JP2007329447A - 基板搬送装置及び縦型熱処理装置 - Google Patents
基板搬送装置及び縦型熱処理装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
【解決手段】大口径の基板wの上方に移動される支持部17と、該支持部17に設けられ基板wの周縁部を上掴みで支持する上掴み機構28とを有する基板搬送装置18において、上記支持部17に、基板wの上面中央部に気体を吹付けると共に吸引して基板wの中央部を撓まないように空気層50を介して非接触で吸引保持する非接触吸引保持部30を設けている。
【選択図】図3
Description
w 半導体ウエハ(基板)
3 熱処理炉
6 蓋体
9 ボート(保持具)
13 リング状支持板
14 フープ(収納容器)
17 フォーク(支持部)
18 ウエハ搬送装置(基板搬送装置)
28 上掴み機構
30 非接触吸引保持部
36 回点用吹出しノズル
37 位置合せ部
39 変位センサ
40 姿勢制御機構
44 基準プレート
50 空気層(気体層)
70 支持部
80 下掴み機構
U 非接触吸引保持ユニット
Claims (12)
- 大口径の基板の上方に移動される支持部と、該支持部に設けられ基板の周縁部を上掴みで支持する上掴み機構とを有する基板搬送装置において、上記支持部に、基板の上面中央部に気体を吹付けると共に吸引して基板の中央部を撓まないように気体層を介して非接触で吸引保持する非接触吸引保持部を設けたことを特徴とする基板搬送装置。
- 大口径の基板の下方に移動される支持部と、該支持部に設けられ基板の周縁部を下掴みで支持する下掴み機構とを有する基板搬送装置において、上記支持部に、基板の下面中央部に気体を吹付けると共に吸引して基板の中央部を撓まないように気体層を介して非接触で吸引保持する非接触吸引保持部を設けたことを特徴とする基板搬送装置。
- 上記非接触吸引保持部は、中央に配置された吸引孔と該吸引孔の周囲に配置された複数の吹出し孔とからなる非接触吸引保持ユニットを1つ又は複数備えていることを特徴とする請求項1又は2記載の基板搬送装置。
- 上記支持部は、基板の上面の接線方向に気体を吹付けて基板を回転させる回転用吹出しノズルと、基板に設けられた位置合せマークを検出して基板の位置合せを行う位置合せ部とを有していることを特徴とする請求項1又は2記載の基板搬送装置。
- 上記支持部は、基板の傾きを光学的に検出するための変位センサと、該変位センサからの検出信号に基いて支持部を基板と平行にする姿勢制御機構とを有していることを特徴とする請求項1又は2記載の基板搬送装置。
- 上記支持部の下方に設けられた基準プレートと、該基準プレートに設けられ基板の傾きを光学的に検出する変位センサと、該変位センサからの検出信号に基いて支持部を基板と平行にする姿勢制御機構とを有していることを特徴とする請求項1又は2記載の基板搬送装置。
- 下部に炉口を有する熱処理炉と、その炉口を密閉する蓋体と、該蓋体上に設けられ多数枚の大口径の基板をリング状支持板を介して上下方向に所定間隔で保持する保持具と、前記蓋体を昇降させて保持具を熱処理炉に搬入搬出する昇降機構と、複数枚の基板を所定間隔で収納する収納容器と前記保持具との間で、基板を略水平状態で上掴みに支持して搬送する基板搬送装置とを備え、上記搬送装置は、上記基板の上方に移動される支持部と、基板の周縁部を上掴みで支持する上掴み機構とを有し、上記支持部に、基板の上面中央部に気体を吹付けると共に吸引して基板の中央部を撓まないように気体層を介して非接触で吸引保持する非接触吸引保持部を設けたことを特徴とする縦型熱処理装置。
- 下部に炉口を有する熱処理炉と、その炉口を密閉する蓋体と、該蓋体上に設けられ多数枚の大口径の基板をリング状支持板を介して上下方向に所定間隔で保持する保持具と、前記蓋体を昇降させて保持具を熱処理炉に搬入搬出する昇降機構と、複数枚の基板を所定間隔で収納する収納容器と前記保持具との間で、基板を略水平状態で下掴みに支持して搬送する基板搬送装置とを備え、上記基板搬送装置は、上記基板の下方に移動される支持部と、基板の周縁部を下掴みで支持する下掴み機構とを有し、上記支持部に、基板の下面中央部に気体を吹付けると共に吸引して基板の中央部を撓まないように気体層を介して非接触で吸引保持する非接触吸引保持部を設けたことを特徴とする縦型熱処理装置。
- 上記非接触吸引保持部は、中央に配置された吸引孔と該吸引孔の周囲に配置された複数の吹出し孔とからなる非接触吸引保持ユニットを1つ又は複数備えていることを特徴とする請求項7又は8記載の縦型熱処理装置。
- 上記支持部は、基板の上面の接線方向に気体を吹付けて基板を回転させる回転用吹出しノズルと、基板に設けられた位置合せマークを検出して基板の位置合せを行う位置合せ部とを有していることを特徴とする請求項7又は8記載の縦型熱処理装置。
- 上記支持部は、基板の傾きを光学的に検出するための変位センサと、該変位センサからの検出信号に基いて支持部を基板と平行にする姿勢制御機構とを有していることを特徴とする請求項7又は8記載の縦型熱処理装置。
- 上記支持部の下方に設けられた基準プレートと、該基準プレートに設けられ、基板の傾きを光学的に検出する変位センサと、該変位センサからの検出信号に基いて支持部を基板と平行にするための姿勢制御機構とを有していることを特徴とする請求項7又は8記載の縦型熱処理装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007007220A JP4642787B2 (ja) | 2006-05-09 | 2007-01-16 | 基板搬送装置及び縦型熱処理装置 |
PCT/JP2007/058702 WO2007129558A1 (ja) | 2006-05-09 | 2007-04-23 | 基板搬送装置及び縦型熱処理装置 |
KR1020087027305A KR101347992B1 (ko) | 2006-05-09 | 2007-04-23 | 기판 반송 장치 및 종형 열처리 장치 |
US12/225,920 US8167521B2 (en) | 2006-05-09 | 2007-04-23 | Substrate transfer apparatus and vertical heat processing apparatus |
CN2007800168867A CN101443899B (zh) | 2006-05-09 | 2007-04-23 | 基板搬送装置和立式热处理装置 |
EP07742137A EP2053648A4 (en) | 2006-05-09 | 2007-04-23 | SUBSTRATE TRANSPORT DEVICE AND VERTICAL THERMAL TREATMENT EQUIPMENT |
TW096115590A TWI478265B (zh) | 2006-05-09 | 2007-05-02 | Substrate handling device and longitudinal heat treatment device |
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JP2006130492 | 2006-05-09 | ||
JP2007007220A JP4642787B2 (ja) | 2006-05-09 | 2007-01-16 | 基板搬送装置及び縦型熱処理装置 |
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JP2007329447A true JP2007329447A (ja) | 2007-12-20 |
JP4642787B2 JP4642787B2 (ja) | 2011-03-02 |
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JP2007007220A Expired - Fee Related JP4642787B2 (ja) | 2006-05-09 | 2007-01-16 | 基板搬送装置及び縦型熱処理装置 |
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US (1) | US8167521B2 (ja) |
EP (1) | EP2053648A4 (ja) |
JP (1) | JP4642787B2 (ja) |
KR (1) | KR101347992B1 (ja) |
CN (1) | CN101443899B (ja) |
TW (1) | TWI478265B (ja) |
WO (1) | WO2007129558A1 (ja) |
Cited By (11)
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WO2010092930A1 (ja) * | 2009-02-13 | 2010-08-19 | 株式会社国際電気セミコンダクターサービス | 基板処理装置、処理管、基板保持具、基板保持具の固定具、基板処理方法、及び基板製造方法 |
JP2011238870A (ja) * | 2010-05-13 | 2011-11-24 | Lintec Corp | 支持装置および支持方法ならびに搬送装置および搬送方法 |
JP2012212746A (ja) * | 2011-03-31 | 2012-11-01 | Tokyo Electron Ltd | 基板搬送装置及び基板搬送方法 |
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JP2015504236A (ja) * | 2011-12-29 | 2015-02-05 | 株式会社ニコン | 搬入方法、露光方法、搬送システム及び露光装置、並びにデバイス製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
JP4642787B2 (ja) | 2011-03-02 |
CN101443899B (zh) | 2010-08-18 |
EP2053648A1 (en) | 2009-04-29 |
TW200814225A (en) | 2008-03-16 |
US20090175705A1 (en) | 2009-07-09 |
WO2007129558A1 (ja) | 2007-11-15 |
EP2053648A4 (en) | 2009-11-25 |
CN101443899A (zh) | 2009-05-27 |
KR101347992B1 (ko) | 2014-01-07 |
TWI478265B (zh) | 2015-03-21 |
US8167521B2 (en) | 2012-05-01 |
KR20090037386A (ko) | 2009-04-15 |
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