JP5595396B2 - オンダイ・キャパシタ用アンダーバンプメタル - Google Patents

オンダイ・キャパシタ用アンダーバンプメタル Download PDF

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JP5595396B2
JP5595396B2 JP2011518995A JP2011518995A JP5595396B2 JP 5595396 B2 JP5595396 B2 JP 5595396B2 JP 2011518995 A JP2011518995 A JP 2011518995A JP 2011518995 A JP2011518995 A JP 2011518995A JP 5595396 B2 JP5595396 B2 JP 5595396B2
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conductor
layer
bump metal
under bump
conductor structure
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JP2011529263A5 (enExample
JP2011529263A (ja
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マクレラン，ニール
グオ，フェイ
チュン，ダニエル
チェウン，テレンス
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エイティーアイ・テクノロジーズ・ユーエルシー
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US12/180,042 US8314474B2 (en) 2008-07-25 2008-07-25 Under bump metallization for on-die capacitor
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