JP2010272562A - 電子部品の実装構造 - Google Patents
電子部品の実装構造 Download PDFInfo
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- JP2010272562A JP2010272562A JP2009120634A JP2009120634A JP2010272562A JP 2010272562 A JP2010272562 A JP 2010272562A JP 2009120634 A JP2009120634 A JP 2009120634A JP 2009120634 A JP2009120634 A JP 2009120634A JP 2010272562 A JP2010272562 A JP 2010272562A
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- electronic component
- substrate
- pads
- chip
- mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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Abstract
【解決手段】電子部品(チップ)の実装構造50は、端子11を有するチップ10と、このチップの端子11と電気的に接続されるべき端子22Pを有する配線基板20と、チップ10と配線基板20の間に配置され、絶縁性基材31にその厚さ方向に貫通する多数の線状導体32が設けられた構造を有する介在基板30とを備える。チップ10の端子11と配線基板20の端子22Pとは、介在基板30に設けた複数の線状導体を介して電気的に接続されている。
【選択図】図1
Description
実装されるチップ10は、例えば、以下のようにして作製することができる。
配線基板20の本体を構成する樹脂基板21の形態としては、上述したように少なくとも最表層に配線層が形成された基板であって、各配線層が基板内部を通して電気的に接続されている形態のものであれば十分である。
図5は、上述した実施形態(図1〜図4)で使用されるインターポーザ用基板30の第1の変形例に係るインターポーザ用基板30aの構成(断面図)を示したものである。
11…(突起状の)端子、
20…配線基板(パッケージ)、
21…樹脂基板(配線基板本体)、
22P…パッド(端子)、
24,25…ソルダレジスト層(保護膜/絶縁層)、
30,30a,30b,30c…インターポーザ用基板(介在基板)、
31…絶縁性基材、
32…ビア(線状導体)、
33,34…パッド、
33G,34G…グランド層、
35(35A,36A)…アンダーフィル樹脂(接着剤層)、
37,38…低融点金属の導体層、
50…電子部品の実装構造(半導体装置)。
Claims (10)
- 端子を有する電子部品と、
前記電子部品の端子と電気的に接続されるべき端子を有する配線基板と、
前記電子部品と前記配線基板の間に配置され、絶縁性基材にその厚さ方向に貫通する多数の線状導体が設けられた構造を有する介在基板とを備え、
前記電子部品の端子と前記配線基板の端子とが、前記介在基板における複数の線状導体を介して電気的に接続されていることを特徴とする電子部品の実装構造。 - 前記絶縁性基材の両面に、前記複数の線状導体を共有する形でそれぞれ導体層からなる1対のパッドが形成され、一方のパッドに前記電子部品の端子が接続され、他方のパッドに前記配線基板の端子が接続されていることを特徴とする請求項1に記載の電子部品の実装構造。
- 前記1対のパッドは、当該パッドの周囲に所定の間隔を空けて、グランドに繋がる導体層によって囲まれていることを特徴とする請求項2に記載の電子部品の実装構造。
- 前記介在基板の熱膨張係数は、前記電子部品の熱膨張係数よりも大きく、かつ、前記配線基板の熱膨張係数よりも小さく選定されていることを特徴とする請求項1に記載の電子部品の実装構造。
- 前記電子部品と前記介在基板の間の空隙、及び、前記配線基板と前記介在基板の間の空隙に、体積収縮性を有する樹脂が充填されていることを特徴とする請求項4に記載の電子部品の実装構造。
- 前記樹脂に無機フィラーが混合されていることを特徴とする請求項5に記載の電子部品の実装構造。
- 前記1対のパッドの表面に、それぞれ低融点金属の導体層が形成されていることを特徴とする請求項2に記載の電子部品の実装構造。
- 前記1対のパッドが前記絶縁性基材の両面に複数対形成される場合に、各面側の複数のパッドは、隣り合うパッド間の距離が前記線状導体の直径よりも大きくなるように配置されていることを特徴とする請求項2に記載の電子部品の実装構造。
- 前記絶縁性基材における多数の線状導体は、隣り合う線状導体間の距離が線状導体の直径よりも小さくなるように配置されていることを特徴とする請求項1に記載の電子部品の実装構造。
- 前記絶縁性基材における多数の線状導体は、いずれのパッドにも接続されていない孤立した線状導体を含むことを特徴とする請求項2に記載の電子部品の実装構造。
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