KR101752375B1 - 온다이 커패시터를 위한 언더 범프 금속화 - Google Patents

온다이 커패시터를 위한 언더 범프 금속화 Download PDF

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KR101752375B1
KR101752375B1 KR1020117004569A KR20117004569A KR101752375B1 KR 101752375 B1 KR101752375 B1 KR 101752375B1 KR 1020117004569 A KR1020117004569 A KR 1020117004569A KR 20117004569 A KR20117004569 A KR 20117004569A KR 101752375 B1 KR101752375 B1 KR 101752375B1
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conductor
forming
under bump
bump metallization
layer
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KR20110042336A (ko
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네일 맥렐란
페이 구오
다니엘 충
테렌스 츙
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에이티아이 테크놀로지스 유엘씨
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KR1020117004569A 2008-07-25 2009-07-23 온다이 커패시터를 위한 언더 범프 금속화 Active KR101752375B1 (ko)

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US12/180,042 US8314474B2 (en) 2008-07-25 2008-07-25 Under bump metallization for on-die capacitor
US12/180,042 2008-07-25
PCT/CA2009/001039 WO2010009553A1 (en) 2008-07-25 2009-07-23 Under bump metallization for on-die capacitor

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