JP2007059878A - 半導体装置、及び発振器 - Google Patents
半導体装置、及び発振器 Download PDFInfo
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- JP2007059878A JP2007059878A JP2006176274A JP2006176274A JP2007059878A JP 2007059878 A JP2007059878 A JP 2007059878A JP 2006176274 A JP2006176274 A JP 2006176274A JP 2006176274 A JP2006176274 A JP 2006176274A JP 2007059878 A JP2007059878 A JP 2007059878A
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- wiring layer
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- semiconductor device
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- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】半導体装置1は、能動素子としての集積回路12と、集積回路12に電気的に接続される複数の接続電極(14,15)とを含む半導体基板10と、半導体基板10の接続電極14,15が形成される面に、接続電極14,15を避けて形成される第1の樹脂層70と、半導体基板10と第1の樹脂層70の間に形成され、複数の接続電極のうちの一つに接続される接続配線層25,26と、接続配線層25,26に一端が接続され、第1の樹脂層の表面に形成されるCu配線層からなる渦巻き形状のスパイラルインダクタ40,50と、スパイラルインダクタ40,50の表面を覆う第2の樹脂層75と、複数の接続電極のいくつかと電気的に接続され、第2の樹脂層75から一部が突出してなる外部端子81〜86と、を備える。
【選択図】図2
Description
ここで、キャパシタを構成する第1の樹脂層は、積層型キャパシタにおける誘電体であり、Cu配線層と接続配線層とは誘電体を挟む電極に相当する。
図1〜図3は本発明の実施形態1に係る半導体装置を示し、図4〜図6は、実施形態2に係る半導体装置である。
(実施形態1)
パッシベーション膜16は、SiN、SiO2、MgOなどから形成され、接続端子(14,15)は、Alで形成されている。
なお、樹脂層70は20um以上の厚さを持つことが好ましい。
このスパイラルインダクタ40の内側の端部42は、Cu接続配線層55からの立ち上げ部に接続されている。
まず、パッシベーション膜16と接続電極14,15が形成された半導体基板10の表面に接続配線層25,26をスパッタリングにより形成する。接続電極14,15と接続配線層25,26とは電気的に接続された状態である。この際、接続配線層25,26は連続した全面に形成される。
続いて、第1の樹脂層70(ポリイミド樹脂)を全面に塗布する。
負性抵抗部は、Nチャンネルトランジスタ93のドレインが出力端子OUT1に接続され、ゲートは出力端子OUT2に接続されている。また、Nチャンネルトランジスタ94のドレインは出力端子OUT2に接続され、ゲートは出力端子OUT1に接続されている。また、出力端子OUT1、OUT2の直前には出力信号を増幅するバッファアンプ97、98を備えている。
また、本実施形態の電圧制御発振器90の共振回路における位相雑音特性は、Q値の二乗に反比例することが知られている。ただし、発振回路の位相雑音特性で用いられるQ値は、負荷Qと呼ばれる回路全体の損失を表す値であるが、本実施例の場合ではスパイラルインダクタ部の寄与がもっとも大きいためスパイラルインダクタのQ値で議論しても良い。従って、スパイラルインダクタ部のQ値を大きくすることにより位相雑音特性(位相ノイズ)を低減することができる。
(実施形態2)
パッシベーション膜16の上面には、第1の樹脂層70が形成され、この最上層には第1のCu配線層からなるスパイラルインダクタ140,150と、第2のCu配線層からなるキャパシタC1,C2を構成する上部電極部165が形成される。
すなわち、本発明は、主に特定の実施形態に関して特に図示され、且つ、説明しているが、本発明の技術的思想及び目的の範囲に逸脱することなく、以上説明した実施形態に対し、形状、材質、それらの組み合わせ、及びその他の詳細な構成において、当業者が様々な変形を加えることができるものである。
Claims (6)
- 能動素子としての集積回路と、該集積回路に電気的に接続される複数の接続電極とを含む半導体基板と、
前記半導体基板の前記接続電極が形成される面に、前記接続電極を避けて形成される第1の樹脂層と、
前記半導体基板と前記第1の樹脂層の間に形成され、前記複数の接続電極のうちの一つに接続される接続配線層と、
前記接続配線層に一端が接続され、前記第1の樹脂層の表面に形成されるCu配線層と、
前記接続配線層と前記Cu配線層とからなる受動素子と、
前記Cu配線層の表面を覆う第2の樹脂層と、
前記複数の接続電極のいくつかと電気的に接続され、前記第2の樹脂層から一部が突出してなる外部端子と、を備えることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記受動素子が、前記第1の樹脂層の表面に形成されるCu配線層からなるスパイラルインダクタであることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記受動素子が、前記接続配線層と、前記Cu配線層と、前記接続配線層と前記Cu配線層とが交差する領域に挟まれる第1の樹脂層と、からなるキャパシタであり、
前記キャパシタが、前記集積回路に設けられる可変キャパシタと並列に接続されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記受動素子が、前記第1の樹脂層の表面に形成される第1のCu配線層からなるスパイラルインダクタと、
前記第1の樹脂層の表面に形成される第2のCu配線層と、前記接続配線層と、前記第2のCu配線層と前記接続配線層とが交差する領域に挟まれる第1の樹脂層と、からなるキャパシタと、から構成されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記半導体装置が、前記第2の樹脂層によって、前記外部端子の一部を除いて封止されていることを特徴とする半導体装置。 - 能動素子としての集積回路と、該集積回路に電気的に接続された複数の接続電極とを含む半導体基板と、
前記半導体基板の前記接続電極が形成される面に、前記接続電極を避けて形成される第1の樹脂層と、
前記第1の樹脂層の表面に、共振回路を構成する前記請求項2に記載のスパイラルインダクタと、前記請求項3に記載のキャパシタのどちらか一方、または両方を並列に接続して構成される受動素子と、
前記複数の接続電極のいくつかに接続する外部端子と、を備えることを特徴とする発振器。
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KR1020060070159A KR100744276B1 (ko) | 2005-07-27 | 2006-07-26 | 반도체 장치 및 발진기 |
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