significant corrosion of the metal. In the case where all the hydrogen atoms attached to nitrogen in the cyclic amine structure are substituted with an alkyl group, a benzene group or an alcohol group, the corrosion inhibiting ability is excellent but the removal ability is not obtained.

It can be seen from Table 1 that the resist removal performance differs depending on the degree of denaturation of the resist film for each raw material, and it can be seen that the resist film with a severe denaturation is slightly lower in the removal performance than the chain type amine have. However, it can be seen that the removal performance of the chain type amines, diamines, and the like does not drop significantly depending on the degree of modification of the resist-modified film. As a result, the resist removal performance of the diamine is lower than that of the chain type amine. The effect on corrosion is less than that of chain amines.

<Experimental Example 2>

As shown in Table 2 below, the degree of corrosion of the metal was tested for the monoethanolamine and the amines used in the present invention, using the test piece 1. In the case of amines having a problem in resist removal performance in a single evaluation, two amines were used in combination. Further, in the above-mentioned single evaluation, since there is little corrosion to each metal, 45% by weight of glycol ether and 45% by weight of diethylene glycol butyl ether as a polar solvent are used, and 2 or 1 amine Was 10 wt%. The results are shown in Table 2.

   Degree of metal corrosion aluminum molybdenum Copper Monoethanolamine ○ ○ X 1- (2-hydroxyethyl) piperazine ◎ ◎ ◎ 1- (2-aminoethyl) piperazine ◎ ◎ X N- (3-aminopropyl) morpholine ○ ○ X 1- (2-hydroxyethyl) 4-methylpiperazine ◎ ◎ ◎ 2 - [(2-aminoethyl) amino] ethanol ○ ◎ ○ 1 - [(2-aminoethyl) amino] 2-propanol ○ ◎ ○ 1-Amino-1-methylpiperazine ◎ ○ ◎ 2 - [(2-aminoethyl) amino] ethanol
1- (2-hydroxyethyl) piperazine ◎ ◎ ○ Monoethanolamine
1- (2-hydroxyethyl) piperazine ◎ ◎ △

Note: In Table 2, the degree of corrosion: ⊚ (no corrosion at all), ◯ (with little corrosion), Δ (severe corrosion), X (completely corroded)

Table 2 shows that, compared to monoethanolamine, cyclic amines show good results in terms of metal corrosion in aluminum and molybdenum. Also, among the cyclic amine structures, the larger the number of functional substituents than hydrogen in the nitrogen, the more favorable the copper corrosion.

In addition, when a diamine or monoethanolamine having no other functional groups substituted for hydrogen in place of hydrogen is used in combination with a cyclic amine, the effect of corrosion can be improved.

&Lt; Examples 1 to 20 and Comparative Examples 1 and 2 >

Compositions of Examples and Comparative Examples were prepared with the compositions shown in Table 1 below.

Hereinafter, Experimental Examples 3 and 4 were conducted to evaluate the resist removal force and corrosion resistance for each metal wiring in the composition of the resist removal solution. Specimens used in Experimental Examples 3 and 4 were used for corrosion prevention evaluation (Specimen 1) and for resist removal performance (Specimen 3).

Experiments using the resist removal solvent prepared under the conditions shown in the following Table 3 were carried out using the above-mentioned specimens.

division Amine 1 Amine 2 Glycol ether Polar solvent 1 Polar solvent 2 Corrosion inhibitor 1 Corrosion inhibitor 2 Kinds content
(wt%) Kinds content
(wt%) Kinds content
(wt%) Kinds content
(wt%) Kinds content
(wt%) Kinds content
(weight
part) Kinds content
(weight
part)



room
city
Yes One AEAE 5 DEGBE 65 NMP 30 MTHB 0.5 MMI 0.03 2 AEAE 5 DEGREE 65 MMF 30 L-AA 0.5 MMI 0.03 3 AEAE 2 DEGREE 65 MMAc 33 MTHB 0.5 MMI 0.03 4 AEAE 5 DEGREE 65 MMF 30 Pyro 0.5 MMI 0.03 5 MAEAE 5 DEGBE 65 NMP 30 MTHB 0.5 MMI 0.03 6 MAEAE 5 DEGREE 65 MMF 30 MTHB 0.5 MMI 0.03 7 AEAP 10 DEGBE 60 NMP 30 MTHB 0.5 MMI 0.03 8 AEAP 15 DEGREE 60 MMF 25 MTHB 0.5 MMI 0.03 9 AEAE 3 MEA 2 DEGREE 65 MMF 30 MTHB 0.5 MMI 0.03 10 AEAE 3 DEA 2 DEGREE 65 MMF 30 MTHB 0.5 MMI 0.03 11 HEP 3 AEAE 2 DEGREE 65 MMF 30 MMI 0.03 12 HEP 6 AEAP 6 DEGREE 60 NMP 28 MMI 0.03 13 HEP 3 AEAE 2 DEGREE 65 MMF 15 DMAc 15 MMI 0.03 14 HEP 6 AEAE 4 DEGREE 60 MMF 10 NMP 15 MMI 0.03 15 HEP 3 AEAP 2 DEGREE 65 MMF 15 DMAc 15 MMI 0.03 16 APM 3 AEAE 2 DEGREE 65 MMF 30 MMI 0.03 17 AEAE 5 DEGREE 55 NMP 40 18 MAEAE 5 DEGBE 55 MMF 40 19 AEAP 5 DEGREE 55 DMAc 40 20 AEAE 5 DEGREE MMF 40 DMAc 55 compare
Yes One MEA 10 DEGBE 60 NMP 30 NMP 30 2 HEP 5 DEGBE 65 NMP 30 NMP 30

Note) In Table 3,

HEP: 1- (2-hydroxyethyl) piperazine

APM: N- (3-aminopropyl) morpholine.

AEAE: 2 - [(2-aminoethyl) amino] ethanol (2 - [(2-aminoethyl) amino]

AEAP: 1 - [(2-aminoethyl) amino] -2-propanol (1 -

MAEAE: 2- [2- (methylamino) ethyl] aminoethanol (2- [2- (methylamino) ethyl] aminoethanol)

MEA: monoethanolamine

DEA: diethanolamine

MMI: mercaptomethylimidazole.

MTHB: methyltrihydroxybenzoate &lt; RTI ID = 0.0 &gt;

Pyro: pyrocatechol

L-AA: L-ascorbic acid

NMP: N-methyl-2-pyrrolidone ( N -methyl-

DMAc: dimethylacetamide &lt; RTI ID = 0.0 &gt;

MMAc: monomethylacetamide &lt; RTI ID = 0.0 &gt;

MMF: N-methylformamide &lt; RTI ID = 0.0 &gt;

DEGME: diethyleneglycol methylether

DEGBE: diethyleneglycol buthylether

<Experimental Example 3>

Using the above-described Examples 1 to 20 and Comparative Examples 1 and 2, the removing ability of the third specimen to the film quality was evaluated. Particularly, in order to observe the change of resist removal performance due to volatilization, each removal solution was kept at 70 ° C for 48 hours under forced evacuation to evaluate the removal performance of specimen 3. After the removal solution was terminated at 70 ° C, the above (Specimen 3) was immersed and observed with naked eyes. The results are shown in Table 4.

Evaluation of removal power division Psalm 3
150 seconds of immersion Psalm 3
48 hours volatilization and 150 seconds immersion Example 1 ◎ ◎ Example 2 ◎ ◎ Example 3 ◎ ◎ Example 4 ◎ ◎ Example 5 ◎ ◎ Example 6 ◎ ◎ Example 7 ◎ ◎ Example 8 ◎ ◎ Example 9 ◎ ◎ Example 10 ◎ ◎ Example 11 ◎ ◎ Example 12 ◎ ◎ Example 13 ◎ ◎ Example 14 ◎ ◎ Example 15 ◎ ◎ Example 16 ◎ ◎ Example 17 ◎ ◎ Example 18 ◎ ◎ Example 19 ◎ ◎ Example 20 ◎ ◎ Comparative Example 1 ◎ △ Comparative Example 2 △ △

(Removal of the resist completely), O (with a little resist residue),? (Excessive resist residue), X (no resist removal)

As can be seen from the comparative example, it was found that when the amine having a low boiling point was kept alone at 70 ° C. for 48 hours, the removal performance was significantly lowered. Since each of the corrosion inhibitors does not affect the peeling performance largely, all of the examples show that the peeling performance is not changed because the boiling point of the cyclic amine is 200 ° C or higher, so that the composition is not largely changed even after 48 hours of volatilization, It can be seen that the composition which significantly affects performance is amine. In addition, the peeling performance of Examples is higher than that of Comparative Example 2, and peeling performance is different when the polar solvent is added differently. Examples 9 and 10 in which a diamine and a chain amine were added together, and Examples 11 to 16 in which a diamine and a cyclic amine were also added together showed a synergistic effect of peeling performance. Particularly, since the boiling point of the diamine exceeds 200 ° C, it can be seen that the performance is not significantly affected after 48 hours. Therefore, when a diamine is added together with a cyclic amine whose peeling performance is poor with respect to a seriously modified resist-modified film, the performance can be synergistically improved with respect to the peeling performance.

<Experimental Example 4>

The corrosion resistance of each of the metal films of Examples 1 to 20 and Comparative Examples 1 and 2 was evaluated by using the fourth specimen (Piece 1). In addition, the difference in each example was evaluated by adding 3% water in order to observe remarkably, and the results are shown in Table 5.

                              Corrosion evaluation division First Specimen
600 seconds immersion, aluminum First Specimen
600 seconds immersion, molybdenum First Specimen
600 seconds of immersion, copper Example 1 ◎ ◎ ○ Example 2 ◎ ◎ ○ Example 3 ◎ ◎ ○ Example 4 ◎ ◎ ○ Example 5 ◎ ◎ ○ Example 6 ◎ ◎ ○ Example 7 ◎ ◎ ○ Example 8 ◎ ◎ ○ Example 9 ◎ ◎ ○ Example 10 ◎ ◎ ◎ Example 11 ◎ ◎ ◎ Example 12 ◎ ◎ ◎ Example 13 ◎ ◎ ◎ Example 14 ◎ ◎ ◎ Example 15 ◎ ◎ ◎ Example 16 ◎ ◎ ○ Example 17 ◎ ◎ ○ Example 18 ◎ ◎ ○ Example 19 ◎ ◎ ○ Example 20 ◎ ◎ ○ Comparative Example 1 x ○ x Comparative Example 2 △ ◎ △

Note: In Table 5, the degree of corrosion: ⊚ (no corrosion at all), ◯ (with a little corrosion), Δ (severe corrosion), X (completely corroded)

From the results shown in Table 5, it was found that corrosion of each metal film in the examples of the present invention was superior to the comparative example by using a diamine compound, and it was found that, compared with the case where the diamines were used singly, Showed better corrosion protection performance when mixed together.

In addition, even when diamine or the like was added to assure a slight resist removal performance, the corrosion performance was not affected, and both showed good results. That is, it was found that only one type of corrosion inhibitor showed satisfactory results in all the metal films. Therefore, when two amines are added, the synergistic effect can be obtained which can take only the advantages of each type.

In addition, antioxidants of the hydroxyl phenol series selected as corrosion inhibitors can exert excellent corrosion inhibiting effects on aluminum or molybdenum, which can be selectively adsorbed on aluminum or molybdenum physically and chemically It is presumed that the flow of electrons is disturbed. Likewise, the corrosion inhibitors of the mercapto series inhibit the galvanic effect by overcoming the potential difference with the underlying film by not only chemically adsorbing on the copper surface but also lowering the redox potential.

The composition for removing resist according to the present invention has the effect of minimizing the corrosion of the metal film under the resist and completely removing and cleaning the resist.

Claims (11)

(2-aminoethyl) amino] -2-propanol, 2- {[2- aminoethylamino] (Methylamino) ethyl] amino} ethanol and 2 - [(2-amino-2-methylpropyl) amino] ethanol and 2- {[2- (dimethylamino) ethyl] methylamino} 1 to 20% by weight of the diamine compound; And b) a residue of a glycol ether compound, Further comprising 0.01 to 10 parts by weight of a corrosion inhibitor based on 100 parts by weight of the total composition, The corrosion inhibitor is selected from the group consisting of mercaptobenzimidazole, mercaptomethylbenzimidazole, mercaptomethylimidazole, hydroxypyridine, dihydroxypyridine, methyltrihydroxybenzoate, L-ascorbic acid and D-isoascorbic acid Wherein the resist composition comprises at least one member selected from the group consisting of the following. The composition for removing resist according to claim 1, wherein the composition further comprises at least one polar solvent. The composition according to claim 2, wherein the composition further comprises at least one polar solvent, wherein a) 1 to 20% by weight of a diamine compound, b) 10 to 90% by weight of a glycol ether compound, and c) And a solvent residue. delete The method according to claim 1, wherein the glycol ether compound is selected from the group consisting of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol butyl ether, diethylene glycol propyl ether, Triethylene glycol ethyl ether, triethylene glycol butyl ether, triethylene glycol ethyl ether, and triethylene glycol methyl ether. 3. The method of claim 2, wherein the polar solvent is selected from the group consisting of N-methyl-2-pyrrolidone, N-methylacetamide, N, N-dimethylacetamide, acetamide, N- At least one compound selected from the group consisting of amide, formamide, N-methylformamide, N, N-dimethylformamide, N-ethylformamide, N, N-diethylformamide and N, A composition for removing a resist. 3. The method of claim 2, wherein the polar solvent is at least one selected from the group consisting of N-methyl-2-pyrrolidone, N-methylformamide, N-methylacetamide and N, N- / RTI &gt; delete delete The composition of claim 1, wherein the corrosion inhibitor is at least one selected from the group consisting of mercaptomethylimidazole, methyltrihydroxybenzoate, L-ascorbic acid, and D-isoascorbic acid. The composition of claim 1 wherein the composition is selected from the group consisting of 1- (2-hydroxyethyl) piperazine, 1- (2-aminoethyl) piperazine, 1- At least one cyclic amine compound selected from the group consisting of amino-1-methylpiperazine, 1-methylpiperazine, 2-methylpiperazine, 1-benzylpiperazine, and 2-phenylpiperazine; Or monoethanolamine, monoisopropanolamine, diethanolamine, triethanolamine, n-methylethanolamine, n-ethylethanolamine, dimethylethanolamine, diethylethanolamine, aminoethoxyethanol, and aminomethoxyethanol Is added in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the total composition.