JP2007507906A5 - - Google Patents

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Publication number
JP2007507906A5
JP2007507906A5 JP2006534210A JP2006534210A JP2007507906A5 JP 2007507906 A5 JP2007507906 A5 JP 2007507906A5 JP 2006534210 A JP2006534210 A JP 2006534210A JP 2006534210 A JP2006534210 A JP 2006534210A JP 2007507906 A5 JP2007507906 A5 JP 2007507906A5
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JP
Japan
Prior art keywords
pressure
seal
processing
processing space
cavity
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JP2006534210A
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Japanese (ja)
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JP4787761B2 (ja
JP2007507906A (ja
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Priority claimed from US10/680,783 external-priority patent/US7225820B2/en
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Publication of JP2007507906A publication Critical patent/JP2007507906A/ja
Publication of JP2007507906A5 publication Critical patent/JP2007507906A5/ja
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Publication of JP4787761B2 publication Critical patent/JP4787761B2/ja
Anticipated expiration legal-status Critical
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JP2006534210A 2003-10-06 2004-10-01 半導体ウエハーの高圧処理チャンバー Expired - Fee Related JP4787761B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/680,783 2003-10-06
US10/680,783 US7225820B2 (en) 2003-02-10 2003-10-06 High-pressure processing chamber for a semiconductor wafer
PCT/US2004/032571 WO2005038868A2 (en) 2003-10-06 2004-10-01 High-pressure processing chamber for a semiconductor wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011014290A Division JP2011097101A (ja) 2003-10-06 2011-01-26 半導体ウエハーの高圧処理チャンバー

Publications (3)

Publication Number Publication Date
JP2007507906A JP2007507906A (ja) 2007-03-29
JP2007507906A5 true JP2007507906A5 (cg-RX-API-DMAC7.html) 2007-09-20
JP4787761B2 JP4787761B2 (ja) 2011-10-05

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Family Applications (2)

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JP2006534210A Expired - Fee Related JP4787761B2 (ja) 2003-10-06 2004-10-01 半導体ウエハーの高圧処理チャンバー
JP2011014290A Pending JP2011097101A (ja) 2003-10-06 2011-01-26 半導体ウエハーの高圧処理チャンバー

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011014290A Pending JP2011097101A (ja) 2003-10-06 2011-01-26 半導体ウエハーの高圧処理チャンバー

Country Status (4)

Country Link
US (1) US7225820B2 (cg-RX-API-DMAC7.html)
JP (2) JP4787761B2 (cg-RX-API-DMAC7.html)
TW (1) TWI284919B (cg-RX-API-DMAC7.html)
WO (1) WO2005038868A2 (cg-RX-API-DMAC7.html)

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KR102267171B1 (ko) * 2018-04-30 2021-06-22 세메스 주식회사 기판 처리 장치 및 방법
KR102616514B1 (ko) * 2019-03-14 2023-12-26 주식회사 케이씨텍 기판 처리 장치 및 기판 처리 방법
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KR102616133B1 (ko) * 2020-07-08 2023-12-22 세메스 주식회사 기판 처리 장치 및 방법
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