JP2011529263A5 - - Google Patents

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Publication number
JP2011529263A5
JP2011529263A5 JP2011518995A JP2011518995A JP2011529263A5 JP 2011529263 A5 JP2011529263 A5 JP 2011529263A5 JP 2011518995 A JP2011518995 A JP 2011518995A JP 2011518995 A JP2011518995 A JP 2011518995A JP 2011529263 A5 JP2011529263 A5 JP 2011529263A5
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JP
Japan
Prior art keywords
conductor
forming
under bump
conductor structure
layer
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Granted
Application number
JP2011518995A
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English (en)
Japanese (ja)
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JP5595396B2 (ja
JP2011529263A (ja
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Priority claimed from US12/180,042 external-priority patent/US8314474B2/en
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Publication of JP2011529263A publication Critical patent/JP2011529263A/ja
Publication of JP2011529263A5 publication Critical patent/JP2011529263A5/ja
Application granted granted Critical
Publication of JP5595396B2 publication Critical patent/JP5595396B2/ja
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JP2011518995A 2008-07-25 2009-07-23 オンダイ・キャパシタ用アンダーバンプメタル Active JP5595396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/180,042 US8314474B2 (en) 2008-07-25 2008-07-25 Under bump metallization for on-die capacitor
US12/180,042 2008-07-25
PCT/CA2009/001039 WO2010009553A1 (en) 2008-07-25 2009-07-23 Under bump metallization for on-die capacitor

Publications (3)

Publication Number Publication Date
JP2011529263A JP2011529263A (ja) 2011-12-01
JP2011529263A5 true JP2011529263A5 (enExample) 2012-09-06
JP5595396B2 JP5595396B2 (ja) 2014-09-24

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ID=41567883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011518995A Active JP5595396B2 (ja) 2008-07-25 2009-07-23 オンダイ・キャパシタ用アンダーバンプメタル

Country Status (6)

Country Link
US (1) US8314474B2 (enExample)
EP (2) EP3193366A3 (enExample)
JP (1) JP5595396B2 (enExample)
KR (1) KR101752375B1 (enExample)
CN (1) CN102150228B (enExample)
WO (1) WO2010009553A1 (enExample)

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