WO2010089921A1 - 平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール - Google Patents
平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール Download PDFInfo
- Publication number
- WO2010089921A1 WO2010089921A1 PCT/JP2009/067843 JP2009067843W WO2010089921A1 WO 2010089921 A1 WO2010089921 A1 WO 2010089921A1 JP 2009067843 W JP2009067843 W JP 2009067843W WO 2010089921 A1 WO2010089921 A1 WO 2010089921A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin layer
- flat coil
- module
- coil
- flat
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the present invention relates to a method for manufacturing a module with a flat coil and a module with a flat coil.
- Patent Document 1 proposes a printed circuit board with a built-in inductor.
- This inductor-embedded printed circuit board will be described with reference to FIG.
- the printed circuit board 1 is formed with a through hole 1a having a predetermined shape.
- An annular counterbore 1b is formed outside the through hole 1a, and an annular insulating wall 1c is interposed between the counterbore 1b and the through hole 1a.
- a coil 2 is attached to the counterbore 1b.
- the coil 2 is formed by winding a winding covered with an insulating film.
- a first core member 3a having a flat plate is attached to the printed circuit board 1 from the lower surface side with respect to the through hole 1a.
- the core member 3b is disposed.
- the first core member 3a is bonded to the printed circuit board 1 and the second core member 3b is bonded to the first core member 3a and the printed circuit board 1, and the first and second core members 3a and 3b are bonded.
- the present invention has been made to solve the above-described problems, and provides a method for manufacturing a module with a flat coil and a module with a flat coil that can reduce the manufacturing cost and can cope with a large current.
- the purpose is to do.
- the method of manufacturing a module with a flat coil according to the present invention includes a step of providing a second resin layer exhibiting magnetism or non-magnetism on a first resin layer containing a chip-type electronic component, and the second resin layer. And a step of providing a flat coil on the top and a step of providing a third resin layer exhibiting magnetism or non-magnetism so as to cover the flat coil.
- the flat plate coil and the magnetic core are provided on the second resin layer in an uncured state, and after the second resin layer is cured, the uncured state is formed so as to cover the flat coil and the magnetic core.
- the third resin layer is provided, and the surface of the third resin layer is planarized using the magnetic core as a spacer.
- the module with a flat coil of the present invention includes a first resin layer containing a chip-type electronic component, a second resin layer exhibiting magnetism or non-magnetism disposed on the first resin layer, A flat coil disposed on the second resin layer and a third or non-magnetic third resin layer covering the flat coil are provided.
- the core portion of the flat coil has a magnetic core.
- the surface of the magnetic core is exposed on the surface of the third resin layer.
- the third resin layer is preferably a nonmagnetic resin layer, and the flat coil is preferably configured to function as an antenna.
- the flat coil is configured as a power transmission coil of a non-contact power transmission device, and as a non-contact power transmission module including the power transmission coil and a power transmission circuit or the power transmission coil and a power reception circuit. Can be configured.
- the third resin layer can be formed as a magnetic resin layer, and the flat coil can function as an inductor.
- the flat coil can be used as an inductor for a filter circuit including an inductor and a capacitor.
- the present invention it is possible to provide a method for manufacturing a module with a flat coil and a module with a flat coil that can reduce the manufacturing cost and cope with a large current.
- (A) is sectional drawing which shows one Embodiment of the module with a flat coil of this invention
- (b) is a block diagram which shows an example of the non-contact-type electric power transmission apparatus to which the module with a flat coil shown in (a) is applied. It is.
- (A)-(f) is process drawing which shows one Embodiment of the manufacturing method of the module with a flat coil shown in FIG. 1, respectively. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention. It is sectional drawing which shows other embodiment of the module with a flat coil of this invention.
- FIG. 1 It is sectional drawing which shows other embodiment of the module with a flat coil of this invention.
- A is sectional drawing which shows other embodiment of the module with a flat coil of this invention
- (b) is a block which shows the example by which the module with the flat coil shown to (a) was comprised as a DC-DC converter.
- FIG. It is a top view which shows the other flat coil used for the module with a flat coil of this invention.
- FIG. drawing shows the principal part of the printed circuit board which incorporates the conventional coil.
- a flat coil-equipped module 10 includes, for example, as shown in FIG. 1A, a first resin layer 12 containing a chip-type electronic component 11 and a first resin layer.
- a magnetic core 14A is disposed at the center portion (core portion) of the spiral of the flat coil 14, and the magnetic core 14A is formed thicker than the thickness of the flat coil 14.
- the flat coil 14 is embedded in the third resin layer 15, and the upper surface of the magnetic core 14 ⁇ / b> A is exposed from the upper surface of the second resin layer 13.
- the L value of the flat coil 14 can be increased.
- the first resin layer 12 is formed as a non-magnetic composite resin layer in which a non-magnetic filler such as alumina or silica and a thermosetting resin are mixed at a predetermined ratio.
- a non-magnetic filler such as alumina or silica
- a thermosetting resin a non-magnetic filler such as alumina or silica
- thermosetting resin a thermosetting resin alone.
- terminal electrodes 16A and 16B on which chip-type passive electronic components 11A and chip-type active electronic components 11B are mounted are disposed on the lower surface of the first resin layer 12, respectively. . These terminal electrodes 16A and 16B are exposed from the lower surface of the first resin layer 12, and are used when the module 10 with a flat coil is connected to a substrate such as a mother board.
- the second resin layer 13 is formed as a composite resin layer exhibiting magnetism in which a magnetic filler such as ferrite and a thermosetting resin are mixed at a predetermined ratio.
- the second resin layer 13 is preferably formed of the same or the same kind of resin as the thermosetting resin of the first resin layer 12, and in this way, the second resin layer 13 and the first resin layer 13 are formed. The bonding force with the resin layer 12 is improved, and peeling between the two can be prevented. This also applies to the third resin layer 15 described later. Further, since the second resin layer 13 is formed of the composite resin layer, the heat generated from the chip-type electronic component 11 can be efficiently radiated in the same manner as the first resin layer 12.
- the flat coil 14 is preferably formed of a metal plate such as copper or a metal wire. Since the flat coil 14 is formed of such a metal plate or metal wire, the resistance can be reduced and a large current can flow.
- the magnetic core 14A disposed in the core portion of the flat coil 14 is preferably formed by a magnetic block such as ferrite. By forming the magnetic core 14 with a magnetic block, the magnetic permeability and saturation magnetic flux density are increased, and the L value and Q value of the flat coil 14 can be increased.
- the third resin layer 15 is formed of a non-magnetic composite resin in which a nonmagnetic filler and a thermosetting resin are mixed at a predetermined ratio in the same manner as the first resin layer 12.
- the third resin layer 15 covers the entire flat coil 14, but only the upper surface of the magnetic core 14 ⁇ / b> A is exposed on the upper surface of the third resin layer 15 as described above.
- the third resin layer 15 is also preferably formed of the same or the same type of thermosetting resin as the first and second resin layers 12 and 13. Note that the third resin layer 15 may be a resin layer formed of a thermosetting resin alone.
- via hole conductors 17A and 17B are formed in the third resin layer 15 at portions corresponding to the inner end portion and the outer end portion of the flat coil 14, respectively. . These via-hole conductors 17A and 17B electrically connect the flat coil 14 and the lead wiring 18 formed on the upper surface of the third resin layer 15.
- the flat coil-equipped module 10 configured in this way is configured as a non-contact power transmission module, for example.
- the non-contact power transmission module includes a power transmission coil constituted by the flat coil 14 and the magnetic core 14A, and a non-contact power transmission circuit or a non-contact power reception circuit including a plurality of chip-type electronic components 11. A predetermined power is transmitted or received via the flat coil 14.
- the flat coil-equipped module 10 of the present embodiment can be applied as a non-contact power transmission device 100 shown in FIG.
- the non-contact power transmission apparatus 100 generates an AC voltage based on an AC / DC converter 101 that converts an AC voltage into a DC voltage, and a DC current output from the AC / DC converter 101.
- Power transmission circuit 102 a primary coil 103 in which an AC voltage flows from the power transmission circuit 102 to generate a magnetic flux, a secondary coil 104 in which an AC voltage is induced based on the magnetic flux from the primary coil 103, and a secondary coil 104
- a power receiving circuit 105 that rectifies an AC voltage and outputs a DC voltage, and is configured to charge the secondary battery 106 with the DC voltage output from the power receiving circuit 105.
- the chip-type electronic component 11 incorporated in the first resin layer 12 is configured as a non-contact power transmission circuit or a non-contact power reception circuit
- the flat coil 14 is a primary coil. 103 or the secondary coil 104.
- the primary coil 103 and the secondary coil 104 face each other with a predetermined distance, whereby predetermined AC power can be transmitted from the primary coil 103 to the secondary coil 104 without contact.
- the 1st resin layer 12 which incorporates the chip type electronic component 11 shown to (a) of FIG. 2 is produced.
- a stainless steel plate is prepared, and a metal foil such as a copper foil is attached to the upper surface of the plate, and terminal electrodes 16A and 16B having a predetermined pattern are formed by a photolithography technique.
- a semi-cured composite resin sheet containing a nonmagnetic filler is thermocompression bonded to the chip electronic component 11. As shown in FIG. 2A, an uncured first resin layer 112 containing the chip-type electronic component 11 is obtained.
- an uncured composite resin sheet containing a magnetic filler is thermocompression bonded to the upper surface of the uncured first resin layer 112, and the uncured first resin
- An uncured second resin layer 113 is stacked on the layer 112.
- the flat coil 14 formed by, for example, bending a metal plate is disposed at a predetermined position of the uncured second resin layer 113, and the flat coil After the magnetic core 14 ⁇ / b> A thicker than 14 is disposed in the core portion of the flat coil 14, the uncured first and second resin layers 112 and 113 are thermally cured.
- the flat coil 14 is thicker than, for example, a coil in which a metal foil is patterned by an etching technique or a coil formed by printing a conductive paste, so that the resistance can be reduced and a large current can be handled.
- a semi-cured composite resin sheet containing a nonmagnetic filler is thermocompression bonded to the upper surface of the second resin layer 13.
- the magnetic core 14A serves as a spacer
- the flat coil 14 can be embedded in the composite resin sheet
- the upper surface of the magnetic core 14A can be embedded in the composite resin.
- An uncured third resin layer 115 that is exposed from the upper surface of the sheet and has a uniform thickness can be obtained.
- a via hole H is formed by irradiating a portion corresponding to the above with laser.
- the upper surface of the third resin layer 15 is plated to embed a conductive metal in the via hole H to form via-hole conductors 17A and 17B, and a conductive metal film is formed on the upper surface of the third resin layer 15 Further, as shown in FIG. 2 (f), the lead wiring 18 is formed by patterning the conductive metal film using a photolithography technique. Thereby, the flat coil 14 is connected to the routing wiring 18 via the via-hole conductors 17A and 17B, and the flat coil-equipped module 10 of this embodiment can be obtained.
- the second resin layer 13 containing the magnetic filler is formed on the first resin layer 12 containing the chip-type electronic component 11. And a step of providing a flat coil 14 on the second resin layer 12 and a step of providing a non-magnetic third resin layer 15 so as to cover the flat coil 14.
- the module 10 with a flat plate coil of this embodiment can be manufactured easily and at low cost without providing a through hole, a countersink part, etc. for providing a coil in the substrate.
- the flat core coil 14 is provided on the second resin layer 13 and the magnetic core 14A is provided at the core portion of the flat coil 14, the flat coil 14 and the magnetic core 14A are provided.
- the process can be simplified and the coil mounting work efficiency can be increased.
- the flat coil 14 and the magnetic core 14A are provided on the uncured second resin layer 113, and after the uncured second resin layer 113 is cured, the flat coil 14 and the magnetic core 14A are covered.
- the third resin layer 115 in an uncured state is provided on the surface, and the surface of the third resin layer is flattened using the magnetic core 14A as a spacer. Therefore, a unique spacer is used to flatten the third resin layer 15.
- the third resin layer 15 adjusted to a constant film thickness can be obtained without using it.
- the flat coil-equipped module 10 manufactured by the manufacturing method of the present embodiment includes a first resin layer 12 containing the chip-type electronic component 11 and a magnetic filler disposed on the first resin layer 12. Since it has the 2nd resin layer 13 to contain, the flat coil 14 arrange
- the third resin layer 15 is a non-magnetic resin layer, and the flat coil 14 functions as an antenna pattern, so that it can be used for electromagnetic wave transmission / reception.
- the flat coil 14 is a power transmission coil 103 or 104 of the non-contact power transmission apparatus 100 and is configured as a non-contact power transmission module including the power transmission coil 103 and the power transmission circuit 102 or the power reception circuit 105. Therefore, power can be transmitted in a short time, and for example, the secondary battery 106 can be charged in a short time.
- the second resin layer 13 exhibiting magnetism is interposed between the first resin layer 12 containing the chip-type electronic component 11 and the third resin layer 15 in which the flat coil 14 is embedded, the chip The magnetic influence of the flat coil 14 on the mold electronic component 11 can be prevented or suppressed.
- the core part 14A has the magnetic core 14A in the core portion of the flat coil 14, the module 10 with the flat coil having an excellent L value and Q value can be obtained.
- a module with a flat coil according to the present embodiment is a module with a flat coil according to the first embodiment, except that the via hole conductors 17A and 17B are different, as shown in FIG. 10 is the same. Therefore, in this embodiment, the same or corresponding parts as those in the first embodiment will be described with the same reference numerals.
- the via-hole conductors 17A and 17B penetrate the first and second resin layers 12 and 13 and are connected to the lower surfaces of the inner end portion and the outer end portion of the flat coil 14. Accordingly, the routing wiring for connecting the via-hole conductors 17A and 17B is formed on the side of a substrate (not shown) such as a motherboard on which the module 10A with a flat plate coil is mounted. This routing wiring may be provided on the lower surface of the first resin layer 12. When the routing wiring is provided on the lower surface of the first resin layer 12, it can be provided together with the terminal electrodes 16A and 16B on which the chip-type electronic component 11 is mounted.
- the steps until the via hole conductors 17A and 17B are provided are performed in the same manner as in the case of manufacturing the flat coiled module 10 of the first embodiment.
- the via-hole conductors 17A and 17B are provided, the first, second, and third resin layers 12, 13, and 15 are thermally cured, and then portions corresponding to the inner end portion and the outer end portion of the flat coil 14 are provided.
- These via holes are filled with a conductive paste and cured to form via hole conductors 17A and 17B.
- a flat coil-equipped module 10B according to the present embodiment is provided with a shield layer 19 at the interface between the first and second resin layers 12 and 13 as shown in FIG. Except that the second via-hole conductor 17C is electrically connected as a grounding conductor, and is basically the same as the module 10A with a flat coil (see FIG. 3) of the second embodiment. .
- the same or corresponding parts as those in the second embodiment will be described with the same reference numerals.
- a plating film or a metal foil is provided as the shield layer 19
- a plating film or a metal foil is provided on the entire upper surface of the second resin layer 13, and then patterned by a photolithography technique so that the via-hole conductors 17 ⁇ / b> A and 17 ⁇ / b> B pass through. Holes can be provided.
- a conductive film is provided as the shield layer 19
- a hole through which the via-hole conductors 17 ⁇ / b> A and 17 ⁇ / b> B pass can be provided by printing a conductive paste in a predetermined pattern.
- the second via-hole conductor 17C can be provided in the same manner as the via-hole conductors 17A and 17B.
- the shield layer 19 is provided at the interface between the first resin layer 12 and the second resin layer 13 by a plating film, a metal foil, or a conductive film, the shield layer 19 and the chip-type electronic component 11 in the first resin layer 12 Electromagnetic interference with the flat coil 14 in the third resin layer 15 can be prevented.
- the shield layer 19 can prevent electromagnetic interference between the chip-type electronic component 11 and the flat coil 14, and the flat coil of the second embodiment. The same effect as the attached module 10A can be expected.
- the first resin layer 12 containing the chip-type electronic component 11 is a flat plate according to the second embodiment.
- This is basically the same as the module 10A with a flat coil (see FIG. 3) of the second embodiment, except that the module 10B with a coil is arranged with its vertical direction reversed.
- the same or corresponding parts as those in the second embodiment will be described with the same reference numerals.
- one terminal electrode 16A on which the chip capacitor 11A is mounted extends in the direction of the IC chip 11B.
- a second via-hole conductor 17D reaching the lower surface of the first resin layer 12 is connected to the extended portion of the terminal electrode 16A.
- a connection terminal 16 ⁇ / b> C formed in a predetermined pattern is formed on the lower surface of the first resin layer 12.
- the flat coil-equipped module 10C according to the present embodiment is mounted on a base number such as a mother board via a connection terminal 16C. In other respects, the flat coil-equipped module of the present embodiment is configured similarly to the second embodiment.
- the terminal electrodes 16A and 16B of the chip-type electronic component 11 are arranged inside the module 10C with a flat coil, the connection is made without being restricted by the arrangement position of the chip-type electronic component 11.
- the same effects as those of the second embodiment can be expected.
- a flat coil-equipped module 10D according to the present embodiment is a flat coil-equipped module according to the second embodiment except that the via hole conductors 17A and 17B are different from each other as shown in FIG. 10A (see FIG. 3), and supported by a core substrate (for example, a ceramic multilayer substrate) 20. Therefore, in the present embodiment, the same or corresponding parts as those in the second embodiment will be described with the same reference numerals.
- the ceramic multilayer substrate 20 incorporates various kinds of wiring, capacitors, inductors and other passive electronic components (not shown). Then, by mounting the module 10D with a flat coil on the ceramic multilayer substrate 20, a highly functional and small module M can be obtained. Further, the connection terminals 20A are formed in a predetermined pattern on the lower surface of the ceramic multilayer substrate 20, and the module M is mounted on a substrate such as a mother board via the connection terminals 20A.
- the module 10D with a flat coil according to the present embodiment includes the via-hole conductors 17A and 17B that are upside down with respect to those of the second embodiment as described above, and therefore the manufacturing method thereof is the same as that of the second embodiment. This is slightly different from the manufacturing method of the flat coil-equipped module 10A.
- the module M when the module M is manufactured, first, the first resin layer 12 and the second resin layer 13 containing the chip-type electronic component 11 are sequentially provided on the upper surface of the ceramic multilayer substrate 20 in the manner shown in FIG. . Thereafter, via holes are formed by irradiating the portions corresponding to the inner and outer ends of the flat coil 14 on the upper surface of the second resin layer 13 with laser. Since the laser is irradiated from the upper surface side of the second resin layer 13 in this way, the vertical direction of the via hole is opposite to the case of the second embodiment. These via holes are filled with a conductive paste and cured to form via-hole conductors 17A and 17B, and then a flat coil 14 and a magnetic core 14A are provided on the upper surface of the second resin layer 13. At this time, the inner end and the outer end of the flat coil 14 are aligned with the respective via-hole conductors 17A and 17B. Subsequently, the module M can be obtained by providing the third resin layer 15 covering the flat coil 14.
- the module M is configured by mounting the module 10D with a flat coil on the ceramic multilayer substrate 20 containing passive electronic components such as a capacitor and an inductor. can do.
- a flat coil-equipped module 10E according to the present embodiment includes, as shown in FIG. 7, for example, a wiring 18 for connecting the flat coil 14 to a substrate such as a mother board.
- the module with the flat coil according to the second embodiment is basically provided except that the second via-hole conductors 17E and 17F are provided to be suspended from the routing wiring 18 toward the board such as the mother board. 10A (see FIG. 3). Therefore, in the present embodiment, the same or corresponding parts as those in the second embodiment will be described with the same reference numerals.
- the inner and outer ends of the flat coil 14 are routed wirings formed in a predetermined pattern on the upper surface of the third resin layer 15 via the via-hole conductors 17A and 17B, respectively, as in the case shown in FIG. 18 is connected.
- the routing wiring 18 is connected to third via-hole conductors 17E and 17F penetrating the third, second, and first resin layers 15, 13, and 12 outside the flat coil 14.
- the second via-hole conductor 17C is grounded to the shield layer 19 formed at the interface between the first resin layer 12 and the second resin layer 13 in the same manner as the module 10B with a flat coil according to the third embodiment. It is formed as a conductor.
- via holes penetrating the first, second, and third resin layers 12, 13, and 15 can be provided.
- the laser output is increased to reduce the diameter.
- a via hole can be formed in a short time.
- the output of the laser must be reduced. In addition to an increase in diameter, it takes a lot of time to form a via hole.
- the flat coil-equipped module 10F according to the present embodiment is, for example, as shown in FIG. 8A, except that the second resin layer 13 is formed of a resin layer containing a magnetic filler. Is configured with substantially the same structure as the flat coil-equipped module 10A of the second embodiment. Therefore, in the present embodiment, the same or corresponding parts as those in the second embodiment will be described with the same reference numerals.
- the flat coil 14 is configured as an antenna, whereas in the present embodiment, the flat coil 14 is configured as an inductor.
- the flat coil-equipped module 10F of the present embodiment is configured as a DC-DC converter as shown in FIG.
- 8B includes an input-side capacitor 201, an output-side capacitor 202, an inductor 203, and an IC chip 204 that is a control circuit.
- the DC input voltage VIN is input and switched by a field effect transistor (hereinafter referred to as “switching element”) in the IC chip 204.
- switching element a field effect transistor
- the output voltage V OUT Is stepped down by the input voltage VIN a stable output voltage VOUT can be output by adjusting the ratio of T ON and T OFF .
- the input side capacitor 201 is used for stabilizing the input voltage VIN during transition and preventing voltage spikes.
- a filter circuit for outputting a DC voltage is provided on the output side. This filter circuit is configured by combining an inductor 203 that stores and discharges current energy and an output-side capacitor 202 that stores and discharges voltage energy.
- the chip-type electronic component 11 incorporated in the first resin layer 12 of the flat coil-equipped module 10F of the present embodiment is configured as an input-side capacitor 201, an output-side capacitor 202, and an IC chip 204.
- the flat coil 14 is configured as the inductor 203.
- the flat coil 14 is embedded in the second and third resin layers 13 and 15 exhibiting magnetism vertically, the magnetic flux generated by the flat coil 14 is confined, and the L value and Q as an inductor are confined. The value can be increased.
- the DC-DC converter 200 having a high conversion efficiency can be configured. .
- the flat coil 14 used for each said embodiment is formed as a mosquito coil incense-like form as shown, for example in FIG.
- the present invention can be suitably used for electronic devices having a built-in coil such as a non-contact power transmission device or a DC-DC converter.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
11 チップ型電子部品
12 第1の樹脂層
13 第2の樹脂層
14 平板状コイル
14A 磁心
15 第3の樹脂層
本実施形態の平板状コイル付きモジュール10は、例えば図1の(a)に示すように、チップ型電子部品11を内蔵する第1の樹脂層12と、第1の樹脂層12上に配置された磁性フィラーを含有する第2の樹脂層13と、第2の樹脂層13上に配置された渦巻状の平板状コイル14と、平板状コイル14を覆う非磁性を呈する第3の樹脂層15と、を備え、例えば同図の(b)に示すように非接触式電力伝送モジュール100として構成されている。
本実施形態の平板状コイル付きモジュール10Aは、例えば図3に示すように、ビアホール導体17A、17Bの形態を異にする以外は、第1の実施形態の平板状コイル付きモジュール10と同様に構成されている。そこで、本実施形態において第1の実施形態と同一または相当部分には同一符号を付して説明する。
本実施形態の平板状コイル付きモジュール10Bは、例えば図4に示すように、第1、第2の樹脂層12、13の界面にシールド層19が設けられ、このシールド層19に第2のビアホール導体17Cが接地用導体として電気的に接続されていること以外は、基本的に第2の実施形態の平板状コイル付きモジュール10A(図3参照)と同様に構成されている。尚、本実施形態においても第2の実施形態と同一または相当部分には同一符号を付して説明する。
本実施形態の平板状コイル付きモジュール10Cの場合には、例えば図5に示すように、チップ型電子部品11を内蔵する第1の樹脂層12が第2の実施形態の平板状コイル付きモジュール10Bとは上下方向が逆向きにして配置されていること以外は、基本的に第2の実施形態の平板状コイル付きモジュール10A(図3参照)と同様に構成されている。尚、本実施形態においても第2の実施形態と同一または相当部分には同一符号を付して説明する。
本実施形態の平板状コイル付きモジュール10Dは、例えば図6に示すように、ビアホール導体17A、17Bの形態を異にする以外は、第2の実施形態の平板状コイル付きモジュール10A(図3参照)と同様に構成され、コア基板(例えば、セラミック多層基板)20によって支持されている。従って、本実施形態においても第2の実施形態と同一または相当部分には同一符号を付して説明する。
本実施形態の平板状コイル付きモジュール10Eは、例えば図7に示すように、平板状コイル14をマザーボード等の基板へ接続するための引き回し配線18を第3の樹脂層15の上面に設け、この引き回し配線18からマザーボード等の基板に向けて第2のビアホール導体17E、17Fを垂下させて設けていること以外は、基本的には第2の実施形態の平板状コイル付きモジュール10A(図3参照)と同様に構成されている。従って、本実施形態においても第2の実施形態と同一または相当部分には同一符号を付して説明する。
本実施形態の平板状コイル付きモジュール10Fは、例えば図8の(a)に示すように、第2の樹脂層13が磁性フィラーを含有する樹脂層によって形成されていること以外は、第2の実施形態の平板状コイル付きモジュール10Aと実質的に同一の構造をもって構成されている。従って、本実施形態においても第2の実施形態と同一または相当部分には同一符号を付して説明する。
Claims (11)
- チップ型電子部品を内蔵する第1の樹脂層上に、磁性または非磁性を呈する第2の樹脂層を設ける工程と、
上記第2の樹脂層上に平板状コイルを設ける工程と、
上記平板状コイルを覆うように磁性または非磁性を呈する第3の樹脂層を設ける工程と、を有する
ことを特徴とする平板状コイル付きモジュールの製造方法。 - 上記第2の樹脂層上に平板状コイルを設けると同時に、その芯部分に磁心を設けることを特徴とする請求項1に記載の平板状コイル付きモジュールの製造方法。
- 未硬化状態の上記第2の樹脂層上に上記平板状コイル及び上記磁心を設け、上記第2の樹脂層を硬化させた後、上記平板状コイル及び上記磁心を覆うように未硬化状態の上記第3の樹脂層を設け、上記磁心をスペーサとして上記第3の樹脂層の表面を平坦化することを特徴とする請求項2に記載の平板状コイル付きモジュールの製造方法。
- チップ型電子部品を内蔵する第1の樹脂層と、上記第1の樹脂層上に配置された磁性または非磁性を呈する第2の樹脂層と、上記第2の樹脂層上に配置された平板状コイルと、上記平板状コイルを覆う磁性または非磁性を呈する第3の樹脂層と、を備えたことを特徴とする平板状コイル付きモジュール。
- 上記平板状コイルの芯部分に磁心を有することを特徴とする請求項4に記載の平板状コイル付きモジュール。
- 上記磁心の表面が上記第3の樹脂層の表面に露出していることを特徴とする請求項5に記載の平板状コイル付きモジュール。
- 上記第2の樹脂層は磁性フィラーを含有する磁性樹脂層であることを特徴とする請求項4~請求項6のいずれか1項に記載の平板状コイル付きモジュール。
- 上記第3の樹脂層は非磁性樹脂層であり、上記平板状コイルはアンテナとして機能することを特徴とする請求項4~請求項7のいずれか1項に記載の平板状コイル付きモジュール。
- 上記平板状コイルは非接触式電力伝送装置の電力伝送用コイルとして構成され、且つ、上記電力伝送用コイルと送電回路または上記電力伝送用コイルと受電回路を含む非接触式電力伝送モジュールとして構成されていることを特徴とする請求項8に記載の平板状コイル付きモジュール。
- 上記第3の樹脂層は磁性樹脂層として形成され、且つ、上記平板状コイルはインダクタとして機能することを特徴とする請求項4~請求項7のいずれか1項に記載の平板状コイル付きモジュール。
- 上記平板状コイルは、インダクタ及びコンデンサを含むフィルタ回路のインダクタとして用いられることを特徴とする請求項10に記載の平板状コイル付きモジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010549346A JP5549600B2 (ja) | 2009-02-07 | 2009-10-15 | 平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール |
CN200980156108.7A CN102308349B (zh) | 2009-02-07 | 2009-10-15 | 带平板状线圈的模块的制造方法及带平板状线圈的模块 |
US13/197,810 US8294546B2 (en) | 2009-02-07 | 2011-08-04 | Method for manufacturing module with planar coil, and module with planar coil |
US13/613,023 US8791785B2 (en) | 2009-02-07 | 2012-09-13 | Method for manufacturing module with planar coil, and module with planar coil |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009026824 | 2009-02-07 | ||
JP2009-026824 | 2009-02-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/197,810 Continuation US8294546B2 (en) | 2009-02-07 | 2011-08-04 | Method for manufacturing module with planar coil, and module with planar coil |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010089921A1 true WO2010089921A1 (ja) | 2010-08-12 |
Family
ID=42541835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/067843 WO2010089921A1 (ja) | 2009-02-07 | 2009-10-15 | 平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール |
Country Status (4)
Country | Link |
---|---|
US (2) | US8294546B2 (ja) |
JP (1) | JP5549600B2 (ja) |
CN (1) | CN102308349B (ja) |
WO (1) | WO2010089921A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013251455A (ja) * | 2012-06-01 | 2013-12-12 | Ibiden Co Ltd | 電磁コイル |
JP5576542B1 (ja) * | 2013-08-09 | 2014-08-20 | 太陽誘電株式会社 | 回路モジュール及び回路モジュールの製造方法 |
JP5622906B1 (ja) * | 2013-08-09 | 2014-11-12 | 太陽誘電株式会社 | 回路モジュールの製造方法 |
WO2015005160A1 (ja) * | 2013-07-11 | 2015-01-15 | 株式会社村田製作所 | 電子部品、通信モジュール及び電子機器 |
WO2015151331A1 (ja) * | 2014-03-31 | 2015-10-08 | 東洋ゴム工業株式会社 | 密閉型二次電池用変形検知センサ |
KR20220152131A (ko) * | 2021-05-07 | 2022-11-15 | 스태츠 칩팩 피티이. 엘티디. | 레이저-기반 재배선 및 멀티-스택 패키지 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101133397B1 (ko) * | 2010-04-05 | 2012-04-09 | 삼성전기주식회사 | 평면형 트랜스포머 및 이의 제조 방법 |
JP2013229851A (ja) * | 2012-03-30 | 2013-11-07 | Tdk Corp | 高周波伝送線路、アンテナ及び電子回路基板 |
KR20140008483A (ko) * | 2012-07-10 | 2014-01-21 | 주식회사 만도 | 모터 구조체 |
RU2560918C2 (ru) * | 2012-12-03 | 2015-08-20 | Корпорация "САМСУНГ ЭЛЕКТРОНИКС Ко., Лтд." | Способ увеличения добротности плоской спиральной катушки индуктивности |
JP6377336B2 (ja) * | 2013-03-06 | 2018-08-22 | 株式会社東芝 | インダクタ及びその製造方法 |
US9177925B2 (en) | 2013-04-18 | 2015-11-03 | Fairfchild Semiconductor Corporation | Apparatus related to an improved package including a semiconductor die |
CN104112727B (zh) * | 2013-04-18 | 2018-06-05 | 费查尔德半导体有限公司 | 与包括半导体管芯的改进封装件相关的方法和装置 |
DE102015000317A1 (de) | 2014-01-10 | 2015-07-16 | Fairchild Semiconductor Corporation | Isolierung zwischen Halbleiterkomponenten |
KR102222484B1 (ko) * | 2014-05-27 | 2021-03-04 | 에스케이하이닉스 주식회사 | 윙부를 가지는 플렉시블 적층 패키지 |
KR20160037652A (ko) * | 2014-09-29 | 2016-04-06 | 엘지이노텍 주식회사 | 무선 전력 송신 장치 및 무선 전력 수신 장치 |
JP6353763B2 (ja) * | 2014-09-30 | 2018-07-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP6280014B2 (ja) * | 2014-09-30 | 2018-02-14 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP6354683B2 (ja) * | 2015-07-03 | 2018-07-11 | 株式会社村田製作所 | コイル部品 |
US10720788B2 (en) | 2015-10-09 | 2020-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wireless charging devices having wireless charging coils and methods of manufacture thereof |
JP6872313B2 (ja) * | 2015-10-13 | 2021-05-19 | リンテック株式会社 | 半導体装置および複合シート |
JP6451654B2 (ja) * | 2016-01-07 | 2019-01-16 | 株式会社村田製作所 | コイル部品 |
JP6485374B2 (ja) * | 2016-01-21 | 2019-03-20 | 株式会社村田製作所 | コイル部品 |
JP6369493B2 (ja) * | 2016-03-30 | 2018-08-08 | Tdk株式会社 | 給電コイルユニット、ワイヤレス給電装置およびワイヤレス電力伝送装置 |
JP5988004B1 (ja) * | 2016-04-12 | 2016-09-07 | Tdk株式会社 | 電子回路パッケージ |
US10097030B2 (en) | 2016-04-29 | 2018-10-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Packaged semiconductor devices with wireless charging means |
EP3493227B1 (en) * | 2016-09-02 | 2023-01-25 | Murata Manufacturing Co., Ltd. | Inductor component and power supply module |
US10438889B2 (en) * | 2016-12-23 | 2019-10-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
US10074622B2 (en) | 2017-02-06 | 2018-09-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
WO2018235539A1 (ja) * | 2017-06-19 | 2018-12-27 | 株式会社村田製作所 | コイル部品 |
WO2018235550A1 (ja) * | 2017-06-19 | 2018-12-27 | 株式会社村田製作所 | コイル部品 |
US11335767B2 (en) * | 2017-07-31 | 2022-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of fabricating the same |
US10790244B2 (en) | 2017-09-29 | 2020-09-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method |
US10930604B2 (en) | 2018-03-29 | 2021-02-23 | Semiconductor Components Industries, Llc | Ultra-thin multichip power devices |
CN108766707B (zh) * | 2018-05-29 | 2021-03-23 | 维沃移动通信有限公司 | 一种无线充电接收端 |
CN108900216B (zh) * | 2018-06-01 | 2021-01-29 | 华为技术有限公司 | 一种无线传输模组及制造方法 |
JP7318446B2 (ja) * | 2019-09-20 | 2023-08-01 | Tdk株式会社 | コイルユニット、ワイヤレス送電装置、ワイヤレス受電装置、及びワイヤレス電力伝送システム |
CN211929254U (zh) * | 2020-05-07 | 2020-11-13 | 台达电子企业管理(上海)有限公司 | 绕组组件及磁性组件 |
CN113628851B (zh) | 2020-05-07 | 2024-01-23 | 台达电子企业管理(上海)有限公司 | 绕组组件及磁性元件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059878A (ja) * | 2005-07-27 | 2007-03-08 | Seiko Epson Corp | 半導体装置、及び発振器 |
JP2008034632A (ja) * | 2006-07-28 | 2008-02-14 | Seiko Epson Corp | インターポーザーとその製造方法及び半導体モジュール並びにその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283029A (ja) | 1994-04-07 | 1995-10-27 | Ibiden Co Ltd | インダクタ内蔵プリント配線基板 |
US6441715B1 (en) * | 1999-02-17 | 2002-08-27 | Texas Instruments Incorporated | Method of fabricating a miniaturized integrated circuit inductor and transformer fabrication |
US6815220B2 (en) * | 1999-11-23 | 2004-11-09 | Intel Corporation | Magnetic layer processing |
CN1141738C (zh) | 2001-04-11 | 2004-03-10 | 华邦电子股份有限公司 | 芯片上电感组件的制造方法 |
JP3736387B2 (ja) | 2001-05-25 | 2006-01-18 | 株式会社村田製作所 | 複合電子部品及びその製造方法 |
US6774470B2 (en) | 2001-12-28 | 2004-08-10 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and method of fabricating the same |
JP2006229190A (ja) * | 2005-01-24 | 2006-08-31 | Sanyo Electric Co Ltd | 半導体装置 |
JP2007053311A (ja) * | 2005-08-19 | 2007-03-01 | Shinko Electric Ind Co Ltd | コイル構造体及びその製造方法ならびに半導体パッケージ |
US7751205B2 (en) | 2006-07-10 | 2010-07-06 | Ibiden Co., Ltd. | Package board integrated with power supply |
JP5115691B2 (ja) | 2006-12-28 | 2013-01-09 | Tdk株式会社 | コイル装置、及びコイル装置の製造方法 |
US8058960B2 (en) * | 2007-03-27 | 2011-11-15 | Alpha And Omega Semiconductor Incorporated | Chip scale power converter package having an inductor substrate |
-
2009
- 2009-10-15 CN CN200980156108.7A patent/CN102308349B/zh active Active
- 2009-10-15 JP JP2010549346A patent/JP5549600B2/ja active Active
- 2009-10-15 WO PCT/JP2009/067843 patent/WO2010089921A1/ja active Application Filing
-
2011
- 2011-08-04 US US13/197,810 patent/US8294546B2/en active Active
-
2012
- 2012-09-13 US US13/613,023 patent/US8791785B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059878A (ja) * | 2005-07-27 | 2007-03-08 | Seiko Epson Corp | 半導体装置、及び発振器 |
JP2008034632A (ja) * | 2006-07-28 | 2008-02-14 | Seiko Epson Corp | インターポーザーとその製造方法及び半導体モジュール並びにその製造方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013251455A (ja) * | 2012-06-01 | 2013-12-12 | Ibiden Co Ltd | 電磁コイル |
WO2015005160A1 (ja) * | 2013-07-11 | 2015-01-15 | 株式会社村田製作所 | 電子部品、通信モジュール及び電子機器 |
JP5576542B1 (ja) * | 2013-08-09 | 2014-08-20 | 太陽誘電株式会社 | 回路モジュール及び回路モジュールの製造方法 |
JP5622906B1 (ja) * | 2013-08-09 | 2014-11-12 | 太陽誘電株式会社 | 回路モジュールの製造方法 |
US9101044B2 (en) | 2013-08-09 | 2015-08-04 | Taiyo Yuden Co., Ltd | Circuit module and method of producing the same |
WO2015151331A1 (ja) * | 2014-03-31 | 2015-10-08 | 東洋ゴム工業株式会社 | 密閉型二次電池用変形検知センサ |
JPWO2015151331A1 (ja) * | 2014-03-31 | 2017-04-13 | 東洋ゴム工業株式会社 | 密閉型二次電池用変形検知センサ |
US10312555B2 (en) | 2014-03-31 | 2019-06-04 | Toyo Tire Corporation | Deformation detecting sensor for sealed secondary battery |
KR20220152131A (ko) * | 2021-05-07 | 2022-11-15 | 스태츠 칩팩 피티이. 엘티디. | 레이저-기반 재배선 및 멀티-스택 패키지 |
US11862572B2 (en) | 2021-05-07 | 2024-01-02 | STATS ChipPAC Pte. Ltd. | Laser-based redistribution and multi-stacked packages |
KR102676909B1 (ko) * | 2021-05-07 | 2024-06-19 | 스태츠 칩팩 피티이. 엘티디. | 레이저-기반 재배선 및 멀티-스택 패키지 |
Also Published As
Publication number | Publication date |
---|---|
JP5549600B2 (ja) | 2014-07-16 |
US20130002042A1 (en) | 2013-01-03 |
US8294546B2 (en) | 2012-10-23 |
US8791785B2 (en) | 2014-07-29 |
CN102308349A (zh) | 2012-01-04 |
CN102308349B (zh) | 2016-06-29 |
US20110285215A1 (en) | 2011-11-24 |
JPWO2010089921A1 (ja) | 2012-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5549600B2 (ja) | 平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール | |
TWI344805B (en) | Inductor and electric power supply using it | |
US10389241B2 (en) | Power supply converter and method for manufacturing the same | |
US10141107B2 (en) | Miniature planar transformer | |
JP5570196B2 (ja) | インダクタ内蔵部品 | |
US10117334B2 (en) | Magnetic assembly | |
JP2008171965A (ja) | 超小型電力変換装置 | |
US9620448B1 (en) | Power module | |
US10405429B2 (en) | Transformer integrated type printed circuit board | |
JP2009246159A (ja) | 多出力磁気誘導素子およびそれを備えた多出力超小型電力変換装置 | |
JPWO2013137044A1 (ja) | インダクタ内蔵基板製造方法及びインダクタ内蔵基板及びそれを用いた電源モジュール | |
US20030048168A1 (en) | High-current inductor and method for making same | |
JP2004072815A (ja) | 超小型電力変換装置およびその製造方法 | |
JP2004319875A (ja) | インダクタ内蔵型多層基板およびその製造方法 | |
US10660193B2 (en) | Multilayer substrate | |
JP6344540B2 (ja) | 電力変換モジュール | |
US11657951B2 (en) | Integrated embedded transformer module | |
US11051406B2 (en) | Component carrier with integrated inductor and manufacturing method | |
JP5890475B2 (ja) | インダクタ内蔵部品 | |
JP2018006437A (ja) | 複合デバイス | |
JP2005080382A (ja) | パワー変換モジュールデバイスおよびそれを用いた電源装置 | |
CN217114072U (zh) | 电路结构 | |
US20230395305A1 (en) | Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same | |
JP2010147171A (ja) | 電子回路装置 | |
WO2010053038A1 (ja) | 実装型電子回路モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980156108.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09839695 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2010549346 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09839695 Country of ref document: EP Kind code of ref document: A1 |