CN104766838A - 封装堆叠结构及其制法 - Google Patents

封装堆叠结构及其制法 Download PDF

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Publication number
CN104766838A
CN104766838A CN201410011287.8A CN201410011287A CN104766838A CN 104766838 A CN104766838 A CN 104766838A CN 201410011287 A CN201410011287 A CN 201410011287A CN 104766838 A CN104766838 A CN 104766838A
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China
Prior art keywords
packaging
base plate
support portion
encapsulation stacking
making
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CN201410011287.8A
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English (en)
Inventor
童世豪
蓝章益
王隆源
江政嘉
黄淑惠
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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Publication of CN104766838A publication Critical patent/CN104766838A/zh
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Abstract

一种封装堆叠结构及其制法，该制法先提供一设有第一电子元件与多个第一支撑部的第一封装基板，再形成封装胶体于该第一封装基板上，以包覆该第一电子元件与该些第一支撑部，再形成多个开孔于该封装胶体上，以令各该第一支撑部的部分表面对应外露于各该开孔，之后将第二封装基板藉由多个第二支撑部结合至各该第一支撑部，使该第二封装基板叠设于该第一封装基板上，且该第二支撑部位于该开孔中，藉此，该封装胶体能有效隔离各该第一支撑部或各该第二支撑部，以避免桥接现象。

Description

封装堆叠结构及其制法
技术领域
本发明涉及一种封装堆叠结构，尤指一种得提升产品可靠度的封装堆叠结构及其制法。
背景技术
随着半导体封装技术的演进，半导体装置(Semiconductor device)已开发出不同的封装型态，而为提升电性功能及节省封装空间，遂堆加多个封装结构以形成封装堆叠结构(Package on Package，POP)，此种封装方式能发挥系统封装(SiP)异质整合特性，可将不同功用的电子元件，例如：记忆体、中央处理器、绘图处理器、影像应用处理器等，藉由堆叠设计达到系统的整合，适合应用于轻薄型各种电子产品。
图1为现有封装堆叠结构1的剖面示意图。如图1所示，该封装堆叠结构1包含第一封装基板11及第二封装基板12。该第一封装基板11具有相对的第一及第二表面11a,11b，且于该第一表面11a上设有电性连接该第一封装基板11的第一半导体元件10，而该第二表面11b上具有植球垫112以供结合焊球17。该第二封装基板12具有相对的第三及第四表面12a,12b，且该第三表面12a设有多个电性接触垫120，又该第三及第四表面12a,12b上具有防焊层123，并形成有多个开孔以外露该些电性接触垫120。
于制作时，先将该第一半导体元件10以覆晶方式电性连接该第一封装基板11，且藉由底胶16充填于该第一半导体元件10与第一封装基板11之间，并于该第一封装基板11的第一表面11a上形成多个焊锡柱13，再使该第二封装基板12的第四表面12b藉由该焊锡柱13叠设且电性连接于该第一封装基板11上。接着，形成封装胶体14于该第一封装基板11的第一表面11a与该第二封装基板12的第四表面12b之间，以包覆该第一半导体元件10。之后，以覆晶方式设置多个第二半导体元件15于该第三表面12a上以电性连接该些电性接触垫120，且藉由底胶16充填于该第二半导体元件15与第二封装基板12之间。
然而，现有封装堆叠结构1的制法中，由于第一封装基板11与第二封装基板12间以焊锡柱13作为支撑与电性连接的元件，而随着电子产品的接点（即I/O）数量愈来愈多，在封装件的尺寸大小不变的情况下，各该焊锡柱13间的间距需缩小，致使容易发生桥接（bridge）的现象，因而造成产品良率过低及可靠度不佳等问题。
因此，如何克服现有技术中的问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述现有技术的缺失，本发明提供一种封装堆叠结构及其制法，以避免桥接现象。
本发明的封装堆叠结构，包括：第一封装基板；至少一第一电子元件，其设于该第一封装基板上且电性连接该第一封装基板；多个第一支撑部，其设于该第一封装基板上；封装胶体，其设于该第一封装基板上，以包覆该第一电子元件与该些第一支撑部，且该封装胶体具有多个开孔，以令各该第一支撑部的部分表面对应外露于各该开孔；以及第二封装基板，其设有多个第二支撑部，且藉由该第二支撑部结合该第一支撑部，使该第二封装基板叠设于该第一封装基板上，而该第二支撑部位于该开孔中。
本发明还提供一种封装堆叠结构的制法，包括：提供一设有至少一第一电子元件与多个第一支撑部的第一封装基板，且该第一电子元件电性连接该第一封装基板；形成封装胶体于该第一封装基板上，以包覆该第一电子元件与该些第一支撑部；形成多个开孔于该封装胶体上，以令各该第一支撑部的部分表面对应外露于各该开孔；以及一设有多个第二支撑部的第二封装基板藉由该第二支撑部结合至该第一支撑部上，使该第二封装基板叠设于该第一封装基板上，且该第二支撑部位于该开孔中。
前述的封装堆叠结构及其制法中，该第一支撑部电性连接该第二封装基板，且该第一支撑部为金属柱，其材质例如为铜或焊锡材料。
前述的封装堆叠结构及其制法中，该第一支撑部的构成为铜块外表覆盖焊锡材料。例如，该铜块为球体或柱体。
前述的封装堆叠结构及其制法中，该第二支撑部电性连接该第二封装基板，且该第二支撑部为金属柱，其材质例如为铜或焊锡材料。
前述的封装堆叠结构及其制法中，该封装胶体接触靠合该第二封装基板；或者，该封装胶体与该第二封装基板之间具有间距。
另外，前述的封装堆叠结构及其制法中，还包括设置至少一第二电子元件于该第二封装基板上。
由上可知，本发明封装堆叠结构及其制法，藉由先形成封装胶体以包覆该该些第一支撑部，再形成该些开孔以对应外露各该第一支撑部的部分表面，因而于之后该第二支撑部结合该第一支撑部时，各该第一支撑部之间或各该第二支撑部之间具有封装胶体作隔离，所以相较于现有技术，该些第一支撑部之间或各该第二支撑部之间不会发生桥接的问题，因而能有效提高产品良率及可靠度。
附图说明
图1为现有封装堆叠结构的剖视示意图；
图2A至图2D为本发明封装堆叠结构的制法的剖视示意图；其中，图2B’为图2B的另一实施例，图2D’及图2D”分别为图2D的其它不同实施例；以及
图3A至图3B为本发明封装堆叠结构的制法的另一实施例的剖视示意图。
主要组件符号说明
1、2、2’、2”、3     封装堆叠结构
10                    第一半导体元件
11、21                第一封装基板
11a、21a              第一表面
11b、21b              第二表面
112、212              植球垫
12、22                第二封装基板
12a、22a              第三表面
12b、22b              第四表面
120、220              电性接触垫
123                   防焊层
13                    焊锡柱
14、24                封装胶体
15                    第二半导体元件
16、26                底胶
17、27                焊球
20                    第一电子元件
200、250              焊锡凸块
210                   焊垫
211                   第一外接垫
213、223              绝缘保护层
2130、2230            开口
221                   第二外接垫
23                    支撑件
231、231’            第一支撑部
231a                  顶面
231b                  侧面
2310                  铜块
2311                  焊锡材料
232                   第二支撑部
240、240’            开孔
25、25’              第二电子元件
250’                 焊线
26’                  封装材
t                     间距。
具体实施方式
以下藉由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用于配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用于限定本发明可实施的限定条件，所以不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“顶”、“第一”、“第二”及“一”等用语，也仅为便于叙述的明了，而非用于限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2D为本发明封装堆叠结构2的制法的剖视示意图。
如图2A所示，提供一具有相对的第一表面21a及第二表面21b的第一封装基板21。
所述的第一封装基板21，其第一表面21a上具有多个焊垫210与第一外接垫211，且其第二表面21b上具有多个植球垫212，又该第一及第二表面21a,21b上具有例如防焊层的绝缘保护层213，并形成有多个开口2130以外露该些焊垫210、第一外接垫211及植球垫212。
此外，于该第一外接垫211上形成第一支撑部231，且该第一支撑部231电性连接该第一封装基板21的第一外接垫211，其中，该第一支撑部231为金属体，其材质可为铜或焊锡材料等，但不以此为限。
又，于该焊垫210上藉由焊锡凸块200设置第一电子元件20，即该第一电子元件20以覆晶方式电性连接该第一封装基板21。
另外，该第一电子元件20为主动元件或被动元件，可使用多个第一电子元件20，且可选自主动元件、被动元件或其组合，该主动元件例如：晶片，而该被动元件例如：电阻、电容及电感。
如图2B所示，形成封装胶体24于该第一封装基板21的第一表面21a上，以包覆该第一电子元件20与该些第一支撑部231。接着，形成多个开孔240于该封装胶体24上，以令各该第一支撑部231的顶面231a对应外露于各该开孔240。
于本实施例中，以激光方式形成该些开孔240，但并不限于此方式。
此外，于另一实施例中，如图2B’所示，也可令各该第一支撑部231的顶面231a与侧面231b对应外露于各该开孔240’。
又，该封装胶体24填入该第一电子元件20与该第一封装基板21的第一表面21a之间；也可填充底胶于该第一电子元件20与该第一封装基板21的第一表面21a之间。
如图2C所示，接续图2B的制程，提供一具有相对的第三表面22a及第四表面22b的第二封装基板22。
所述的第二封装基板22，其第三表面22a上具有多个电性接触垫220，且其第四表面22b上具有多个第二外接垫221，又该第三及第四表面22a,22b上具有例如防焊层的绝缘保护层223，并形成有多个开口2230以外露该些电性接触垫220及第二外接垫221。
此外，于该第二外接垫221上形成第二支撑部232，且该第二支撑部232电性连接该第二封装基板22的第二外接垫221，其中，该第二支撑部232为金属体，其材质例如预焊锡（pre-solder）、铜或焊锡材料。
又，设置第二电子元件25于该第二封装基板22的第三表面22a上，且该第二电子元件25以覆晶方式（如藉由焊锡凸块250）电性连接该电性接触垫220，并形成底胶26于该第二电子元件25与该第二封装基板22的第三表面22a之间。
另外，该第二电子元件25为主动元件或被动元件；或者，可使用多个个第二电子元件25，且可选自主动元件、被动元件或其组合，该主动元件例如：晶片，而该被动元件例如：电阻、电容及电感。
如图2D所示，该第二封装基板22以其第四表面22b藉由该第二支撑部232结合至该第一支撑部231的顶面231a上，使该第二封装基板22叠设于该第一封装基板21上，且各该第二支撑部232对应位于各该开孔240中。
于本实施例中，该第一与第二支撑部231,232作为支撑件23，且该封装胶体24接触靠合该第二封装基板22的第四表面22b的绝缘保护层223。
此外，可结合多个焊球27于该第一封装基板21的第二表面21b上的植球垫212。
又，若接续图2B’所示的制程，将制得如图2D’所示的封装堆叠结构2’。或者，如图2D”所示，该封装胶体24也可与该第二封装基板22之间具有间距t。
另外，也可如图3A及图3B所示，该第二封装基板22上进行打线式封装，即藉由多个焊线250’电性连接该第二电子元件25’与该电性接触垫220，并以封装材26’包覆该第二电子元件25’与焊线250’。
于本实施例中中，该第二电子元件25’为堆叠多个晶片的结构，但不以此为限，且该第一支撑部231’的构成为球体或柱体的铜块2310外表覆盖焊锡材料2311，如焊锡材料2311包覆核心铜球的全部表面，且令各该第一支撑部231的部分侧面231b对应外露于各该开孔240’。
本发明的制法藉由先形成封装胶体24以包覆该该些第一支撑部231,231’，再形成该些开孔240,240’以对应外露各该第一支撑部231,231’的顶面231a，因而于之后该第二支撑部232结合该第一支撑部231,231’时，该封装胶体24能隔离各该支撑件23，即增加隔离各该支撑件23的效果，所以相较于现有技术，各该支撑件23之间不会发生桥接现象，因而能有效提高产品良率及可靠度。
本发明还提供一种封装堆叠结构2,2’,2”,3，包括：第一封装基板21、第一电子元件20、多个第一支撑部231,231’、第二封装基板22、封装胶体24以及第二电子元件25,25’。
所述的第一封装基板21具有相对的第一表面21a及第二表面21b。
所述的第一电子元件20设于该第一封装基板21的第一表面21a上，且电性连接该第一封装基板21。
所述的第一支撑部231,231’设于该第一封装基板21的第一表面21a上，且电性连接该第一封装基板21。于本实施例中，该第一支撑部231,231’为金属柱，其材质例如铜或焊锡材料。
所述的封装胶体24设于该第一封装基板21的第一表面21a上，并包覆该第一电子元件20与该些第一支撑部231,231’，且该封装胶体24具有多个开孔240,240’，以令各该第一支撑部231的部分表面对应外露于各该开孔240,240’。
所述的第二封装基板22设有多个第二支撑部232，且该第二支撑部232电性连接该第二封装基板22，并藉由该第二支撑部232结合该第一支撑部231,231’，使该第二封装基板22叠设于该第一封装基板21上，而该第二支撑部232位于该开孔240中。于本实施例中，该第二支撑部232为金属柱，其材质例如铜或焊锡材料。
所述的第二电子元件25,25’设于该第二封装基板22上，且电性连接该第二封装基板22。
另外，于本实施例中，该封装胶体24接触靠合该第二封装基板22。于其它实施例中，该封装胶体24也可与该第二封装基板22之间具有间距t。
综上所述，本发明封装堆叠结构及其制法，藉由先形成封装胶体以包覆该该些第一支撑部，再形成该些开孔以对应外露各该第一支撑部，之后当该第二支撑部结合该第一支撑部时，该封装胶体能有效隔离各该支撑件，藉以避免桥接现象，因而能有效提高产品良率及可靠度。
上述实施例仅用于例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (24)

1.一种封装堆叠结构，包括：
第一封装基板；
至少一第一电子元件，其设于该第一封装基板上且电性连接该第一封装基板；
多个第一支撑部，其设于该第一封装基板上；
封装胶体，其设于该第一封装基板上，以包覆该第一电子元件与该些第一支撑部，且该封装胶体具有多个开孔，以令各该第一支撑部的部分表面对应外露于各该开孔；以及
第二封装基板，其设有多个第二支撑部，且藉由该第二支撑部结合该第一支撑部，使该第二封装基板叠设于该第一封装基板上，而该第二支撑部位于该开孔中。
2.如权利要求1所述的封装堆叠结构，其特征在于，该第一支撑部电性连接该第一封装基板。
3.如权利要求1所述的封装堆叠结构，其特征在于，该第一支撑部为金属柱。
4.如权利要求1所述的封装堆叠结构，其特征在于，该第一支撑部的材质为铜或焊锡材料。
5.如权利要求1所述的封装堆叠结构，其特征在于，该第一支撑部的构成为铜块外表覆盖焊锡材料。
6.如权利要求5所述的封装堆叠结构，其特征在于，该铜块为球体或柱体。
7.如权利要求1所述的封装堆叠结构，其特征在于，该第二支撑部电性连接该第二封装基板。
8.如权利要求1所述的封装堆叠结构，其特征在于，该第二支撑部为金属柱。
9.如权利要求1所述的封装堆叠结构，其特征在于，该第二支撑部的材质为铜或焊锡材料。
10.如权利要求1所述的封装堆叠结构，其特征在于，该封装胶体接触靠合该第二封装基板。
11.如权利要求1所述的封装堆叠结构，其特征在于，该封装胶体与该第二封装基板之间具有间距。
12.如权利要求1所述的封装堆叠结构，其特征在于，该结构还包括设于该第二封装基板上的至少一第二电子元件。
13.一种封装堆叠结构的制法，包括：
提供一设有至少一第一电子元件与多个第一支撑部的第一封装基板，且该第一电子元件电性连接该第一封装基板；
形成封装胶体于该第一封装基板上，以包覆该第一电子元件与该些第一支撑部；
形成多个开孔于该封装胶体上，以令各该第一支撑部的部分表面对应外露于各该开孔；以及
一设有多个第二支撑部的第二封装基板藉由该第二支撑部结合至该第一支撑部上，使该第二封装基板叠设于该第一封装基板上，且该第二支撑部位于该开孔中。
14.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第一支撑部电性连接该第一封装基板。
15.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第一支撑部为金属柱。
16.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第一支撑部的材质为铜或焊锡材料。
17.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第一支撑部的构成为铜块外表覆盖焊锡材料。
18.如权利要求17所述的封装堆叠结构的制法，其特征在于，该铜块为球体或柱体。
19.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第二支撑部电性连接该第二封装基板。
20.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第二支撑部为金属柱。
21.如权利要求13所述的封装堆叠结构的制法，其特征在于，该第二支撑部的材质为铜或焊锡材料。
22.如权利要求13所述的封装堆叠结构的制法，其特征在于，该封装胶体接触靠合该第二封装基板。
23.如权利要求13所述的封装堆叠结构的制法，其特征在于，该封装胶体与该第二封装基板之间具有间距。
24.如权利要求13所述的封装堆叠结构的制法，其特征在于，该制法还包括设置至少一第二电子元件于该第二封装基板上。
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